Three-dimensional NAND flash memory has become a cornerstone of modern data storage, powering everything from mobile devices to hyperscale data centers fueling the AI revolution. As the industry pushes toward both higher storage density through aggressive 
vertical scaling and faster operation to meet the demands of next-generation highperformance SSDs, low-latency AI/ML workloads, and real-time data-intensive applications, the challenges of maintaining robust device reliability grow increasingly complex. This talk provides an industry perspective on the co-evolution of 3D NAND density and performance, covering advances in cell architecture and scaling strategies alongside the reliability challenges that arise when optimizing for both capacity and speed. The presentation will also share practical insights on working as an engineer in the semiconductor memory industry and the career path from academia to industry, aimed at students and young professionals entering the field

How are companies actually adopting AI today?

This informal IEEE networking session is designed for engineers, researchers, and industry practitioners to share real-world experiences around AI adoption — what’s working, what’s not, and where teams are facing challenges.

This is not a talk or presentation.
There are no slides — just a curated, peer-level discussion.

Topics may include:

• Where teams are in their AI adoption journey (experimentation → production)
• Use of LLMs and AI systems in real-world workflows
• Challenges in scaling AI beyond prototypes
• Measuring impact and ROI
• Build vs. buy decisions

The session is intentionally kept small to enable meaningful interaction.

• Short introductions (name, role, current AI focus)
• Open discussion guided by participant experiences
• Informal networking

• Engineers and ML practitioners working on AI systems
• Product and platform leaders involved in AI adoption
• Founders and technical decision-makers
• Researchers interested in applied AI systems

• No presentations or sales pitches
• Participation is encouraged — come ready to share and learn
• Limited capacity to maintain quality of discussion

Chhavi Jain
Vice Chair, IEEE Signal Processing Society – San Diego Chapter

This session is part of an ongoing IEEE initiative to connect practitioners working on real-world AI systems and deployment challenges.

Bangalore and San Diego Sister Chapters joint meeting (TwCP):

Learn about the benefits and the steps to be elevated as an IEEE senior member

In this meeting, Dr. Zhang will cover the benefits of an IEEE senior member and the senior member elevation process:

• ·        why becoming senior,
• ·        senior member requirements,
• ·        senior member application process,
• ·        how to find references,
• ·        how to calculate number of years of experiences, 
• ·        how to prepare application materials  (with senior review panel dates),
•   .   briefly discussion on IEEE Fellow Program

Join us for the upcoming technical talk —attend in person at Stockman’s Restaurant or virtually via Microsoft Teams 

Title:

Accelerated Qualification of Novel Nuclear Structural Materials: Multiphysics Simulations of a MEMS-Based Creep Device Under Ion Irradiation

Abstract:

Qualification of structural materials for advanced nuclear reactors requires testbeds capable of
simultaneously replicating and monitoring high temperatures, irradiation, and mechanical stress.
This talk presents a multiphysics modeling framework for the design and optimization of an in-
situ testbed for measuring irradiation creep and thermal fatigue.
The testbed couples a silicon MEMS device with ion irradiation and scanning electron
microscopy to enable real-time mechanical testing under irradiation. Finite element simulations
developed in CUBIT and BISON resolve the coupled thermal, electrical, and mechanical
response of the MEMS device and quantify induced strain in the sample. Geometry optimization
of the MEMS device is performed to achieve uniform temperature and strain fields in the test
sample.
Results demonstrate that the multiphysics framework reduces reliance on iterative physical
prototyping in testbed development and provides a reproducible basis for geometry and loading
parameter selection in nuclear materials testing.

Speaker: Akanksha Parmar
Postdoctoral Research Associate
Idaho National Laboratory

Akanksha is a Postdoctoral Research Associate in C650 department at INL, where her research
focuses on computational modeling of nuclear fuels, including high burnup structure, chromia-
doped UO₂, and annular fuel pellets, using advanced constitutive models such as crystal
plasticity.
She received her Ph.D. in Mechanical Engineering from Purdue University, where she combined
multiscale modeling with hands-on fabrication, processing, and characterization to study
microstructure evolution during additive manufacturing. She holds an M.S. in Aeronautics and
Astronautics from Purdue University, where her thesis focused on multiscale modeling of
composite structures.

Agenda

1. General issues of chapter development, next meeting time, and speaker.
2. Officers election and reporting: Current interested are Amit Rai, Sree Ram, Vijaya sai Munduro, Karthik Bodducherla
3. Tech talks feedback:
   1. Reliability Meets AI (RS & ASQ)
   2. Predictive Engineering (RS & EMBS)
   3. www.iirw.org | Oct 2026
4. Members status
5. Standards: IEEE P1856.1 (PHM) Working Group, IEEE Rel std. Semiconductor (TBD)

This webinar provides an overview of the evolving power system in Samoa as the country increases its integration of renewable energy resources. The
presentation introduces the structure of the national grid operated by Electric Power Corporation Samoa and highlights recent operational
challenges, including generation constraints, grid reliability, and the current energy situation. Particular attention is given to the technical
challenges of operating a small island power system with high renewable penetration. Key lessons learned and potential strategies for maintaining
reliable system operation during this transition are also discussed.

