using https://events.vtools.ieee.org/meetings/xml/0/90/asc/6/OREGON
88083 bytes
9 meetings
- Title:
- OCCS GET Series:AI for Research & Development (AI4R&D): Revolutionizing Innovation and Value Creation in R&D
- Date:
- April 29th
4:00 PM (3 hours) - Location:
- 5270 California Ave
IRVINE, CA - Abstract:
We are excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies (GET) Series, a monthly platform dedicated to exploring groundbreaking trends in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to engage with forward-thinking ideas and cutting-edge advancements.
This month, we dive into the transformative role of AI in Research & Development (R&D). Integrating AI into R&D processes holds immense potential, driving innovation and unlocking trillions in economic value. According to McKinsey, generative AI alone could contribute [vtools-xml.php] url[asc/6/OREGON].6 to .4 trillion annually, with R&D and product innovation among the most significant beneficiaries.
Join us as we explore the AI4R&D model, addressing key challenges in the R&D lifecycle, including:
✅ Managing information overload
✅ Optimizing experiment design
✅ Navigating AI risk management
✅ Overcoming the "Valley of Death" in research commercializationFollowing the widely recognized Technology Readiness Levels (TRLs) framework, we’ll discuss strategies for effectively integrating AI throughout the research-to-commercialization journey to enhance efficiency and maximize value creation.
Attendees will gain insights into how AI can:
🚀 Streamline R&D processes
🤖 Enhance decision-making
💡 Accelerate innovation and commercializationAdditionally, the talk will introduce AI-focused workforce development, explore the future of AI, and provide actionable strategies for implementing AI-powered projects.
📅 Don’t miss this opportunity to stay ahead in the evolving world of AI-driven research and development!
Interested in sharing your expertise in a future session? We are always looking for passionate speakers! Reach out to us at swapnali.karvekar@ieee.org—we’d love to collaborate.
Join us as we learn, innovate, and shape the future of technology together!
- Title:
- Sustainable Innovation: Women Engineers Driving Global Change
- Date:
- April 30th
5:30 PM (1 hour) - Abstract:
The IEEE Women in Engineering Oregon Section Affinity Group presents an inspiring event focused on the vital role of women engineers in advancing sustainable technologies and climate solutions. This event will highlight key innovations in renewable energy, battery storage, carbon management, and clean energy technologies, showcasing how engineers are driving impactful global change.
Through expert discussions and knowledge-sharing, attendees will gain insights into emerging trends in climate tech and eco-friendly innovations. The event also provides a platform for networking and empowering the next generation of engineers committed to sustainability.
- Title:
- IEEE SSCS Oregon Chapter May Meeting and Seminar (Hybrid)
- Date:
- May 6th
5:30 PM (2 hours) - Location:
- Intel Ronler Acres
Hillsboro - Abstract:
IEEE SSCS Oregon Chapter May Meeting and Seminar
Join us for a talk from SSCS Distinguished Lecturer Dr. Alvin Loke from Intel, San Diego, on Tuesday, May 6th, 2025. The seminar will be held from 5:30pm to 7:30pm (PST) in-person. Food and drinks will be provided.
Topic:
The Road to Gate-All-Around CMOS
Abstract:
Despite the much debated end of Moore's Law, CMOS scaling still maintains economic relevance with 3nm finFET SoCs already in the marketplace for three years and 2nm gate-all-around SoCs anticipated late this year. Area scaling extensively driven by design/technology innovations co-optimized for primarily logic scaling continue to offer compelling node-to-node power, performance, area, and cost benefits. In this tutorial, we will start with a walk through memory lane, recounting a brief history of transistor evolution to motivate the migration from the planar MOSFET to the fully depleted FinFET. We will summarize the key process technology elements that have enabled the finFET CMOS nodes, highlighting the resulting device technology characteristics and challenges. This will set the context for motivating the transition to the gate-all-around device architecture, namely nanoribbons or nanosheets, and unveiling the magic of how these devices are fabricated.
