The University of Utah and Western Electricity Coordinating Council (WECC) are co-organizing the 2026 International Conference on Probabilistic Methods Applied to Power Systems (PMAPS2026) at the University of Utah campus in Salt Lake City, Utah, on September 21-24, 2026. This premier international power grid reliability conference focuses on "Reliable Power Grids in the Age of AI and Large Loads", and features tutorials, and prominent plenary speakers from across the U.S. discussing challenges and solutions for grid reliability and resilience. The program also features power and energy career fair, bringing together industry and many students from across the country. More information about the conference and program: https://pmaps2026.utah.edu/program-at-a-glance/

IEEE Power and Energy Society (PES) and IEEE PES Utah Chapter proudly sponsor this premier conference and are excited to offer discounted registration rate for IEEE members in Utah. Please use code ieeeutah during registration to take 40% off your registration fee: https://pmaps2026.utah.edu/registration/

Note that early bird registration ends on August 21, 2026.

Monday, September 21, 2026

5:30pm – 7:30 pm

 IEEE Consultants' Network: SEPTEMBER 2026 Meeting ("Home Base")

"Use and Deployment of AI Specialists”

Matthew Zimmer, MSME, MBA
Systems Engineer | AKA “The A.I. Penny Pincher”

TOPIC:
AI is a general-purpose technology, but it's already produced specialists — practitioners so fluent that the gap between them and a motivated beginner is wider than most people realize, and widening daily. We'll look honestly at where the real value lives, why meaningful results come from partnering rather than going it alone, and which skills and mental models non-specialists need to leverage what they can and hold a credible conversation with the people handling the rest.

LOCATION:
Leucadia Pizza UTC / La Jolla
7748 Regents Rd
San Diego, CA

Menu: https://leucadiapizza.com/menus/utc

COST: 
Free, but you are responsible for your own food/drinks/gratuity
          Order at the counter

 PARKING:
Ample parking in front of restaurant

Are you on our LinkedIn group?

Meetup Link for this meeting: https://www.meetup.com/san-diego-ieee-meetup/events/315979654/

We are organizing part7 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.

RESCHEDULED from JULY 28

“Preparing for 100% Clean and Renewable Energy Systems”

with Dr Ahmed Mousa, Chief Innovation Officer for Galileo Group, Inc.

Date/Time: Tuesday, September 22, 6pm – 7 pm Pacific Time

Abstract:

This talk will outline the characteristics of 100% clean and renewable energy systems, and how we can prepare for them, considering the guidelines of IEEE Planet Positive. Utilities must supply critical leadership in addressing climate change, sustainability, socioeconomic issues, and environmental stewardship. The transition to a sustainable future requires balancing today’s short-term needs with future planning for 100% clean and renewable energy systems. Issues include global collaboration, the role of inverter-based resources, climate change mitigation, large load vs. energy efficiency/load management and the future role of energy control centers. Supporting equity and inclusion mandates planning for rural electrification and for providing affordable power to disadvantaged communities.

The IEEE Global Career Fair 2026 brings together job seekers, employers, industry leaders, IEEE members, students, and young professionals from around the world for a global virtual recruitment and career-development experience.

Taking place 23–24 September 2026, the event follows a follow-the-sun format, creating opportunities for participants across the Asia-Pacific, Europe, Middle East and Africa, Latin America, Canada, and the United States to participate during their respective time zones.

Throughout the 24+ hour experience, participants will be able to:

• Meet recruiters and hiring organizations through interactive virtual employer booths.

• Explore internships, graduate opportunities, and experienced professional roles across engineering, technology, computing, energy, AI, semiconductors, communications, manufacturing, aerospace, and other sectors.

• Engage directly with recruiters through live chat and virtual networking features.

• Attend live sessions, panels, employer presentations, and career-development programming featuring industry and IEEE leaders.

• Explore opportunities beyond their own geographic region and connect with organizations recruiting globally.

• Build career readiness through programming focused on workforce trends, emerging skills, professional development, and the future of work.

