Summary

The IEEE Electronics Packaging Society (EPS) is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.

Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among its members and others and with special attention of such aims within the field of interest of the Society.

The EPS promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations.

In Oregon, the focus is mainly on IC and PCB design and packaging, therefore this chapter is joint with the Circuits and Systems Society.

Contacts

• Chair: Howard Heck, This email address is being protected from spambots. You need JavaScript enabled to view it.
• Vice Chair (EPS): James Morris, This email address is being protected from spambots. You need JavaScript enabled to view it.
• Vice Chair (CAS): Malgorzata Chrzanowska-Jeske, This email address is being protected from spambots. You need JavaScript enabled to view it.
• Secretary: Edward Perkins, This email address is being protected from spambots. You need JavaScript enabled to view it.
• Treasurer: Lee Oien,This email address is being protected from spambots. You need JavaScript enabled to view it.
• Member-at-large: Chuck Bauer, This email address is being protected from spambots. You need JavaScript enabled to view it.

Meetings

Chapter meetings are posted in the Oregon Section vTools listing.

Past Presentations

See

Attachments:

Fjelstad Sept 2013 Aluminum Substrates	6137 kB
Lee Nov 2013 CPMT DL Lecture	7504 kB