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Filtered duplicate meeting "Boeing Little Mountain Test Facility Tour Program" (1)

28 meetings

Title:
AI Maturity: how to Minimize the Risks and Maximize the Benefits AI can bring
Date:
May 30th
5:30 PM (1 hour)
Abstract:

There is so much excitement about AI.  Whether your team consists of expert data scientists or citizen data scientists or both, investing in AI is a great way forward.  Using your data as an asset with the help of AI has great potential to bring a competitive advantage, but only when done right.  Mature AI is defined as having properly developed, productionalized, consumed, and maintained AI products.  AI Maturity is directly correlated to the business impact AI will bring. With a plan developed on the AI Maturity model we will present, you can move your team forward on your maturity journey.

Title:
LMAG: STEM Engagement - kick-off
Date:
May 31st
9:00 PM (1.5 hours)
Abstract:

This is the STEM engagement kick-off.

 

Title:
Intro to Neural Networks and Deep Learning
Date:
June 2nd
4:30 AM (13 hours)
Abstract:

Deep learning (DL) is a subfield of Machine Learning that deals with algorithms inspired by the structure and function of the brain. DL has revolutionized the world with its advancement in technology, finding its application in every sector of business.  Deep Learning models help advertisers leverage data to perform real-time bidding and targeted display advertising. It is also used to make weather predictions about rain, earthquakes, and tsunamis. With deep learning, machines can comprehend speech and provide the required output. It enables the machines to recognize people and objects in the images fed to it. TensorFlow is currently the most popular learning library in the world, based on the concept of tensors, which are vectors or matrices of n dimensions. This workshop will explore selected programming tools using python and/or Matlab and demonstrates the Deep Learning (DL) steps with examples. The focus will be handling of some of the widely used methods and key issues that students may come across, suggesting a number of discrete resolutions so as to provide optimal results on the accuracy and validity of Train and Test methodology.

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
June 2nd
3:30 PM (1.5 hours)
Abstract:

EXCOM MEETING

Title:
IEEE Consultant Networking Event Dinner and Show
Date:
June 2nd
7:30 PM (1.5 hours)
Location:
216 Union Street
Seattle, WA
Abstract:

Join us for a night of entertainment with Massy Ferguson & Paula Boggs Band. Come out and converse with your IEEE Consultant Network Seattle. Find out what projects we are working on and how we can connect you with our group. Great networking event. Find out what events are coming up, who is hiring and who on our team can help your organization flourish. Paula is a friend of the IEEE. She contributes to our team and is a great singer and song writer. You don’t want to miss this memorable event. Sign up today! Dinner and show RSVP today.

Title:
IEEE Region 6, Southern Area Meeting
Date:
June 3rd
10:00 AM (4 hours)
Location:
California State University, Northridge
Northridge,, CA
Abstract:

Join other officers in the Region 6, Southern Area for a meeting to network, to share best practices, and discuss how to make section and chapter meetings more successfull.

Some material from the online Area meeting that was held April 15, the IEEE NORTHEAST/SOUTHWEST JOINT AREA MEETING, is available - send c.jackson@ieee.org a note for the link

We will be meeting in JD 1602.
https://www.csun.edu/csun-maps 
Everyone will need to purchase a day parking pass.
https://www.csun.edu/parking/visitor-parking-information

Title:
From Metasurfaces to Electromagnetic Skins - Concepts and Design Methods 
Date:
June 7th
9:00 AM (1.5 hours)
Abstract:

Title: From Metasurfaces to Electromagnetic Skins - Concepts and Design Methods 

By Prof. Giacomo Oliveri 


Zoom call information

Link: https://uqtr.zoom.us/j/86375973096?pwd=MEJmU1Fhem5Wd2RIKzR1ZmZnd2Y3QT09

Meeting ID : 863 7597 3096
Meeting Password : 972592


Abstract

2D metamaterials and metasurfaces has emerged in the last couple of decades as a powerful approach to improve the performance of antennas and radiating elements beyond what could be obtained by standard materials. Among the vast applications of such a technology, metasurfaces have been used to reduce the mutual-coupling effects in multi-antenna system, to enable antenna co-existence and mutual transparency, to allow frequency/angular filtering, and to enhance the active impedance matching in phased arrays. The recent introduction of Electromagnetic Skins (EMSs)
has motivated a complete revolution of metasurface design methodologies and approaches.
EMSs, which are stand-alone structures capable of performing advanced wave manipulation functionalities, have been then used to extend the capabilities of current wireless and sensing systems. The objective of this talk will be to discuss the transition between metasurfaces and EMSs, and to illustrate the recent advances and ongoing trends in their design and implementation.