IEEE Virtual Career Fairs are designed to reduce geographic barriers and make meaningful interaction between employers and engineering talent more accessible. The virtual environment provides employer booths, networking and meeting spaces, recruiter interaction, résumé and job information, and a broader agenda of talks and workshops for participants.

The IEEE Global Career Fair builds upon IEEE's regional Virtual Career Fair initiative and expands that model into a coordinated global experience — connecting talent with opportunity across regions, industries, and time zones.

One global event. Multiple regions. 24+ hours of opportunity.

Who Should Attend?

• Job Seekers: IEEE members and non-members, students, recent graduates, young professionals, experienced professionals, and engineering and technology professionals exploring new career opportunities.

• Employers/Companies: Companies and organizations seeking engineering and technology talent across career levels, disciplines, industries, and geographic regions.

• IEEE Community: IEEE Regions, Sections, Societies, Councils, Student Branches, Young Professionals groups, Women in Engineering groups, and other IEEE Organizational Units interested in supporting workforce development and industry engagement.

Learn More & Register: https://careerfair.ieee.org/global

>> Job Seekers: Register to attend, prepare your résumé, explore participating employers, and join the Global Career Fair from anywhere in the world.

>> Employers: Participate as a recruiting organization and connect with IEEE’s global community of engineering and technology talent.

The officers of the Oregon/SW Washington Chapter of the Industry Applications Society invite you to join us Wednesday evening, September 23, 2026, for our dinner, meeting, and technical presentation.  We appreciate the support of all who attend our dinners and presentations.  We will be meeting at our “home base” MEGI Engineering in Lake Oswego. This location is easy to access by car from the Interstate 5 Kruse Way/Lake Oswego exits. Ample free parking and entrance at the West side of the building.

 The cost for dinner is with food from QDOBA Mexican Eats. There is no charge to attend the presentation only.  Our IAS Chapter always offers free dinners for local PSU, OSU, George Fox, U of P, OIT and WSUV Electrical Engineering Students who attend our meetings. This is an excellent networking opportunity for students as our meetings are attended by many professionals in consulting, industrial engineering, and electrical equipment manufacturing.

Abstract: Gallium Nitride (GaN) is a material that does not exist in nature and along with alloys made by mixing it with Indium Nitride and/or Aluminum Nitride spans the spectrum from the infrared {InN (Eg (bandgap)0.7eV)} to the UV {AlN (Eg=6.2eV)}. This explains its applications form red-blue-green displays to solid state white lighting to UV emitters for sterilization applications as an examples. GaN also has remarkable electronic properties with electron mobilities greater than 2000 cm2V-1s-1 with attendant large charge densities. Its breakdown electric field is 3MV/cm which 10X that of Si. The ability of the material to simultaneously deliver large currents at high voltages with low dissipative resistance makes it a preferred RF power source from 1GHz to 130GHz (and beyond) and also the choice of delivering high frequency power conversion in compact form factors for laptop and mobile phone chargers, PV inverters, data server power supplies and EV chargers. This talk will cover these 3 domains of applications: a minimum 3 slices of pizza kinda talk.

This presentation provides a comprehensive overview of transmission line protection systems, GPS clock synchronization, and fiber-optic communication used in modern electrical power transmission networks. These three technologies work together to protect electrical equipment, detect and isolate faults quickly, maintain system stability, and provide accurate information for monitoring and analysis.

The first part of the presentation focuses on transmission line protection systems. It explains the purpose of protection systems and how protection relays identify abnormal conditions such as short circuits, phase-to-phase faults, phase-to-ground faults, and other electrical disturbances. Different protection methods, including overcurrent, distance protection, differential protection, and directional protection, are introduced. The presentation also explains how protective relays communicate with circuit breakers to disconnect the faulty section of a transmission line while allowing the healthy portions of the power system to continue operating.