Speaker Biography:
Alvin Loke is a Senior Principal Engineer at Intel, San Diego, working on analog design/technology co-optimization for Intel’s gate-all-around CMOS. He has previously worked on CMOS nodes spanning 250nm to 2nm at Agilent, AMD, Qualcomm, TSMC, and NXP. Alvin received a BASc from the University of British Columbia, and MS and PhD from Stanford. After several years in CMOS process integration, he has since worked on analog/mixed-signal design focusing on a variety of wireline links including chiplet IOs, design/model/technology interface, and analog design methodologies. Alvin has been an active IEEE Solid-State Circuits Society (SSCS) volunteer since 2003, having served as Distinguished Lecturer, AdCom Member, CICC Committee Member, Webinar Chair, Denver and San Diego Chapter Chair, as well as JSSC, SSCL, and Solid-State Circuits Magazine Guest Editor. He currently serves as the VLSI Symposium Secretary and SSCS Global Chapters Chair. Alvin frequently speaks on CMOS technology and its impact on analog design, having authored invited publications including the CICC 2018 Best Paper and short courses at ISSCC, VLSI Symposium, CICC, and BCICTS.
- Title:
- Financial Planning Checklist: The 5 Most Common Mistakes That Will Undo Your Financial Future and What to do About Them
- Date:
- May 9th
12:00 PM (1 hour) - Abstract:
Do you ever wonder if you’re missing something when it comes to maximizing the way you think about and save/invest your money? Wonder no further, Joy Dow is a CFP® (Certified Financial Planner) who has helped over 400 people to optimize their financial road map. She will be guiding us through her “Financial planning checklist.” This exercise helps anyone to identify what gaps, blind spots or inefficiencies might be missing in their plan. Regardless of if you’re just starting out, or you are high income and net worth this session will be impactful for all.
- Title:
- 50 Years of Fiber Optic Sensor Development for Aerospace, Defense, Energy, Civil Structure and Medical Applications
- Date:
- May 9th
5:30 PM (1 hour) - Abstract:
Join the IEEE Photonics Society Chapter for a special webinar with Eric Udd, a pioneer in fiber optic sensing technology. This talk will highlight key milestones from the past 50 years—spanning aerospace, defense, energy, civil infrastructure, and medical applications. Learn how innovations in fiber optic sensors for measuring rotation, strain, acoustics, pressure, and more have transformed multiple industries. Real-world case studies and insights from decades of research and development will be shared.
- Title:
- IEEE Oregon May 2025 Excom In-Person Meeting
- Date:
- May 13th
6:30 PM (2 hours) - Location:
- Fourth Avenue Building
Portland - Abstract:
This will be an in person event at PSU
We'll be in PSU so plan accordingly for parking and finding the room.
Dinner will be provided
Agenda:
6:30 Eat/Socializing
7:00 Start of Business meeting
8:30 End of Business meeting
- Title:
- Women in Tech: Shaping the Future of Engineering and Innovation
- Date:
- May 19th
5:30 PM (1 hour) - Abstract:
Join us for an inspiring session of Women in Tech: Shaping the Future of Engineering and Innovation, hosted by the IEEE Women in Engineering Oregon Section. This event celebrates the remarkable achievements and transformative influence of women leaders who are driving the next wave of technological advancements.
- Title:
- IEEE SCV WIE AI Summit 2025
- Date:
- May 21st
4:00 PM (4 hours) - Location:
- SC9
Santa Clara, CA - Cost:
- Admission fee may apply
- Abstract:
- IEEE SCV WIE AI Summit 2025
In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI and its profound impact on our lives.
Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. We will also examine the evolution of AI agents, focusing on autonomous task completion, multi-agent collaboration, and the integration of external knowledge for robust decision-making.