Biography
Giacomo Oliveri received the B.S. and M.S. degrees in TLC Engineering and the PhD degree in Space Sciences and Engineering from the University of Genoa, Italy, in 2003, 2005, and 2009 respectively. He is currently an Associate Professor in Electromagnetic Fields at the Department of Civil, Environmental, and Mechanical Engineering (University of Trento) and a Board Member of the ELEDIA Research Center. Moreover, he is Adjunct Professor at CentraleSupélec and member of the Laboratoire des Signaux et Systèmes (L2S)@CentraleSupélec, Gif-sur-Yvette (France).
He has been a visiting researcher at L2S in 2012, 2013, and 2015, and he has been an Invited Associate Professor at the University of Paris Sud, France, in 2014, and visiting professor at Université Paris-Saclay in 2016 and 2017. Prof. Oliveri received the Italian National Scientific Qualification for the position of Full Professor in 2017 (ASN), and the French National Qualification as Full Professor in 2019.
He is author/co-author of over 400 peer-reviewed papers, of which more than 145 on international journals and more than 280 on international conferences, which have been cited more than 7800 times (Scopus). His H-index is 44 (Scopus). His research work is mainly focused on metamaterials and electromagnetic skin engineering, smart electromagnetic environment methodologies and technologies, electromagnetic direct and inverse problems, and antenna array synthesis. Prof. Oliveri served as an Associate Editor of the IEEE Antennas and Wireless Propagation Letters (2016-2022), of the IEEE Journal on Multiscale and Multiphysics Computational Techniques (2017-2023), and he currently serves as an AE of the EPJ Applied Metamaterials journal, of the International Journal of Antennas and Propagation, of the International Journal of Distributed Sensor Networks, of the Microwave Processing journal, and of the Sensors journal. He is member of several IEEE AP Society committees (Membership Benefits Committee; Strategic Analysis Board; Field Awards Nomination Committee; Field Award Committee). He is an elected member of the Board of the Scientific Council of the CNIT. He is a Senior Member of the IEEE, and the Chair of the IEEE AP/ED/MTT North Italy Chapter.

Title:
Negotiating Your Professional Services Agreement (IEEE-USA Livestream Webinar)
Date:
June 7th
11:00 AM (1 hour)
Abstract:

Negotiating Your Professional Services Agreement:  The Good, the Bad, and the Ugly

In this free webinar, we will discuss the importance of a well-drafted professional services agreement. We will talk about some of the critical risk management provisions that should be addressed in all professional services agreements and discuss ways to deal with poorly drafted provisions proposed by clients.

  • Discuss the importance of contract negotiations and insight that may be gained from the process;
  • Identify important contract provisions that are frequently the subject of difficult negotiations;
  • Consider the risk management implications associated with poorly worded provisions and ways to modify the language; and
  • Learn about the potential advantages associated with favorably-drafted provisions.

 

This series is being presented in partnership with the IEEE Member Discounts Program.

Title:
Foothill Consultant Network - "A really important engineering challenge"
Date:
June 7th
6:30 PM (2 hours)
Location:
Suite 100
Ontario, CA
Abstract:

Monthly Consultants Network Meeting

Title:
In-Vehicle Display Technology Development and Challenges
Date:
June 8th
6:00 PM (2 hours)
Location:
Mountain View Community Center
mountain view, CA
Abstract:

Location: Maple Room, Mountain View Community Center, 201 S Rengstorff Ave, Mountain View, CA 94040

Speaker

Fen Chen,1Cruise LLC, San Francisco, CA, USA
fen.chen@getcruise.com

Abstract:

Visualization technologies are the most vital components of in-vehicle interactions. The shift toward autonomous vehicles and connected cars is bringing a future in which occupants would be needed to monitor the status of the vehicle and its surroundings. Meanwhile, occupants would also spend significantly more time watching displays for entertainment, information, and connectivity on the road. Therefore, the need for in-vehicles displays with better visibility, brightness, viewing angle, resolution, sharpness, and reliability together with larger sizes and free-form that offer unobtrusive visual information during journeys is on the rise. Superior display with touch technologies can enable a safe, informative, and comfortable driving or riding experience. The applied in-vehicle display products include a center infotainment display, rear seat entertainment display, head-up display, side mirror display, and instrument cluster display. In this talk, motivations as well as various architectures of display including LED, LCD, OLED, Mini/Micro-LED, TFT, flexible, heads-up, and the touchscreen will be introduced. The development trend of in-vehicle display technology will be discussed. The mature TFT LCD technology is still the mainstay for in-vehicle in the short term. OLED and Mini LED/Micro LED array technology has a relatively large advantage in the medium and long term. Due to the unique requirements and opportunities such as aggressive adoptions of EVs, digitalization, and autonomous vehicle, the in-vehicle display technology development will be moved from a “follower” to a “front runner”. Designing displays for vehicles imposes very different challenges than designing them for consumer applications. This is due to some unique factors associated with vehicle usage, such as the required product life cycles, the extremely harsh environment, frequent mechanical impacts, the stringent EMI/EMC compliance, the required high-level ESD protection, and functional safety requirements. Requirements and challenges of display in-vehicle application, including optical performance, appearance, fabrication, characterization, mura/defect inspection, Demura technique, visibility in bright and complete darkness, touch functionality, quality, reliability, EMI/EMC/ESD, and functional safety will be reviewed. Some common LED LCD display reliability failure modes and effects include FOS spot lighting failure mechanism and risk assessment, BLU film buckling and wrinkle failure mechanism and modeling, metal oxide TFT panel level VGH and VGL reliability modeling, LCD panel UV aging reliability modeling, Polarizer bleaching failure mode and reliability modeling, free fall object impact test and LCD glass crack failure risk assessment, and LED luminance degradation reliability modeling will be presented. Automotive display technology will continue to evolve as there are still many emerging technologies, as well as the refinements of existing technologies, which are still under development. This continued growth will overwhelm the driver and occupants with maximum comfort and convenience on the road.

 

Title:
Machine Learning for Embedded Edge Applications
Date:
June 8th
7:00 PM (1 hour)
Abstract:

AI/ML is an all-pervasive technology that has the potential to transform our lives. It has use cases from Internet of Things (IoT) to edge devices to automotive to cloud. This presentation discusses how AI is disrupting traditional embedded edge market including surveillance, robotics, industrial automation, aerospace and defense applications. We will cover market requirements, customer use cases and key challenges. In addition, we will also discuss how next generation of purpose-built products are addressing the needs of this market.

Title:
Boise Hiking Event Jun.10th
Date:
June 10th
7:30 AM (2 hours)
Location:
S1012438401, Boise, ID 83712
Boise, ID
Abstract:

Hi guys,

I had the chance to meet many of you in person in the last BBQ event, and it was super exciting to finally see everyone in person. That is why I am inviting you to this hiking event at Table Rock Trail, we can immerse ourselves in nature while socializing! 

If you are interested, please join the discord for ease of communication DISCORD LINK. Please bring some water and sun screen, I will bring extra in my car.  

Date: June 10th

Time: start at 8:30 am

Location: Table rock trail, Boise, Idaho Table Rock Cross Trail Parking, S1012438401, Boise, ID 83712

Trail: 3.7-mile loop (Approx. 1.5 hours)

Zong Yin Chi

IEEE Boise YP

Title:
IEEE Hawaii YP ExCom June 2023
Date:
June 12th
9:00 PM (0 minute)
Abstract:

Monthly ExCom Meeting

Title:
Large Scale Generator Interconnection Processes and Challenges
Date:
June 14th
9:00 AM (1 hour)
Abstract:

With the United States' ambitious renewable energy goals, the demand for large-scale (>20MW) generator interconnection (GI) services has increased significantly, leading to longer interconnection queues and longer wait times for developers. Understanding how large-scale projects are studied in the interconnection process is crucial for developers, policy makers, and other stakeholders involved in the renewable energy sector. Transmission Service Providers (TSPs) are responsible for studying and evaluating large-scale generator interconnection requests to ensure the safe and reliable integration of new energy resources into the electric grid. TSPs use a variety of technical studies to evaluate the impacts of large-scale GI requests. These processes and technical studies can vary by region and can significantly impact the feasibility of a renewable energy project. 

This presentation will provide a high-level overview of the interconnection processes for large-scale generator projects in the United States. We will explore a variety of different study practices, including those in MISO, PJM, SPP, ERCOT, and TSPs in the Western Interconnect. The presentation will also touch base on challenges TSPs are experiencing with the volume of GI requests in queues across the country.