Session 4 of the OneAquaHealth Innovation Series Leading to the IEEE OneAquaHealth Global Hackathon

TOPIC: Informatics, Technology & Standards

The OneAquaHealth Hackathon Learning Series continues on 27 August 2026 with its fourth session, Informatics, Technology & Standards, covering HL7 FHIR alongside a hands-on sandbox experience. Having moved from the project's scientific basis through One Digital Health and FAIR data principles, the series now turns to how those principles work in practice. Environmental sensor feeds, citizen observations, and health data rarely speak the same language — the problem set out in Track 7: Digital Health Standards, though it reaches well beyond that track. Any prototype drawing on more than one data source runs into it eventually.

Participants will gain practical experience navigating HL7 FHIR models within our dedicated sandbox environment, ensuring your innovations align with global One Digital Health and FAIR data principles. With the August 31 Hackathon registration deadline fast approaching, now is the perfect time to arm your team with the skills necessary to build breakthrough solutions and compete for the ,000+ prize pool. 

We are organizing part6 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.

LAcon V, the 84th World Science Fiction Convention, will be held on August 27-31, 2026 at the Anaheim Convention Center and the Hilton Anaheim and Anaheim Marriott hotels in Anaheim, California, a suburb of Los Angeles. It is the fifth Worldcon convention to bear the “LAcon” name.

LAcon V 2026 - World Science Fiction Convention, Aug 27-31, 2026, in Anaheim California: https://www.lacon.org/

IEEE will be hosting a booth at Worldcon 2026 (LAcon V).

We have volunteer opportunities and a student competition.

Sign up to volunteer at the IEEE booth during Worldcon / LAcon V 2026: https://forms.gle/69uVagGrvNDjpb7bA

If you are a student, also join the 2026 IEEE Student Challenge at Worldcon - From Fiction to Fact.
https://ieee-dataport.org/competitions/2026-ieee-student-challenge-worldcon-fiction-fact

IEEE SCV Young Professionals × KALAeidoscope: Network, paint, and groove at Brushes & Beats with live DJs and good vibes!

Art. Music. Creativity. Connection.

IEEE Santa Clara Valley Section Young Professionals(IEEE SCV YP), in collaboration with KALAeidoscope, invites you to Brushes & Beats — a creative networking mixer designed to bring people together beyond the usual professional setting.

Come meet new people, connect with the community, get creative, and enjoy a late morning of canvas painting, live DJs and creative play.

For this special edition of KALAeidoscope, we’re putting a playful spin on canvas painting. You’ll get a mystery palette, creative challenges, and plenty of inspiration to create your very own, completely unique canvas artwork.

Idukki & DJ Nikhil will be setting the mood with Nu Disco + Coffee House groovesthroughout the event.

No painting experience needed! Just bring yourself and your curiosity — all materials will be provided.

Whether you're an IEEE Young Professional looking to expand your network or simply someone who wants to spend time with an interesting IEEE community, Brushes & Beats is an opportunity to connect, create, and have a great time.

Meet new people, unleash your creativity, and let the beats inspire you!

This event is sponsored by IEEE Young Professionals and IEEE Foundation

• IEEE Young Professionals/members:
• Non-IEEE Attendees:

Date: August 29, 2026
Time: 10:30 AM – 12:30 PM
Venue: Local Color Big Arts Building
Address: 255 W Julian Street, San José, CA 95110
Space: Front Sunshine Room at Big Arts

IEEE Young Professionals (IEEE YP) is an international community of IEEE members and volunteers who have graduated from their first professional degree within the past 15 years.The community brings together recent graduates, experienced professionals, and entrepreneurs who are interested in elevating their professional image, expanding their global network, connecting with peers locally, and giving back to their communities.

At IEEE SCV YP, we create opportunities for our diverse community to connect through networking, professional development, creativity, and shared experiences.

Follow us at https://site.ieee.org/scv-yp/

KALAeidoscope is an art salon experience for anyone who wants to make, create, connect, and have a good time — all while listening to live DJs.

Through creative experiences that bring together art, music, and community, KALAeidoscope creates a space where everyone can explore their creativity, meet new people, and simply enjoy the moment.

