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Filtered duplicate meeting "Panel Session: Emerging Challenges in the Modern Electric Grid (2020 IEEE SmartGridComm)" (1)

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33 meetings

Title:
Beers With Engineers
Date:
October 24th
7:00 PM (3 hours)
Location:
San Bernardino
Abstract:

Foothill Sections Young Professionals Affinity group is hosting a friendly networking event to give our local YP members to get to know one another and find new volunteering opportunities and leadership roles in our branch.

This event is a casual evening with beer or whatever beverages you prefer to relax and make new friends!

If you are interested in attending, help us make the evening more fun by filling out our pre-event poll: https://forms.gle/vdPakkskNXzX1ZTc6

Please join us on our discord where the event will take place: https://discord.com/invite/MurAEeV

Title:
IEEE EPS and CNSD Webinar: Applied Energy Harvesting/Power Management Techniques for Small-scale Autonomous Vehicles
Date:
October 26th
6:00 PM (1.5 hours)
Abstract:

WebEx login details will be sent to registered attendees on October 25, 2020. 

Brief description: The core research philosophy in my research is that energy and power are deemed as "hard currency" in the context of electronic systems. Therefore every joule and watt must be budgeted carefully to maximize the return over energy & power invested, particularly in mobile application, where battery charge is limited.This webinar will discuss the power management techniques of a small-scale, unmanned autonomous vehicle for environmental sustainability research, codenamed Lotus. This machine is designed by my students at SDSU and has integrated commercial-off-the-shelf (COTS) sensors, CMOS integrated circuits, energy harvesters from different energy domains, and ferroelectric capacitors. Conventional power management techniques such as adaptive power delivery, spread spectrum power control, dynamic voltage frequency scaling, power gating and new design techniques based on ferroelectric capacitors that were adopted on Lotus will be discussed in this webinar.

Biography:
Ying Khai Teh was born in Ipoh, and raised in Kampung Boyan, Taiping, in the state of Perak, Malaysia. He completed his engineering bachelor and master degrees, majoring in Electronics from MMU, Malaysia under the Telekom Malaysia Scholarship, and Canadian Commonwealth GSEP Scholarship, in 2005 and 2009, respectively. From 2010 to 2016, he was at the HKUST, Hong Kong, where he obtained his PhD degree in Electronic and Computer Engineering under the Hong Kong PhD Fellowship and conducted one year of post-doctoral research.  He joined the Department of Electrical and Computer Engineering, San Diego State University as an assistant professor in 2016. His research interests are microelectronics, with emphasis on analog, mixed signal, power management integrated circuits and semiconductor hardware security, using hardware-software co-design of CMOS technologies, energy harvesters and multiferroic material. He is an IEEE member, and received the Excellent Student Paper award at the 2009 IEEE ASICON, Changsha, China, the Best Student Paper award at the 2014 IEEE MWSCAS, College Station, Texas, co-recipient of the Best Presenter Award at the 2019 IEEE CCWC, Las Vegas, Nevada, and the 2020 Office of Naval Research SFRP Fellowship at the Naval Information Warfare Center (NIWC) Pacific, San Diego, California, respectively.

Title:
50 – 250 GHz Power Amplifier MMICs- Design, Status, and Opportunities using a 250-nm InP HBT Technology
Date:
October 27th
9:00 AM (1 hour)
Location:
Westlake Village, CA
Abstract:

Asked Zach for his Abstract

Title:
AI and IoT in Rail Roads
Date:
October 27th
7:00 PM (0 minute)
Location:
Seattle, WA
Abstract:

People's brains have been making and keeping sophisticated systems up and running for decades. Today duplicate copies of electrical systems like the Rail Locomotives have been copied to help work processes of sophisticated systems improve design and construction of locomotives and rail cars. Our brains are our virtual reality now termed extended reality or XR have emerged as tools to use to help duplicate actual scenarios. These duplicate systems are tested and stressed real time simultaneously just like the original and over time can be predicted and observed to fail at certain times either as a whole or as components. IoT allows us to show the stressors that actually happen in the field and now is shown as a computer double. Stressors include mechanical, pnematic, electrical and structural for these locomotives and rail cars. Join us tonight for a thoughtful study of the locomotive clone.