The second part discusses GPS clock synchronization and its importance in power-system protection and control. Modern substations contain many intelligent electronic devices, protection relays, fault recorders, and monitoring systems that need a common and highly accurate time reference. GPS-based timing systems provide synchronized time to these devices so that events occurring at different locations can be accurately compared. This is particularly important for fault investigation, sequence-of-events recording, disturbance analysis, synchrophasor measurements, and system-wide event coordination. The presentation will also explain how GPS time signals are distributed within a substation using technologies such as IRIG-B, Precision Time Protocol (PTP), and other timing interfaces.

The third part covers fiber-optic communication connections used between substations and protection equipment. Fiber-optic cables transmit information using light rather than electrical signals, providing high-speed and reliable communication over long distances. They are especially useful in high-voltage environments because they provide electrical isolation, immunity to electromagnetic interference, high bandwidth, and reliable data transmission. The presentation will introduce common fiber connections and explain how fiber links can be used for relay-to-relay communication, teleprotection, SCADA, substation automation, and communication between control centers and substations.

Megha Bhardwaj  is a Professional Engineer licensed in Texas and North Carolina and a Senior Electrical Engineer specializing in power systems, grid modernization, protection and control, and substation engineering. With more than 10 years of experience in the electric power industry, she has led engineering design, project management, protection system modernization, commissioning, and technical execution for major utility and energy infrastructure projects.

Her technical expertise includes transmission line protection, protective relays, high-voltage substations, protection coordination, power system studies, SCADA integration, smart grid technologies. Megha has led engineering activities for transmission substations ranging from 69 kV to 345 kV and has worked on projects involving protection system upgrades, relay modernization, utility infrastructure, generation facilities, and renewable energy integration.

Throughout her career, Megha has supported major utilities, energy companies, and power organizations, providing engineering leadership for complex electrical infrastructure projects. Her experience includes developing and modernizing transmission protection schemes, leading multidisciplinary engineering teams, managing utility-scale battery energy storage projects, performing protection and coordination studies, and supporting construction, commissioning, and field implementation.

Megha is also an active leader within the IEEE community. She is an IEEE Senior Member and has held leadership positions with IEEE Region 5 and the IEEE Houston Section. She serves as Program Vice Chair for IEEE Region 5 – Houston Section, Secretary of the IEEE Power & Energy Society (PES), Houston Section, and Past Vice Chair of IEEE Women in Engineering (WIE), Houston Section. Through these roles, she contributes to technical programming, professional development, engineering education, mentorship, and initiatives that support the advancement of the power and energy engineering profession.

The rapid growth of AI is driving increasingly large and complex infrastructure deployments. While GPUs and accelerators receive much of the attention, bringing AI infrastructure into production involves a much broader challenge. Compute, networking, firmware, hardware controllers, security validation, and provisioning services must all work together reliably before an AI workload can run.

Drawing from real-world experience designing and operating hyperscale cloud infrastructure, this talk explores what happens behind the scenes when AI infrastructure is provisioned and prepared for production. It examines why provisioning at scale becomes a distributed systems problem, where hardware heterogeneity, dependencies, partial failures, version drift, and recovery can significantly affect reliability and operational efficiency.

The session will share practical engineering patterns for addressing these challenges, including dependency-aware orchestration, safe parallel execution, idempotent workflows, hardware and firmware validation, observability, failure isolation, and resilient recovery. It will also explore how these patterns help infrastructure teams move from simply automating individual tasks toward building reliable lifecycle systems that can operate across large heterogeneous fleets.

Rather than focusing on a specific cloud provider or technology stack, the talk presents practical lessons and architectural principles that engineers can apply when designing and operating reliable AI and cloud infrastructure at scale.

Arun Anbumani is a Principal Engineer at Oracle Cloud Infrastructure (OCI), where he designs and operates large-scale cloud infrastructure supporting AI and enterprise workloads. His work focuses on distributed systems, infrastructure provisioning, platform reliability, and automation at hyperscale. Arun is an IEEE Senior Member and also contributes to the broader engineering community through technical writing and conference reviewing.

IEEE San Diego 2026 Wi-Fi workshop: Wi-Fi 8, Wi-Fi 9, and Beyond

Venue Host - Qualcomm Building AZ Auditorium, Friday 09/25

The workshop brings industry leaders from companies including Qualcomm, Huawei, Intel and Nokia to share insights on Wi-Fi 8 and Wi-Fi 9, including latest development, standards, products, commercialization and the eco-system. It also projects the future technological directions of Wi-Fi. 

Organizing Committee

Executive Chair:  Zhensheng Zhang

General Co-Chairs: Liangping Ma, Upkar Dhaliwal 

Program Chair: Dell Kronewitter

Treasure: Zhensheng Zhang

Local Arrangement: Somsubhra Barik

Registration

Registration is required to attend. 

IEEE Communication Society  Members, Qualcomm Employees, Invited Guests, IEEE Students, San Diego IEEE Excomm Members:  free

Other IEEE members.  

Non-IEEE members.      

The IEEE ASU ComSoc Student Branch Chapter is dedicated to fostering an active community of students and researchers passionate about communications, networking, and emerging wireless technologies. Our mission is to create a dynamic environment for professional development, mentorship, and technical exchange. As a core part of this mission, we host a Keynote Speech Series featuring distinguished leaders whose work informs and inspires our members. These sessions are designed to bridge the gap between cutting-edge research and industry practice, providing our student community with direct access to the visionaries shaping the future of connectivity.

Global data center power demand is forecast to rise by 160% to 165% by 2030, with AI driving the majority of this surge. By 2030, worldwide electricity use by data centers is expected to reach 945 TWh. By 2035, demand is projected to soar further to 1,300 TWh globally, with AI making up 70% of total data center power.

Nuclear power reactor is considered to be one of the most viable solutions to fulfill this surge in energy demand caused by AI. 

In this talk, we will have 3 sections: 

1) Dr. Saeed Manshadi will speak about the impact of AI data centers on the Utility Grid. 

2) Next, Mr. Vidya Rangaswamy will talk about the Architecture of the Power Converters used in the Power Supply for the AI Data centers. 

3) Main topic - Nuclear Power solution as power source for AI data Centers. In that Dr. Vivek Lall will examine what is the current state of nuclear power generation, what is the projected growth, cost involved and comparison with conventional energy solutions and alternate energy sources such as Solar and Wind

Join us for an empowering evening celebrating women leaders in technology during Glendale Tech Week! 🚀

The event includes a discussion panel and networking!

📅 Date: Friday September 25, 2026 ⏰ Time: 5:30 PM – 7:30 PM 📍 Location: 505 N Brand Blvd, Ground floor, Glendale, CA 91203🌟 Speakers:

👩‍💼 Shake Babujyan — Project Manager at Burns Engineering, Inc.

👩‍🔬 Pandora Ovanessian — CIO | Fractional CIO | Tech & Business Transformation Advisor

👩‍💻 Kristen Haines — CEO, MailCon | CE & SPO, Phonexa

🎤 Moderator: Araksiya Nadjarian — CEO, ConnectTo Communications

This inspiring panel will spotlight women paving the way in tech, leadership, and innovation. Don’t miss your chance to connect, learn, and grow with industry trailblazers. 🌍💡

👉 Scan the QR code on the flyer to register!

✨ Co-Sponsored by: • IEEE Young Professionals • IEEE Women in Engineering (WIE) San Fernando Valley Chapter

Legal Disclaimer:

This event is part of Glendale Tech Week (GTW), taking place September 23–26, 2026, which serves solely as a platform for independent event organizers to promote and host their own events. GTW is not the host or organizer of any individual event listed during the week.

By registering for any event during Glendale Tech Week, you agree to be added to the Glendale Tech email list. GTW may share your contact information with affiliated event organizers based on your expressed interests. You may unsubscribe from the Glendale Tech mailing list at any time.