Come for the networking, stay for the art, and let the beats inspire your creativity! 🎨🎧✨

Follow us at

Kaleidoscope - https://www.instagram.com/thekaleidoscopestory

Idukki - https://linktr.ee/idukkiwithbeats

DJ Nikhil - https://www.instagram.com/dj_nikhl

IEEE SCV Young Professionals × KALAeidoscope — Brushes & Beats

Artificial Intelligence is rapidly evolving from generating content and improving individual productivity to securely interacting with enterprise systems, applications, APIs, and organizational data. As AI assistants and agents become more capable, organizations need standardized and governed ways to provide them with the context, tools, and business capabilities required to perform meaningful work.

Following our July session on Driving Business Efficiency with AI, the IEEE Orange County Computer Society GET-AI Series continues with a practical, demo-driven August session focused on the Model Context Protocol (MCP) and its role in connecting AI to enterprise data and systems.

This double-feature session will first introduce MCP fundamentals, including its architecture, core components, tools, resources, prompts, and the development of a simple MCP server. The second session will build on that foundation by demonstrating how MCP can be used to connect AI assistants and agents with enterprise applications, APIs, databases, and business workflows.

By combining foundational concepts with real-world integration patterns and live demonstrations, the August session will help attendees understand how MCP enables secure, scalable, and intelligent enterprise AI solutions.

Through practical explanations and live demonstrations, this session introduces the Model Context Protocol (MCP) and explains how it enables AI assistants and agents to securely connect with external tools, applications, APIs, and data sources. Attendees will learn how MCP provides a standardized framework for supplying AI systems with the context and capabilities required to perform meaningful tasks.

The session will move from core concepts to a hands-on demonstration of building and connecting a simple MCP server.

Topics include:

• What MCP is and why it matters in the AI era
• MCP architecture and core components
• MCP Hosts, Clients, and Servers
• Tools, Resources, and Prompts
• Connecting AI assistants to external data and capabilities
• Building a simple MCP server
• Defining and exposing an MCP tool

👉 Takeaway: Understand how MCP connects AI assistants and agents with external systems, and learn how to build a basic MCP server that exposes tools, resources, and prompts through a standardized interface.

Building on the MCP foundations introduced in Session 1, this session explores how organizations can use the Model Context Protocol (MCP) to connect AI assistants and agents with enterprise applications, APIs, databases, knowledge sources, and business workflows. Through architecture examples and live demonstrations, attendees will learn how MCP can enable secure, scalable, and governed access to enterprise capabilities.

The session will focus on moving from a basic MCP implementation to practical enterprise use cases that support intelligent workflows and real-world business outcomes.

Topics include:

• Connecting AI assistants and agents to enterprise systems using MCP
• Exposing enterprise APIs, applications, and data as MCP capabilities
• Integrating databases, file repositories, business systems, and knowledge sources
• Combining MCP with Retrieval-Augmented Generation and semantic search
• Designing secure and governed access to enterprise data
• Authentication, authorization, and access-control considerations
• Orchestrating multi-step workflows across enterprise systems

👉 Takeaway: Learn how to use MCP to securely connect AI assistants and agents with enterprise applications, data, and workflows, enabling intelligent automation, faster access to business information, and scalable enterprise AI solutions.

Pradyumna Kodgi
Principal Product Manager | Oracle Health & AI
IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County
Member, IEEE AI Agentic Systems & AI Policy Committees

📍 California, USA
📧 pkodgi@ieee.org
🔗 linkedin.com/in/pkodgi

EXCOM Meeting for IEEE PES Seattle Officers 

As AI and HPC workloads scale exponentially, traditional network fabrics are hitting a critical bottleneck. Legacy Ethernet simply wasn’t built for the ultra-low latency and zero-loss tolerances demanded by next-generation clusters.  This talk will provide an engineering-first primer on UltraEthernet—the industry’s collaborative answer to modern data center scaling.

Rip Sohan will dissect the architectural gaps of legacy networks, analyze the new data plane building blocks, and unpack the specification’s advanced congestion control and reliability mechanisms. He will also explore how UltraEthernet integrates with existing RDMA ecosystems. Attendees will leave with a definitive mental model of the fabric designed to power the future of compute.

September ExCom

Dr. Stan Trout of Spontaneous Materials will discuss how changing tariffs, domestic sourcing requirements, and global market forces are reshaping the permanent magnet industry and what these trends mean for its future. With nearly 50 years of experience in permanent magnets, magnetic materials, and rare-earth technologies, Dr. Trout is widely recognized as a leading authority in the field.

For more information, see Permanent Magnets, A Material in Flux

What if medical electronics could become virtually invisible – not only conforming seamlessly to the human body but also sensing, communicating, and even interacting with living tissues? Recent advances in graphene and other two-dimensional materials are making this vision possible by enabling a new generation of wearable, implantable, and intelligent bioelectronic systems. Their unique combination of atomic thickness, flexibility, transparency, electrical conductivity, and biocompatibility is fundamentally changing how electronics interface with biology.