In the realm of Vision and Multimodality, we will explore the integration of text, image, and video understanding, as well as advanced techniques like zero-shot learning and self-supervised learning. Our discussions on MLOps for LLMs will provide insights into best practices for training, deploying, and evaluating large models.
We will also address the critical areas of Knowledge-Grounded Reasoning, On-Device Learning, and the ethical dimensions of AI, including bias mitigation, privacy preservation, and the detection of misinformation.
Talk tracks are broadly classified but not limited to,
1. Large Language Models (LLMs) & Foundation ModelsEfficient Fine-tuning of LLMs for Low-Resource Languages, LLM Alignment & Instruction-Tuning: Challenges and Advances, Scaling Laws: Understanding Model Size vs. Performance, Multilingual and Cross-Lingual LLM Adaptation, Memory-Augmented LLMs: Enhancing Long-Term Context Understanding, LLMs as Knowledge Bases: Reasoning and Fact-Checking
2. AI AgentsAutonomous AI Agents: Leveraging LLMs for Task Completion, Multi-Agent Communication & Collaboration in NLP, Self-Reflective AI: Reflexion and Self-Improvement in Language Models, Hierarchical & Modular AI Agents: Towards Scalable Systems, LLMs as Orchestrators: AI Workflows with Task-Specific Agents, Grounding LLMs in External Knowledge for Robust Decision-Making
3. Vision & MultimodalityVision-Language Models (VLMs): From CLIP to GPT-4V, Multimodal Agents: Integrating Text, Image, and Video Understanding, Spatial and Temporal Reasoning in Vision-Language Models, Zero-Shot and Few-Shot Learning in Multimodal AI, Self-Supervised Learning for Multimodal Representations, Evaluating Multimodal Models: Metrics & Benchmarks, Neurosymbolic Approaches for Language and Vision Tasks
4. MLOps for LLMsLLMOps: Best Practices for Training & Deploying LLMs, Efficient Inference for Large Models: Pruning, Quantization & Distillation, Retrieval-Augmented Generation (RAG): Enhancing Context Awareness, Memory and Context Window Expansion: Architectures & Trade-offs, Evaluation Metrics for LLMs & Conversational Agents
5. Knowledge-Grounded & ReasoningLLMs for Automated Theorem Proving & Scientific Discovery, Commonsense Reasoning in AI Agents, Symbolic vs. Neural Reasoning, Interpretable Models: Improving Explainability in LLMs, Unifying Knowledge Graphs and LLMs for Structured Reasoning
6. On-Device Learning for LLMs and Multi-Modal AIOn-Device LLMs & Edge AI for Language Processing and Multimodal Applications, Security, Privacy & Ethical Considerations for On-Device LLMs 7. Ethics, Bias & FairnessBias Mitigation in Large Language Models, Hallucination Detection & Control in LLMs, Privacy-Preserving NLP: Federated Learning & Differential Privacy, AI and Misinformation: Detecting Deepfakes & Generated Content, Ethical Considerations in Deploying NLP for Real-World Applications
- Title:
- DLP Talk: Tailoring Light with 2D/3D Photonic Integrated Devices
- Date:
- June 13th
5:30 PM (1 hour) - Abstract:
Join the IEEE Photonics Society Chapter for an engaging technical talk on the latest advancements in photonic integration. This session will explore cutting-edge research in manipulating complex light fields using both 2D silicon-based and 3D fs-laser inscribed photonic integrated circuits.
The speaker will present recent developments in multi-dimensional light field control—covering amplitude, frequency, time, polarization, and spatial structure—and their applications in optical communications, sensing, metrology, quantum computing, imaging, and more. The talk will conclude with insights into future directions and emerging opportunities in the field.
Don’t miss this opportunity to learn about the transformative potential of 2D/3D photonic integrated devices across a wide range of technologies.
9 meetings. Generated Monday, April 28 2025, at 5:15:56 AM. All times America/Los_Angeles