Title:
Hybrid Bonding: Greater Functionality, Higher Performance and Smaller Size
Date:
June 15th
12:00 PM (1 hour)
Location:
SEMI World Hdqtrs
Milpitas, CA
Abstract:

Massive demands are being placed on computing due to skyrocketing increases in data consumption. Penetration of AI and ML into more and more fields requires real-time fast processing at the edge as well as fast data transfer to datacenters for analysis. 5G and 6G technologies demand ever increasing frequency for wireless communications. Autonomous driving and other harsh environments demand high reliability. The semiconductor industry needs to continuously deliver better performance from a smaller footprint with higher frequency response, higher reliability, lower power consumption, and all with a lower barrier for entry than advances at the transistor level. How are these rigorous market demands influencing innovations in chip manufacturing and advanced interconnect such as hybrid bonding?
This presentation will give a brief introduction of the hybrid bonding technology, how it enables disaggregation and heterogeneous integration and helps increase efficiency and performance while shrinking footprint, and how it enables high reliability.

Title:
Boeing Little Mountain Test Facility Tour Program
Date:
June 15th
12:00 PM (3 hours)
Location:
Little Mountain Test Facility
Ogden, UT
Abstract:

The Boeing Company has arranged to give a tour to Little Mountain Test Facility to the IEEE members. It is a great learning opportunity. The IEEE Utah section would like to invite the interested IEEE member to join the Boeing Little Mountain Test Facility tour program on June 15 2023.

The Little Mountain Test Facility is an extension of Hill Airforce Base, visitor requests are required to be submitted to the Air Force for all tour attendees, and all attendees must be US citizens. This location is a full-feature system test facility for shock/vibration and EMC/EMI testing. This tour is limited for 10 people and first-come-first serve opportunity.

Tour Information

Date: June 15th, 2023

Time: 1:00 – 4:00 PM

Address: Little Mountain Test Facility. 11206 W 900 S St, Ogden, Ut 84404

Please register by June 2nd 2023.

 If there are any other questions about the tour, please email to shanker.shrestha@ieee.org

 

Title:
IEEE CN Smart Cities Sydney
Date:
June 15th
7:00 PM (1 hour)
Abstract:

Join us a session from Down Under Sydney Australia Smart City. Find out why Sydney is one of top Smart City in the World including Smart Health, Smart Education, Smart Connectivity and Smart Mobility.

Title:
IEEE Power and Energy Society - Young Professionals – GRID GAME 2023
Date:
June 16th
7:00 AM (1.5 hours)
Abstract:

The Grid Game started a s simple microgrid simulator that modeled the frequency variations of a microgrid with a small amount of inertia developed for a class created by the University of Idaho and Idaho National Laboratory to teach students about the multidisciplinary area of research and development called resilient control systems. When Mike Guryan from Idaho Regional Optical Networks suggested “could you make that a game?” …

Tim will talk about the inspiration for building the game and about some of the history around the game and the topics of resilient control systems.

 

Note – Installation instructions and Grid Game Manual shall be provided via email to the registered participants. Participants are expected to install the grid game software and go through the manual to understand the game before the event.

Participant certificates shall be provided to attendees and winners/runners to get additional Goodies from IEEE PES YP.

Registration is limited. 

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
June 16th
3:30 PM (1.5 hours)
Abstract:

EXCOM Meeting

Title:
A Vision of Intelligent Train Control
Date:
June 20th
12:00 PM (1.5 hours)
Abstract:

Free Registration: https://www.eventbrite.com/e/a-vision-of-intelligent-train-control-tickets-641698887647

Synopsis:

The progressive adoption of Artificial Intelligence (AI) and advanced communication technologies within railway control and automation gave rise to a huge potential in terms of optimization, learning and adaptation, due to the so-called “self-x” capabilities. However, it has also raised several dependability concerns due to the lack of measurable trust that is needed for certification purposes. In this talk, a vision will be provided about future train control that builds upon existing automatic train operation, protection, and supervision paradigms. The basic concepts for autonomous driving in digital railways will be provided, and feasibility will be addressed in terms of challenges and opportunities, including explainability, autonomic computing, and digital twins. Due to the clear architectural distinction, traditional train protection (ATP) can act as a safety envelope for intelligent operation to optimize energy, comfort, and capacity, while intelligent protection based on signal recognition and obstacle detection can improve safety through advanced driving assistance.

Title:
June Business Meeting
Date:
June 20th
5:30 PM (1.5 hours)
Location:
Building C, 3rd Floor
Farmington, UT
Abstract:

The May business meeting of the IEEE Utah Section.  This meeting will be held at Weber State University Farmington Station Park from 6:30 PM to 8:00 PM.   The address is 240 North Promontory, Suite 3000 - Room 321, Building C, 3rd Floor, Farmington, UT 84025.

On the agenda we have:

  • TBD

This is a great opportunity to meet your new officers and get involved in the section.  If you are attending in person, please register and let us know what you would like to eat.

There is a webex with a call-in number for those that cannot make it in person.  Please contact the Shanker Shrestha ( shanker.shrestha@ieee.org) for the webex information.

Title:
IEEE-USA Livestream Webinar: Semiconductors, an Introduction
Date:
June 21st
11:00 AM (1 hour)
Abstract:

The design and manufacture of semiconductor chips is complex.  There is significant terminology,  processes and science to go from idea to physical part.  If you are new to the semiconductor industry and want to learn about this field, this session is for you.  Gain a high level understanding of how chips are made, including the terminology and ecosystems required.  We'll also briefly discuss some of the careers required to fuel this amazing technical field.

Title:
2023 Monthly San Diego IEEE EXCOM - June Meeting
Date:
June 21st
5:30 PM (2.5 hours)
Location:
ATEC
San Diego, CA
Abstract:

 SDIEEE EXCOM Meeting

Executive Committee meeting to discuss upcoming San Diego IEEE activities. 

All IEEE members welcome to attend. Please RSVP. 

5:30 pm - 6:00 pm,    Networking and food

6:00 pm - 8:00 pm,    meeting (in person and/or remote)

Agenda:

Approve prior meeting minutes (May 2023 Minutes will be in the media section of this vTools event)

Student branch reports

Section Officers Reports

Old and new business

Adjourn 

 

 

 To add to the agenda, please email w5nyv@arrl.net.   

 

Title:
Miniaturized Power Management that Disappears and Merges with the Environment and Systems
Date:
June 21st
6:30 PM (1.5 hours)
Location:
Santa Clara Convention Center
Santa Clara, CA
Abstract:

The need for an efficient power management solution has never been more critical across virtually all electronic devices and systems from low power to high power, smartphones to data centers, battery-powered components to renewable-energy-powered grids, and from stationary systems to aircraft. Particularly for ultra-low power systems such as untethered sensors and IoT systems, the key challenge is to maintain high delivery efficiency while satisfying increasingly demanding input/output requirements, space constraints, reliability, and cost, simultaneously. Aiming to address this grand and increasingly difficult challenge, the speaker will present multiple approaches centered around physical, architectural, and functional integration of advanced power management units with the systems that allow them to efficiently and essentially disappear/merge with the environment. Design examples and results from the iPower3Es group at UCSD and state-of-the-arts will also be covered as demonstration.

Title:
Introduction to Camera Technology: Packaging Challenges
Date:
June 22nd
11:30 AM (1.5 hours)
Location:
SEMI World Hdqtrs
Milpitas, CA
Abstract:

Cameras have become key sensors in many products, e.g., cellphones, automotive, and AR/VR. Though cameras were traditionally invented to mimic human perception, the recent development of artificial intelligence (AI) enabled cameras in an increasing number of computer vision applications (e.g., gesture control, object detection), which also brings additional challenges in camera development and packaging. This talk will first provide a brief introduction to the camera system, including both camera module hardware and the image processing pipeline, and then discuss how different applications affect camera development and packaging.

Title:
Field Trip: Communications for Emergency Response @ Iroquio Point, Eva Beach, Oahu
Date:
June 24th
2:30 PM (3.5 hours)
Location:
Kapilina Beach Homes
Eva Beach, HI
Abstract:

*** The times are very flexible. Let's have lunch together and socialize. Stay as long as you like,

*** This event will also be on other islands. Let me know if you want to see this activity on other islands.

What happens when a natural disaster takes out our communications network? No mobile net. No Internet.  
Every year, the last weekend of June is Field Day. The Amateur Radio Emergency Service (ARES) conducts. Come and see:

* Simulated emergency operations completely off-grid.
        See how little equipment is needed.
* Operations using the high frequency (HF) 160-, 80-, 40-, 20-, 15- and 10-meter bands.
       Lower frequencies that most modern wireless services with great propagation to the mainland.
       If propagation conditions are good, contacts to the east coast and Europe are possible
* The exercise is to reach as many operators as possible exchanging voice and data (Internet) messages.

Feel free to bring your kids.

 

 

 

Title:
The Future of Robotics and Real World Issues
Date:
June 27th
3:00 PM (2 hours)
Location:
The Commonwealth Club
San Francisco, CA
Abstract:

Join the Silicon Valley, San Francisco and Oakland/East Bay Chapter of the IEEE Robotics and Automation Society and The Commonwealth Club for a showcase of robots with guest speakers from Boston Dynamics, Intrinsic.io, RAND and Silicon Valley Robotics.

Our speakers will start the discussion on some real world issues facing the roll out of robots, while we provide a hands-on showcase of some of the robots of tomorrow. 

27 meetings. Generated Tuesday, May 30 2023, at 8:42:48 PM. All times America/Los_Angeles