Summary

The objective of the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is to advance the theory and practice of electrical and electronics engineering. Of special interests are material science, chemical processes, reliability technology and mathematical modeling utilized in the design and production of discrete, hybrids, fiber optics and electronic packaging. Manufacturing technology includes systems, concepts, management and quality.

In Oregon, the focus is mainly on IC and PCB design and packaging, therefore this chapter is joint with the Circuits and Systems Society.

Contacts

  • Chair: Howard Heck, This email address is being protected from spambots. You need JavaScript enabled to view it.
  • Vice Chair (CPMT): James Morris, This email address is being protected from spambots. You need JavaScript enabled to view it.
  • Vice Chair (CAS): Malgorzata Chrzanowska-Jeske, This email address is being protected from spambots. You need JavaScript enabled to view it.
  • Secretary: Edward Perkins, This email address is being protected from spambots. You need JavaScript enabled to view it.
  • Treasurer: Wei Min Shi, This email address is being protected from spambots. You need JavaScript enabled to view it.
  • Member-at-large: Chuck Bauer, This email address is being protected from spambots. You need JavaScript enabled to view it.

Meetings

Chapter meetings are posted in the Oregon Section vTools listing.

Past Presentations

September 2103  Joe Fjelstad  Advantages of Aluminum Substrates for Electronic Assembly
November 2013  Ricky Lee  Optical, Thermal, and Electrical Performances of LED

See