In this talk, I will explore how these materials are enabling technologies that were previously impossible. I will introduce graphene electronic tattoos that laminate onto the skin like temporary tattoos to provide long-term, high-fidelity monitoring of electrophysiological, mechanical, and biochemical signals. Applications will include continuous cuffless blood pressure monitoring using bioimpedance, multimodal physiological sensing, and wearable biosensors capable of tracking biomarkers directly from sweat. Beyond the skin, I will discuss the translation of these ultrathin biointerfaces into implantable devices, including transparent graphene arrays for recording and stimulating the heart. These tissue-conformable interfaces enable simultaneous electrical sensing, optical imaging, and optogenetic modulation while opening new opportunities for minimally invasive therapies and next-generation bioelectronic medicine. Finally, I will present our recent work on graphene-based neuromorphic devices that emulate the adaptive behavior of biological synapses with energy efficiencies approaching those of neurons. These systems represent an important step toward intelligent bioelectronics capable of learning from physiological signals, enabling adaptive biosensing, closed-loop therapeutics, and future human–machine interfaces. Together, these examples illustrate how atomically thin materials are driving the shift from rigid electronic devices to bioelectronic systems that integrate naturally with living tissues.

Bi-Monthly ExCom Meeting held on the third Wednesday of every odd month. 

Engineers have an ethical obligation to assure that their designs are reasonable and safe.  While Engineers like to think that their designs are not only technically correct but perfect, the truth is that errors are often made because the engineers either didn’t understand construction practices, hadn’t thought through the design, got sloppy, or were lazy.  James will cover some examples of actual design errors that created unnecessary but costly construction difficulties, put innocent people at risk, or caused deadly, life-altering injuries.   Some of these stories are from James’ own experience; others have been related by engineers who were involved. 

In the past few years, because of high-performance computing (HPC) driven by artificial intelligence (AI) and data centers in this AI era, packaging using glass-core substrates has been attracting lots of traction. For example, among others, Intel’s one-trillion-transistors application processor with glass-core substrate is to be shipped by the end of 2030 (announced September 2023) and TSMC’s chip-on-panel-on-substrate (CoPoS) with glass-core interposer is to be shipped in Q1 of 2029 (announced April 2025). In this lecture, a brief fundamental of through-glass via (TGV) and redistribution-layers (RDLs) of glass packaging will be presented. The advantages and disadvantages of glass, silicon, and organic will be discussed. Panel-level packaging vs. wafer-level packaging and the panel size will also be provided. Finally, the effects of coefficient of thermal expansion (CTE) of glass-core substrate on the solder joint reliability on printed circuit board (PCB) will be presented. Some recommendations will be provided.

Topic: Rocky Reach Dam Tour

Date:  Friday, Sept. 25th, 2026

Time: 10:00am – 12:00pm

Place: Rocky Reach Discovery Center

Agenda:         

10:00 am – Check In, Introductions, Safety Talk

10:30 am – 12:00pm Tour- Fish Passage, Generator and Turbine, Top of Dam, Control Room

12:00pm – 1:00pm – Lunch Rocky Reach Café

1:00 pm – 3:00 pm – On your own tour of the Discovery Center

Visit Requirements:

• This is a hard hat, tour of an operating power plant.  Closed toe shoes, long pants, and sensible clothing are required. Shorts, dresses, sleeveless shirts, tank tops, high heels are not permitted.
• There is a significant amount of standing, walking and climbing stairs on this tour. Attendees must be able to walk at least a mile and climb stairs and must be over 12 years of age.
• You cannot have a pacemaker.
• Fanny packs, bags, purses, etc., are allowed.  Backpacks can be stored at site.
• This is a technical tour for IEEE members and their quests. 

Join us for presentations and networking with the Utah RF, wireless, and microwave engineering community. 

Utah RF & Wireless Day is an annual opportunity to network and learn from Utah's academic and industrial community. The event includes technical presentations, networking time, student posters, vendor tables, and an IEEE Distinguished Lecturer. Sponsored by the Utah IEEE Chapters of APS/MTT/EMC/AES and the University of Utah Department of Electrical and Computer Engineering.

Registration is free.

In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI and its profound impact on our lives.

Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. We will also examine the evolution of AI agents, focusing on autonomous task completion, multi-agent collaboration, and the integration of external knowledge for robust decision-making.

In the realm of Vision and Multimodality, we will explore the integration of text, image, and video understanding, as well as advanced techniques like zero-shot learning and self-supervised learning. Our discussions on MLOps for LLMs will provide insights into best practices for training, deploying, and evaluating large models.

We will also address the critical areas of Knowledge-Grounded Reasoning, On-Device Learning, and the ethical dimensions of AI, including bias mitigation, privacy preservation, and the detection of misinformation.

Talk tracks are broadly classified but not limited to,

This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems.