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9 meetings

Title:
Fundamentals of Power Integrity with Current Design & Analysis Practices
Date:
November 14th
6:30 PM (2.5 hours)
Location:
Shiley Hall
Portland
Abstract:

Although signal and power integrity practices are as old as digital design itself, unlike SI, PI still remains as an elusive concept in the eye of industrial circles. One reason is the cause-and-effect relation in PI analysis hasn't been firmly established in practical applications. For example, with SI analysis, a logic failure can be traced to a noise threshold violation. PI analysis results, on the other hand, hardly point out to smoking guns with the same rigor. Starting from a qualitative and descriptive introduction of power noise fundamentals, the current analysis techniques will be reviewed with application to data communication systems which include ATCA line cards, server and storage blades. The limitations of industrially accepted analysis techniques will be discussed with practical work-arounds. Some recent developments concerning the multipin optimization of decoupling capacitors will be discussed on sample cases. 

Title:
IEEE OREGON EXCOM MEETING
Date:
November 13th
6:00 PM (2.5 hours)
Location:
Maseeh College of Engineering and Computer Science
Portland
Abstract:
Meeting number: 591 576 152Meeting password: OregonMeeting Link: https://ieeemeetings.webex.com/ieeemeetings/j.php?MTID=m88d660fbe15407139daed7eccc665bba Audio connection: +1 210 606 9466 US Toll
Title:
IEEE SSCS Oregon Chapter Meeting - November 2018
Date:
November 6th
6:30 PM (2 hours)
Location:
Ronler Acres 1 (RA1)
Hillsboro
Abstract:

November Technical seminar and chapter meeting of the Oregon Solid-State Circuits Society Chapter.  Food and drinks will be provided.

TECHNICAL SEMINAR: Towards Large-Scale Quantum computers: Cryogenic CMOS for Scalable Quantum Computation

SEMINAR ABSTRACT: Quantum computers hold the promise to ignite the next technological revolution as the classical computer did for last century’s digital revolution, by efficiently solving problems that are intractable by today’s computers. By enabling the efficient simulation of quantum systems, quantum computing will allow both the optimization of existing industrial processes and the synthesis of new drugs and materials, thus representing an unprecedented game changer with the potential to disrupt entire industries, create new ones and radically change our lives.

Quantum computers rely on processing the information stored in quantum bits (qubits) that must be typically cooled well below 1 K for proper operation. Performing operations on qubits requires a classical (i.e. non-quantum) electronic interface, which is currently implemented at room temperature for the few qubits available today. However, future quantum processors will comprise thousands or even millions of qubits. To avoid the unpractical requirement of thousands of cables from the cryogenic refrigerator to the room-temperature electronics, the electronic interface must operate at cryogen¬ic temperatures as close as possible to the qubits.

This talk will address the challenges of building such a scalable cryogenic electronic interface, focusing on the use of standard CMOS technology. A brief introduction to quantum computers and their operation will be given, followed by a description of their hardware implementation and their requirements in terms of electronic control and read-out. To enable the reliable design of cryogenic circuits, two main ingredients are required: on one hand, compact models for the cryogenic CMOS devices and, on the other hand, a comprehensive methodology to co-design the electronics and the quantum processor. After addressing those aspects, we will demonstrate the design and the functionality of complex analog and digital systems operating at 4 K, thus showing that cryogenic CMOS is a viable technology to enable large-scale quantum computing.

SPEAKER: Prof. Fabio Sebastiano, TU Delft

SPEAKER BIOGRAPHY: Fabio Sebastiano holds degrees from University of Pisa, Italy (B.Sc., 2003, cum laude; M.Sc., 2005, cum laude), from Sant'Anna School of Advanced Studies, Pisa, Italy (M.Sc., 2006, cum laude) and from Delft University of Technology, The Netherlands (Ph.D., 2011).

From 2006 to 2013, he was with NXP Semiconductors Research in Eindhoven, The Netherlands, where he conducted research on fully integrated CMOS frequency references, nanometer-CMOS temperature sensors and area-efficient interfaces for magnetic sensors. In 2013, he joined Delft University of Technology, where he is currently an Assistant Professor. His main research interests are cryogenic electronic interfaces, quantum computation, fully-integrated frequency references and electronic interfaces for smart sensors.

Dr. Sebastiano holds 10 patents, and has co-authored 1 book and over 60 technical publications. He has given invited talks and courses at several international conferences including the International Solid-State Circuits Conference (ISSCC). He was co-recipient of the 2008 ISCAS Best Student Paper Award and of the 2017 DATE best IP award. Fabio is a senior member of IEEE and a Distinguished Lecturer of the IEEE Solid-State Circuit Society.

Title:
Oregon IEEE Consultants' Monthly Meeting
Date:
November 6th
6:00 PM (3 hours)
Location:
IHOP
Beaverton
Abstract:

NOVEMBER ORCNET MEETING
Chris Armstrong of Rigol Technologies is scheduled as a guest speaker.

Chris Armstrong is the Director of Product Marketing & SW Applications at Rigol Technologies North America. Chris brings more than 15 years of experience in test & measurement from sensitive measurement applications to multipurpose benchtop test to integrating complete systems that control instrumentation across a number of interfaces. Chris has obtained a Bachelor of Science in Computer Science & Engineering from the University of Toledo and an MBA from Case Western Reserve University.

 

Find me on linkedin at: https://www.linkedin.com/in/chriskarmstrong/

 

Subject:

Overview of customer benefits of real-time analysis as it pertains to spectrum monitoring and EMI.

Engineers integrating RF technologies into their embedded systems encounter new design challenges and need to understand how their system interacts with the RF environment in order to debug operational and performance issues. This requires instruments that capture, isolate, and visualize analog, digital, and RF signals together. RIGOL’s Real-Time Spectrum Analyzers are made to work with RIGOL Oscilloscopes to combine triggering and the IF signal to debug these challenging issues across domains. Join us to see how RIGOL’s solution makes multi domain debug more affordable while providing unmatched visibility of the interactions between analog, digital, and RF events.

RIGOL will bring a Real-Time Spectrum Analyzer, RF signal generator, waveform generator, and our new 7000 series Oscilloscope with integrated ASIC design for live demonstration.

 

For more information about these instruments and their applications before the meeting please check out these links:

 

https://www.rigolna.com/real-time

 

https://www.rigolna.com/DS7000

 

Regards,

Chris

 

Chris Armstrong
Director of Product Marketing & SW Applications
Rigol Technologies

8140 SW Nimbus Ave

Beaverton, OR 97008
office/fax: 877-4-RIGOL-1 x110
mobile: 440-781-4982
email: chris_armstrong@rigol.com

 


DECEMBER ORCNET MEETING
This is our annual dinner. We need to discuss when and where. What date can you come? We should aim for the first week of December.
Please email your #1 and #2 choice to me. Or bring your feedback to the meeting.
Suggested choices are:
1) The Claim Jumper
2) The Stock Pot
3) Nonah Emilia's Pizza

JANUARY ORCNET MEETING
I have Henry Benetiz scheduled as a guest speaker for the first meeting of the new year.
This year January 1st (New year's Day) is the first Tuesday of the month.
We will have this meeting on January 8th, 2019 (the 2nd week of January).

FEBRUARY
ORCNET MEETING
Meeting date Tuesday, Feb 5th, 2019.
Presentation about rockets Andrew Greenburg from PSU. (tenative)

Title:
IEEE Young Professionals Networking Social
Date:
November 2nd
6:00 PM (3.0 hours)
Location:
THIRSTY LION
Hillsboro
Abstract:

Come to join the Young Professionals and IEEE Oregon Section for a networking social! Meet and mingle with engineers from throughout the section and region! We will host appetizer and snacks. Please register asap so we can get an accurate headcount! We will be in the reserved high stool tables. 

Title:
Industry Applications - Overview of Rail Electrification: DC Traction Power Substations
Date:
October 24th
5:30 PM (3 hours)
Location:
Siemens
Tualatin
Cost:
Admission fee may apply
Abstract:

The officers of the Oregon/SW Washington Chapter invite you to join us Wednesday evening, October 24, 2018, for our Industry Application Society dinner, meeting, presentation and factory tour.  We appreciate the support of all who attend our dinners and presentations.  We will be meeting this month at the Siemens facility in Tualatin, 20393 SW Avery Ct., 97062. This location is easy to access by car from I-5 and parking is FREE.  