Title:
WASHINGTON WATER POWER: THE WHITE-WATER YEARS
Date:
October 28th
5:00 PM (1 hour)
Location:
Zoom LINK provided to REGISTRANTS
Spokane, WA
Abstract:

IEEE Spokane is pleased to present the second, concluding episode of the IEEE WWP/Avista historic series, offered at 5 pm on Wed Oct 28 virtually via Zoom, and titled “Washington Water Power: The White-Water Years.”   This last visual episode will detail the turbulent post war years of the company. 

The journey will take us through the post-war development of WWP’s then-modern utility system to the recent failed Hydro One episode.  Additional topics include the struggles with public power and upheavals like the Western Energy Crisis.   

As in the previous episode, this history of one of the region’s most historic companies will be told through Larry’s superb collection of historic photos, allowing the listener to really see and feel like they were there!  

Title:
IEEE Richland Section Young Professional - Happy Hour
Date:
October 28th
5:30 PM (1.5 hours)
Abstract:

This meeting is intended to be a social and non-technical meeting where the young professionals can meet and find opportunities to get involved in various IEEE activities and contribute to the community. Young professionals can use this event for building/expanding their network. 

Title:
IEEE GHTC 2020 - 10th IEEE Global Humanitarian Technology Conference
Date:
October 29th
8:00 AM (4 days)
Abstract:

The Global Humanitarian Technology Conference (GHTC) is the flagship IEEE forum for presenting and discussing humanitarian technology innovation and deployment. The technical focus of the Conference is complemented by an integrated understanding of broader contexts—economics, policy, culture, environment—that impact successful humanitarian technology implementation.

The 10th IEEE Global Humanitarian Technology Conference (IEEE GHTC 2020) will share practical technology-enabled solutions addressing needs of underserved communities in resource constrained environments around the world in the context of the United Nations Sustainable Development Goals (UN SDGs).

GHTC 2020 takes place from Thursday October 29 through mid-afternoon Sunday November 1. See the preliminary program schedule here.

Student Poster Contest

Our 3rd Student Poster Contest will be held online Thursday afternoon following the paper sessions. Cash prizes will be awarded. Deadline for submission of abstracts is 2-October.

Workshops

Thursday morning choose from two 1/2 day workshops included with your GHTC full registration:

  • Applied Machine Learning for Social Good

This session will focus on topics around the usage of machine learning (ML) methods in order to assist social good applications.

  • Fundamentals of Off-Grid Electrical Systems

This half-day tutorial covers the contextual, technical, and practical implementation aspects of off-grid electrical systems in developing countries. The mini/micro-grid design process is discussed.

  • NEW! Sustainable Project Design Considering COVID-19 Pandemic

This IEEE HAC-sponsored workshop will offer a training on humanitarian technology (HT) project design and implementation, especially considering the during and after COVID-19 pandemic situations from local and global perspectives.

Special Sessions

Special Sessions and Plenaries are being organized and will be scheduled soon, among them:

  • Panel: “Technology-enabled climb up the demand-driven energy ladder: Interoperability, Growth, All-access”

Ensuring universal, affordable and sustainable energy access is one of the biggest societal challenges of our time. Decentralized, bottom-up approaches, such as solar home systems and microgrids, have emerged as a response to shortcomings of the centralized grid approach, but affordability, scalability, path to growth and long-term sustainability remain a challenge.

  • IEEE HAC Panel on COVID-19

How HAC/SIGHT responded to the COVID pandemic – vision and process improvements with examples of some funded projects and building collaboration opportunities.

 

 

 

Title:
Ribbon Alumina Laminate For PCBs And Substrates
Date:
October 29th
11:30 AM (1.5 hours)
Location:
Santa Clara, CA
Abstract:

Summary: Because ceramic materials are inherently brittle, vias have traditionally been made in the green state prior to sintering. Since the sintering is done by the ceramics vendor (at very high temperature), the onus is upon them to fabricate the vias beforehand, thus making the material custom and costly. This stands in stark contrast to PCB materials which are generic when delivered, being customized instead by the purchaser. Corning’s new ribbon alumina laminate is the first ceramic product that allows for PCB processing — even mechanical drilling. The ribbon alumina essentially supplants the traditional glass weave and, being homogeneous, eliminates differential signal skew. The laminate supports very high speed signaling, such as 5G, with very low loss tangent and dielectric constant. Applicable both as PCB and package substrate: use in PCBs dramatically reduces overall CTE mismatch, while use as a package substrate better distributes stress. This presentation will consider the process flow of traditional ceramics in contrast with Corning’s new ribbon alumina laminate, and provides details on important laminate attributes.

Title:
IEEE 10th Global Humanitarian Technology Conference (GHTC 2020) - Plenary Program
Date:
October 29th
1:00 PM (4 days)
Location:
Seattle, WA
Abstract:

FREE ACCESS to GHTC 2020 PLENARY SESSIONS (Registration required)

The Global Humanitarian Technology Conference (GHTC) is the flagship IEEE forum for presenting and discussing humanitarian technology innovation and deployment. The technical focus of the Conference is complemented by an integrated understanding of broader contexts—economics, policy, culture, environment—that impact successful humanitarian technology implementation.

The 10th IEEE Global Humanitarian Technology Conference (IEEE GHTC 2020) will share practical technology-enabled solutions addressing needs of underserved communities in resource constrained environments around the world in the context of the United Nations Sustainable Development Goals (UN SDGs).

GHTC 2020 takes place from Thursday October 29 through mid-afternoon Sunday November 1. See the preliminary program schedule here. Time zone is PT (+3 ET) (+8 GMT+1). Note change from PDT to PST on November 1.

PLENARY PROGRAM

  • Conference Overview (Thursday Oct 29 1pm PDT)

Overview of GHTC 2020 Virtual Program, technical sessions and navigation mechanics with Conference Chair, Paul Cunningham, Vice Chair, Ed Perkins, and Program Chair Pritpal Singh.

  • Opening Session with IEEE Presidents (Oct 29 3:30pm PDT)

LIVE: Remarks on IEEE's role in Humanitarian Activities by 2020 IEEE President Toshio Fukuda and 2021 President-elect Susan (Kathy) Land

Our 3rd Student Poster Contest will be held online Thursday afternoon following the paper sessions. Cash prizes will be awarded. Deadline for submission of abstracts is 19-October.

Ensuring universal, affordable and sustainable energy access is one of the biggest societal challenges of our time. Decentralized, bottom-up approaches, such as solar home systems and microgrids, have emerged as a response to shortcomings of the centralized grid approach, but affordability, scalability, path to growth and long-term sustainability remain a challenge.

How HAC/SIGHT responded to the COVID pandemic – vision and process improvements with examples of some funded projects and building collaboration opportunities.

GHTC 2020 celebrates the 10th anniversary for IEEE GHTC. The anniversary program will consist of some remarks and two panel discussions, one on the evolution of GHTC and the other on IEEE’s role in Humanitarian Technology.

  • Closing Keynote (Nov 1 Noon PST - time change)

Melissa Sassi, IEEE Digital Intelligence Working Group

 

Title:
IEEE CS Webinar: IEEE Oregon Section Technical Seminar - Quo Vadis Digital Microfluidic Biochips? From Laboratory Research to Commercialization and Beyond
Date:
October 29th
7:00 PM (1 hour)
Location:
Online Meeting
Abstract:

 

Guest Speaker:Krishnendu Chakrabarty, the John Cocke Distinguished Professor and Department Chair of Electrical and Computer Engineering (ECE) and Professor of Computer Science, IEEE/ACM Fellow, Duke University

Presenting:Quo Vadis Digital Microfluidic Biochips? From Laboratory Research to Commercialization and Beyond

Venue:Online

When:Oct. 29th7-8 pm

Abstract:

Digital microfluidics was transitioned to the marketplace for sample preparation by Illumina a few years ago. Since then, this technology has also been deployed by Genmark for infectious disease testing and Baebies for the detection of lysosomal enzymes in newborns. This lecture will describe the journey from early laboratory research, PhD theses and publication of research articles, to technology transfer and licensing to companies.  Today’s microfluidic biochips are fully automated under program control and they can be dynamically reconfigured using sensor data. However, despite these success stories, there still remains a gap between microfluidics research and its adoption in microbiology. The presenter will describe how this gap can potentially be closed with new directions in digital microfluidics, including recent advances in using micro-electrode-dot arrays and acoustofluidics.

Title:
2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2)
Date:
November 5th
8:00 AM (12 hours)
Location:
San Diego
Abstract:

The 2020 ACM/IEEE International Workshop on System-Level Interconnect Problems and Pathfinding (SLIP^2) is the 22nd, "rebooted" edition of the System-Level Interconnect Prediction (SLIP) Workshop. As computing systems and applications grapple with a post-Moore, post-CMOS, post-von Neumann future, fundamental interconnect problems and pathfinding challenges have become more critical to address than ever before.

Title:
Engineering Licensure - From Point A to PE (IEEE-USA Free Webinar)
Date:
November 5th
11:00 AM (1 hour)
Location:
Washington, DC
Abstract:

Have you considered being licensed as a professional engineer? What are the advantages? What is involved? Why should electrical engineers be licensed, and what about software engineers? Come hear the answers to these and other questions.

Title:
Enabling technologies for 6G Networks
Date:
November 5th
6:00 PM (1.5 hours)
Abstract:

Abstract:

The academic community begin to define possible verticals and key-performance indicators for the sixth generation (6G) networks. However, the industrial community has many ongoing development projects that could lay down the ground for 6G development. For example, network virtualization transforms the operators infrastructure into fully automated and scalable chain of hybrid network functions that reside in public and private cloud. This new form of network modeling allows optimizing the computational resources through automated networks that monitors spectrum availability and traffic processed throughout various network segments. This combination of proactive service adaptation and smart resource assignment will influence the architectural design for upcoming 6G networks and the development of integrated components. The lecture will provide visions for a proactive end-to-end 6G network considering current and any future technology enablers. 

Title:
Changes to the NFPA 70E 2021 - Capacitors Electrical Safety
Date:
November 6th
12:00 PM (1 hour)
Location:
LIVE STREAM EVENT
Seattle
Abstract:

Join us for a presentation on Changes to the NFPA 70E 2021 - Capacitors. We will discuss:

  1. Informative Annex R Working with Capacitors
  2. Labeling Requirements for Capacitors
  3. Shock, Short Circuit, Thermal, Arc Flash, and Arc Blast Hazard for Capacitors
  4. Determining Capacitor Stored Energy
  5. Capacitor Discharge of the Line *** LIVE DEMONSTRATION ***
Title:
IEEE SPS DISTINGUISHED INDUSTRY LECTURE: MACHINE LEARNING APPLICATIONS IN ONLINE VIDEO PLATFORMS
Date:
November 6th
2:00 PM (1 hour)
Location:
Vancouver, British Columbia
Abstract:
In the past 15 years, we have seen exponential growth in online video platforms such as YouTube, Instagram, Netflix, TikTok, amongst others. In this walk, we will take a look at some of the challenges these platforms have been facing and how machine learning is playing an important role in addressing these challenges. In particular, we will focus on discussing 3 areas:
1- Content discovery and SEO optimization
2- Establishing trust and safety, and3- Protecting the rights of the content owners
We will also discuss some of the areas that are currently open for future research. 
Title:
Automotive Radar – a signal processing perspective on current technology and future systems
Date:
November 10th
9:00 AM (1 hour)
Location:
Glendale, CA
Abstract:

Radar systems are a key technology of modern vehicle safety & comfort systems. Without doubt it will only be the symbiosis of Radar, Lidar and camera-based sensor systems which can enable advanced autonomous driving functions soon. Several next generation car models are such announced to have more than 10 radar sensors per vehicle, allowing for the generation of a radar-based 360° surround view necessary for advanced driver assistance as well as semi-autonomous operation. Hence the demand from the automotive industry for high-precision, multi-functional radar systems is higher than ever before, and the increased requirements on functionality and sensor capabilities lead to research and development activities in the field of automotive radar systems in both industry and academic worlds.