The cost will be for The Original Honey Baked Ham, Double Cheddar Macaroni & Cheese, Broccoli Bacon Bliss, Cheesy Potatoes Au Gratin, Kings Hawaiian Rolls. Please let us know of any dietary restrictions when you register.  There is no charge to attend the presentation only.  Our IAS Chapter always offers free dinners for local PSU, OSU, George Fox, U of P, OIT and WSUV Electrical Engineering Students who attend our meetings. This is an excellent networking opportunity for students as our meetings are attended by many professionals in consulting, industrial engineering and electrical equipment manufacturing.

Title:
OR MTT-ED Chapter Meeting
Date:
October 23rd
6:40 PM (1.8 hours)
Location:
Engineering Building
Portland
Abstract:

In days of old, microwave design was done using laborious hand calculations coupled with intuition and “cut and try” prototyping methods; the results were, and remain, impressive in their performance and their long-lasting impact on modern communication systems.

 

The 1980’s saw the advent of a number of commercial computer-based products for analyzing and simulating the behavior of electromagnetic structures, with the goal of easing and speeding the EM design task. Those first tools were able to handle structures of very limited complexity; they were difficult to use; and they were expensive. Fast-forward to 2018: Today we have a wide selection of such tools which are able to handle structures of considerably greater complexity than their earlier cousins, but so-called “big iron” EM tools can still be a) relatively difficult to use and b) typically quite expensive. (Has anyone priced an HFSS or Ansoft simulator seat recently?)

 

One technique the microwave community has used for many years is that of Mechanical Scale Modeling (“MSM”) in which electrically functional 3D-mechanical-scaled models of EM structures are used to predict the performance of the much smaller structures ultimately built into PCBs and hybrids. Typically used for relatively simple functional blocks, the technique is essentially an analog simulator that gives one the ability to quickly, accurately, and quite inexpensively develop microwave components using larger, more tractable dimensions and easier-to-measure scaled-down frequencies.

 

An interesting aspect of the MSM approach is that it can be applied to a broader set of problems than simple microwave component design. In particular, the author has found it to be a useful, inexpensive, and relatively quick-turn tool for a variety of PCB- and IC-related design tasks, including package modeling, inductor design, and even on-chip IC-level interconnect analysis. Although the author’s original work was done in the 1980’s, he has found the technique to be useful even up to the present day – particularly in budget-constrained environments.

 

This talk will focus primarily on the author’s experiences with the MSM technique as applied to IC and package modeling, including a brief review of the theoretical underpinnings of the method; its limitations; actual hardware models; and measurement techniques and test results. As time permits, we may also take a brief look at several “Lessons learned along the way” relating to the design and use of some familiar transmission line structures.

* This talk is an extension of Prof. Rick Campbell’s IEEE MTT Section
seminar of last spring (2018), in which he described techniques and
results using frequency scaling in the design of RF circuitry.

Title:
Rewiring the Northwest’s Energy Infrastructure
Date:
October 19th
3:15 PM (1.1 hour)
Location:
Engineering Building
Portland
Abstract:

IEEE TEMS Oregon section presents in collaboration with Engineering & Technology Management (ETM) Department at Maseeh College of Engineering and Computer Science   “Distinguished Speaker Series, Fall 2018”

Title:
EMC/PSE Joint Chapter: Update in Worldwide Product Safety & Regulatory Requirements
Date:
October 16th
6:30 PM (2.5 hours)
Location:
Franz Hall
Portland
Abstract:

The winds of change continue to blow in the product safety and regulatory arena.  Change is coming for equipment all the way from large industrial equipment to the smallest IoT devices.    In the industrialized world continued upgrades to the popular safety standards along with additional requirements to support a greener world are the order of the day.  In the wannabe industrialized world, the adoption of similar requirements is underway – along with the development of the needed infrastructure to support this technical work.   

9 meetings. Generated Friday, November 16 2018, at 4:11:20 PM. All times America/Los_Angeles