Current automotive radar technology is almost exclusively based on the principle of frequency-modulated continuous-wave (FMCW) radar, which has been well known for several decades. However, together with an increase of hardware capabilities such as higher carrier frequencies, modulation bandwidths and ramp slopes, as well as a scaling up of simultaneously utilized transmit and receive channels with independent modulation features, new degrees of freedom have been added to traditional FMCW radar system design and signal processing. The anticipated presentation will accordingly introduce the topic with a review on the fundamentals of radar and FMCW radar. After introducing the system architecture of traditional and modern automotive FMCW radar sensors, with e.g. insights into the concepts of distributed or centralized processing and sensor data fusion, the presentation will dive into the details of fast-chirp FMCW processing – the modulation mode which is used by the vast majority of current automotive FMCW radar systems. Starting with the fundamentals of target range and velocity estimation based on the radar data matrix, the spatial dimension available using modern single-input multiple-output (SIMO) and multiple-input multiple-output (MIMO) radar systems will be introduced and radar processing based on the radar data cube or higher-dimension radar-data tensors is discussed. Of interest is the topic of angular resolution – one of the key drawbacks which e.g. render Lidar systems superior to radar in some situations. Consequently, traditional and modern methods for direction of arrival estimation in FMCW radar systems are presented, starting from traditional monopulse-like algorithms to modern sparse reconstruction techniques. Besides other topics such as blindness, rain & snow and near-field detection the presentation will then introduce the great challenge of FMCW radar system interference. While FMCW radar interference is a challenge which can be handled using adaptive signal processing in today’s systems, it will become a severe problem with the increasing number of radar-sensors equipped vehicles in dense traffic situations in the near future and a solution to the expected increase in interference is still an open question.

It is this problem of interference, together with some added functionality, which motivated the proposal of alternative radar waveforms such as pseudo-random or orthogonal-frequency division multiplexing (OFDM) radar for automotive radar systems. Although not yet of great interest from an industrial perspective, the fundamentals and capabilities of both technologies will be introduced in the remainder of the anticipated presentation.

Title:
EMP/IEMI Governance and Mitigation Strategies - A LIVE Webinar
Date:
November 11th
8:00 AM (1.5 hours)
Abstract:

Join us at this free to attend LIVE webinar with industry experts in the field of Electromagnetic Pulse (EMP) and Intentional Electromagnetic Interference (IEMI). All IEEE members and guests are welcome to attend. 

In addition to our speakers shown below, we are honored to have Professor Edl Schamiloglu as our moderator for the LIVE Q&A following the presentations.  Professor Schamiloglu received the B.S. degree from the Applied Physics and Applied Mathematics Department at Columbia University, NY, in 1979; he received the M.S. degree in Plasma Physics from Columbia University in 1981; he received the Ph.D. degree in Engineering (minor in Mathematics) from Cornell University, Ithaca, NY, in 1988. He joined the University of New Mexico (UNM) as Assistant Professor in 1988 and he is currently Distinguished Professor of Electrical and Computer Engineering and Associate Dean for Research and Innovation in the School of Engineering.  Professor Schamiloglu is a Fellow of the IEEE, a Fellow of the American Physical Society, and an EMP Fellow (sponsored by the Summa Foundation).                  Click here to register.

Title:
The Decade Of Materials: Novel Materials For The Connected Digital World
Date:
November 11th
11:30 AM (1.5 hours)
Location:
Santa Clara, CA
Abstract:

Summary: We just started a decade where novel materials will be crucial to many of the technological mega trends we are experiencing, from 5G wireless to augmented/virtual reality, to autonomous vehicles, to personalized medicine, and ML/AI. The talk will focus on materials from technology groups within Corning for electronic, RF and photonic applications in communications, displays, storage and life sciences.

Title:
Deployment-Led Innovation for Sustainable Infrastructure: In Conversation with Jigar Shah
Date:
November 11th
4:00 PM (1.2 hours)
Abstract:

This will be a free-form interview. The moderator, Brendan Keyes, has some planned questions, but attendees are encouraged to use the Zoom CHAT function to send in their own questions/comments during the interview.

Title:
Reliability Section-Az Chapter: Reliability Engineering and AI/ML Implementations
Date:
November 11th
4:30 PM (2.8 hours)
Location:
8522 E Helen Place
Tucson
Abstract:

Impact of various Artificial Intelliegcne and Machine Learning techniques on Reliability Engineering metrics/Methods 

Title:
Oregon Comsoc: Hybrid Cloud Edge-Service - Platform & Services
Date:
November 11th
5:30 PM (1.2 hours)
Location:
Portland
Abstract:

 This event is a joint event with Open Infrastructure Foundation Portland

Abstract:

The rapid standardization with Kubernetes as the defacto standard for orchestration of Infrastructure Clusters has led to aggressive moves by Industry players to capitalize on Operation Technology innovation. While the infrastructure providers are looking to support carrier-grade cluster operations, hybrid-cloud based control plane has become the least common denominator for autoscaling and day-n life cycle management of Kubernetes services.


In this presentation, Prakash would focus on current trends fueling the Edge ecosystem touching upon open service broker APIs, the emergence of hybrid cloud edge service platform, intent-based edge breakout & user plane functions, etc. The topics covered extends across changes in Mobile Edge Computing (MEC), application services using LTE/5G, infrastructure enhancements required to support carrier-grade cluster operations

 

 

Biography

Prakash has 35+ years of Telco/ICT experience with MSEE from IIT Bombay. He is Independent Member Board of Director for Openstack for the last 3 years and current chair of Interop WG, Sr member IEEE, Co-chair EAP INGR WG, Program committee co-chair NFV, Edge, 5G for Open Infra summit 2020, Vice Chair 2018,   NFIC-2018 Chair, and has been a veteran consultant on NFV/CNTT, MANO, VIM, Virtualization, Containerization, Microservices, 5G Core/Edge/Access, Network Slicing and Vertical Industry solutions. The companies he has served for include Micronic Devices, IDM, Microdata Consultants, Intelligent System, Tandem, WinVision, AT&T Mobility, seven.comcoverity.com, AT&T Labs, Futurewei/Huawei Technologies, and currently at Dell. He was also part of Valley start-ups and other IT /Internet Data Center ventures in the late '90s and early 2000. He brought to the table, the experience of building Platform PoCs using OpenStack ecosystems. He has been a regular attendee of CNCF, OpenStack, OPNFV, 3GPP NFV/MEC, IEEE forums over the last several years in the Bay Area as well as globally in the US, China & India.

 

 

Title:
SCV WIE November EXCOM
Date:
November 11th
6:00 PM (2 hours)
Location:
3600 Juliette Lane
santa clara
Abstract:

Section Monthly meeting

Title:
Symposium On Reliability For Electronics And Photonics Packaging
Date:
November 12th
8:00 AM (2 days)
Location:
Santa Clara, CA
Abstract:

Summary: This virtual symposium will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability-related aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

DETAILED AGENDA to follow  -- check   CHECK LATEST PROGRAM DETAILS at  https://ieee-region6.org/scv-eps/?p=2219

Title:
Professional & Forensic Engineering and Expert Witness Career Progression (IEEE-USA Free Webinar)
Date:
November 12th
11:00 AM (1 hour)
Location:
Washington, DC
Abstract:

This webinar discusses Electrical Engineering career paths, specifically paths leading to independent consulting, forensic engineering, and being an expert witness.

A good career starting point is for an undergraduate senior electrical engineering student to obtain Engineer in Training (EIT) certification. Because of the “Industrial Exemption” some electrical engineers never need to be fully licensed, but unexpected career changes (layoffs, for instance) can make Professional Engineering (PE) licensure valuable, and necessary for one to go into business and declare oneself an Engineering Consultant.

Of the many paths an Electrical Engineering Consultant can choose, one fascinating choice is Forensic Engineering and Serving as an Expert Witness. If that path is chosen, the National Academy of Forensic Engineers (NAFE) provides advantages in specialized certification, continuing education, and networking.

Title:
Panel Session: Emerging Challenges in the Modern Electric Grid (2020 IEEE SmartGridComm)
Date:
November 13th
9:00 AM (0 minute)
Abstract:

Emerging Challenges in the Modern Electric Grid (2020 IEEE SmartGridComm)

Title:
Panel Session: Emerging Challenges in the Modern Electric Grid (2020 IEEE SmartGridComm)
Date:
November 13th
9:10 AM (0 minute)
Abstract:

Emerging Challenges in the Modern Electric Grid (2020 IEEE SmartGridComm)

Title:
Student-Industry-Faculty Interaction Session (2020 IEEE SmartGridComm)
Date:
November 13th
10:10 AM (0 minute)
Abstract:

Student-Industry-Faculty Interaction Session (2020 IEEE SmartGridComm)

Title:
IEEE SCV YP 2021 ExCom Seeking Nominations
Date:
November 15th
4:55 PM (7 hours)
Location:
Mountain View, CA
Abstract:

Dear IEEE SCV YP members,

Santa Clara Valley Section Young Professionals is currently seeking nominations from IEEE members to serve on the 2021 ExCom. Positions available include:1. Chair2. Vice-Chair3. Secretary4. Treasurer You have until Sunday, Nov 15, 2020 to send in your self nomination along with a personal biography and position statement.  If you are interested in serving on the YP ExCom next year, please send an nomination email to: Ram Sivaraman  which includes:Title of Email: YP 2021 ExCom Nomination - Name - Position SoughtBody of Email: Name, Contact Info, IEEE membership number, Personal Biography, Position Statement 
Title:
Toward 100Gbps Fully Integrated Wireless Communication Transceivers
Date:
November 17th
12:00 PM (1.3 hours)
Abstract:

The future's more connected societies are in sore need of high-speed point-to-point wireless links with a data rate comparable to wireline links in both indoor short-range and outdoor long-range scenarios. Enabling applications include: optical fiber replacement, high-capacity backhauls, close-proximity wireless data transfer, etc. High-speed communication relies on two major factors: bandwidth and modulation format. The vastly under-utilized mm-wave to sub-THz band is very attractive for this application. However, the abundance of bandwidth in mm-wave/sub-THz bands cannot be easily utilized with commercially available low-cost Silicon-based fabrication technologies. Meanwhile, increasing modulation order puts stringent requirement on the high-speed mixed-signal interface design, i.e. analog-to-digital converters, digital-to-analog-converters and digital signal processors. In short, conventional transceiver architectures encounter serious bottleneck that limits achievable data rate and posts significant concerns on system cost and efficiency. The state-of-the-art solutions will be presented and discussed first, followed by our proposed way of implementing highly integrated ultra-high-speed wireless transceivers.

Join in at https://cpp.zoom.us/j/98062834595

Title:
Monthly San Diego IEEE EXCOM
Date:
November 18th
6:00 PM (3 hours)
Location:
Building C training center
San diego, CA
Abstract:

 

SDIEEE EXCOM Meeting

Executive Committee meeting to discuss upcoming San Diego IEEE activities.  All IEEE members welcome to attend. 

 

Agenda:

 

6:00  light snacks and networking

6:30  Meeting begins

         Review minutes

         Student reports

         Upcoming programs

         New Business

8:30   Adjourn

 

 To add to the agenda, please email kathyh@ieee.org.   All invited, please RSVP. 

Title:
Highlights from the 2020 IEEE-USA Consultant Fee Survey Report (IEEE-USA Free Webinar)
Date:
November 19th
11:00 AM (1 hour)
Location:
Washington, DC
Abstract:

Please join Josephine Russo, a member of the IEEE Research team and author of the 2020 IEEE-USA Consultant Fee Survey Report, for a short webinar to review the findings from the most recent IEEE-USA Consultant Fee Survey.

31 meetings. Generated Friday, October 23 2020, at 10:29:12 PM. All times America/Los_Angeles