#Leadership #TechnologyManagement #BusinessManagement #EngineeringManagement

The IEEE Smart Agri-food Systems (SmartAg) Initiative brings together technologies across sensing, AI, connectivity, automation, and data analytics to improve how food is produced, processed, distributed, and consumed. Rather than focusing only on agriculture, SmartAg takes a whole supply chain approach, addressing challenges such as food safety, traceability, sustainability, and waste reduction. This session will highlight key applications, emerging technologies, and opportunities for collaboration that can help build a more efficient and resilient global food system. 

U.S. IEEE Members are eligible for a PDH after watching this webinar. Apply here.

If you have any issues with receiving your PDH or filling out the form, please contact the IEEE Continuing Education Staff at credentials@ieee.org. 

We look forward to your participation in this IEEE-USA webinar. Visit our IEEE-USA Webinar Archive here. Please feel free to email me if you have any questions.

Looking to connect with local energy geeks? Join the IEEE PES Seattle Chapter for food, drinks, and networking at Cascadia Pizza & Brewery in Bellevue! 🍕🍺

When: Oct 1, 2026, from 4:00 PM – 5:30 PM

Where: 1820 130th Ave NE Ste 2, Bellevue, WA 98005 (6 min walk from BelRed Station)

Registration: per person (Registration Required)

Food is on us! Beverages are not included.

IEEE SSCS Oregon Chapter October Meeting and Seminar

Join us for a talk from SSCS Distinguished Lecturer Prof. Jae-sun Seo from Cornell Tech on Friday, October, 2nd, 2026. The seminar will be held from 1:00pm to 2:00pm (PDT) via a Virtual format. Please register for the meeting link and information.

Topic:

Recent Digital Compute-In-Memory Designs with Various Precision/Sparsity Schemes and SoC-level Evaluation

Abstract:

This talk will present the recent landscape of digital compute-in-memory (CIM) designs for AI applications from my research group and the literature. It will feature digital CIM macro chip designs with sparse computing using compressed weights, low-to-high precision support, and different number formats including integer, floating-point, and microscaling. While high energy-efficiencies have been reported at the CIM macro levels, it is important to evaluate the energy-efficiency of CIM based accelerators at the system-on-chip (SoC) level for practical system considerations. We present collective benchmarking framework development efforts for 2D SoC and 3D IC designs, showcasing the benefits and considerations of CIM designs at the system level.

Speaker Biography:

Jae-sun Seo is an Associate Professor at the ECE department at Cornell Tech since July 2023, before which he was an Associate/Assistant Professor at Arizona State University since 2014. He was a visiting researcher at Meta Reality Labs from 2022 to 2023, and he worked at IBM T. J. Watson Research Center from 2010 to 2013.

His research interests include efficient ASIC and FPGA hardware design of machine learning algorithms and neuromorphic computing. Dr. Seo was a recipient of the 2012 IBM Outstanding Technical Achievement Award, 2017 NSF CAREER Award, 2020 Intel Outstanding Researcher Award, and 2022 IEEE TVLSI Best Paper Award. He has served on the technical program committees for ISSCC, ESSERC, ISCA, HPCA, MLSys, DAC, DATE, etc.

Large language models (LLMs) and Generative AI (GenAI) are at the forefront of frontier AI research and technology. With their rapidly increasing popularity and availability, challenges and concerns about their misuse and safety risks are becoming more prominent than ever. In this talk, we introduce a unified computational framework for evaluating and improving a wide range of safety challenges in generative AI. Specifically, we will show new tools and insights to explore and mitigate the safety and robustness risks associated with state-of-the-art LLMs and GenAI models, including (i) safety risks in fine-tuning LLMs, (ii) LLM red-teaming and jailbreak mitigation, (iii) prompt engineering for safety debugging, and (iv) robust detection of AI-generated content.

Mock Interview Panel with Sacramento State Alumni who work at ZGlobal, PG&E, and others.

In an era where AI technologies are rapidly transforming industries and redefining possibilities, it is crucial to explore both the innovations driving this change and the responsibilities that come with it. Today, we will delve into a diverse array of topics that highlight the multifaceted nature of AI and its profound impact on our lives.

Our sessions will cover the latest developments in Large Language Models and Foundation Models, exploring efficient fine-tuning, multilingual adaptation, and the role of LLMs as knowledge bases. We will also examine the evolution of AI agents, focusing on autonomous task completion, multi-agent collaboration, and the integration of external knowledge for robust decision-making.

In the realm of Vision and Multimodality, we will explore the integration of text, image, and video understanding, as well as advanced techniques like zero-shot learning and self-supervised learning. Our discussions on MLOps for LLMs will provide insights into best practices for training, deploying, and evaluating large models.

We will also address the critical areas of Knowledge-Grounded Reasoning, On-Device Learning, and the ethical dimensions of AI, including bias mitigation, privacy preservation, and the detection of misinformation.

Talk tracks are broadly classified but not limited to,

EXCOM Meeting for IEEE PES Seattle Officers 

Our IEEE PES San Francisco / Oakland East Bay (SF/OEB) Chapter invites you to join our post IEEE PES Resiliency Summit Networking session (at the Hilton Union Square) and a delicious 5-course Moroccan dinner & show at Marrakech Restaurant right afterwards. (The restaurant will not be open to the public and registration will be required.) See https://ieee-pes.org/events/2026-ieee-power-energy-society-pes-resiliency-summit/ for more info and separate registration for the Summit. 

Our Networking, Dinner & Show will be co-hosted by our IEEE San Francisco Young Professionals (YP) & Women in Engineering (WiE) affinity groups. Additionally, this event is cosponsored by the IEEE PES Resiliency Summit, IEEE PES Region 6 YP, IEEE PES Women in Power (WiP) and IEEE San Francisco Section. All are welcome but registrations will be limited to seating capacity. 

Networking at Hilton Union Square

4-5pm Moderated Panel: PES Industry Leaders to share about their careers, challenges and excitement for the next generation of engineers.

5-6pm Speed Networking: PES Industry Leaders will move from tables of 6-8 attendees every 10 minutes.

Move from Hilton Union Square a 1/2 block to Marrakech Restaurant

6:30-7:30pm Five Course Moroccan Dinner at Marrakech Restaurant with informal networking

7:30-10pm Georges Lammam Ensemble & Show with the premier Arabic band including violinist & singer Georges Lammam, keyboardist Khader Keileh, Susu Pampanin on tabla & Amina Goodyear on additional percussion. The show will also include two local SF bellydancers Jordone & Maya and open floor dancing! 

Important Note: You do not need to attend the Resiliency Summit to register and attend the Networking events 10/8 4-6pm at the Hilton and 6:30-10pm at Marrakech Restaurant. You can register and attend: 1) the Summit (separate IEEE PES registration at link above); 2) our 10/8 late afternoon/evening local networking event, or 3) both. We do require separate paid registrations through this vTools link for our networking event as our IEEE PES SF/OEB Chapter has booked the entire restaurant and entertainment. Our IEEE SF Section has kindly committed to supporting our networking event for 1/3 the costs, but we still need your support to cover our IEEE SF/OEB PES Chapter costs.

This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems.

Topic: Sparks Museum of Electrical Invention, Bellingham

Date: Saturday October 10, 2025

Time: 9:45am  – 12:00 PM, Mega  Zapper Show and Museum Tour

Place: 1312 Bay Street, Bellingham, WA 98225

Restrictions:  This is an indoor event.

As part of the celebration of the 100th anniversary of the field-effect transistor, the IEEE Electron Devices Society (EDS) Foothill Chapter is honored to welcome Professor Larry Cheng from Oregon State University for a seminar on one of the most exciting emerging directions in semiconductor devices—phototransistor memory.

Phototransistors have long served as highly sensitive light detectors. Today, advances in semiconductor materials and device physics are enabling these devices to integrate sensing, memory, and computation within a single platform. In this seminar, Professor Cheng will introduce the operating principles of hybrid organic-oxide phototransistors and discuss recent advances in programmable phototransistor memories with tunable retention, adaptive forgetting, and neuromorphic functionalities. He will also highlight how these innovations are opening new opportunities for in-sensor intelligence and next-generation computing architectures.

Whether your interests are in semiconductor devices, materials engineering, AI hardware, or emerging computing technologies, this seminar offers an excellent opportunity to learn about a rapidly evolving research frontier from a leading expert in the field.

IEEE OEB-LMAG, 4Q26 Meeting

Visit both the USS Hornet and CA Historical Radio Society Museum!

This is one meeting you won’t want to miss!

Wednesday, October 14, 2026 (11:50 AM to 2:30 PM PDT)

The Oakland East Bay Life Members Affinity Group (OEB LMAG) is hosting an excursion to two historical locations in Alameda CA, including lunch – this is like winning the “daily double”!

Our lunch meeting this quarter will be at the USS Hornet Museum, but those who want to spend more time there can come early (at 11:00 AM) for a free docent guided tour of the famous aircraft carrier that recovered the Apollo 11 Astronauts, and their Apollo Capsule, after the first landing of men on the moon, as well as Apollo 12 a few months later. The ship has 20+ restored vintage aircraft from WWII: Grumman FM-2 Wildcat, TBM-3E Avenger, Cold War & Vietnam Era: F-4J Phantom II, F8U-1 Crusader, F-14A Tomcat, F-11 Tiger (cockpit/nose), TA-4J Skyhawk, S-3B VikingHelicopters: SH-3H Sea King, HUP-1 Retriever, SH-2F Seasprite, UH-34D Seahorse, Modern Era: F/A-18C Hornet.

After lunch, the excursion will continue with a visit to the birthplace of broadcasting:

At the California Historical Radio Society Museum, we be given a tour of the museum that includes a collection that spans about 120 years of radio, wireless communication, and broadcasting history, including vacuum tubes, radios in unusual period casings (snakeskin, neon, even a whisky-bottle design), WWII-era transmitters, CIA com gear, a replica of Amelia Earhart's plane radio, a working telegraph, and vintage televisions (including the largest black-and-white TV ever made) playing classic programs.

Please plan to drive, or car pool, to the USS Hornet, docked at Pier 3 in Alameda:

USS Hornet - Sea, Air and Space Museum, 707 W Hornet Ave, Alameda, CA 94501 https://maps.app.goo.gl/2YRgoVeC5PcNyNN58

Please plan to arrive no later than 11:50, as lunch will be served at noon!

After a leisurely 50 minute lunch, we will depart in the cars we arrived in, and drive to the California Historical Radio Society Museum, about 15 minutes away at:

2152 Central Ave, Alameda, CA 94501 https://maps.app.goo.gl/H15ydMEyjgFxTwUB7

Subsidized fee for OEB Life Members:

We also welcome Non-Members, so please bring your spouse or guest(s):

October ExCom

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, lunch, and refreshments.

Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from IEEE, Eaton, Electrical Reliability Services (a Vertiv Company), ETAP, SEL, and NEMA. Seminar topics will include:

• Overview of IEEE 1547-2018, Standard for Interconnection and Interoperability of distributed energy resources (DER) with Electric Power Systems
• Electrical Design Fundamentals – Circuit Breaker Applications Understood  
• Medium Voltage Cable Installations
• Cable Ampacity and Sizing Fundamentals Generator
• Protective Relaying Fundamentals
• NEMA Resources and the NEMA Standards Store

 Plan to attend this timely, educational Seminar. Registration is now open!

For Group Registrations, please list all attendee email addresses under Special Requests.

***** Early-Bird registration closes on July 3, don’t delay!*****

(Registration is limited to 100 attendees and must be completed on vTools. No walk-in registrations.)

This is the monthly PES chapter's Executive Committee meeting.  Typically, an hour to discuss old business and new business.

We focus on the upcoming events. James Mercier on September 21st. 
Senior member activity, Section Picnic, and Holiday Party, Future City Event. + technical events.

This presentation provides a practitioner’s perspective on power system operations and the role of operations engineering in maintaining the reliability of the bulk electric power system.

Speaker: Daniel Tiang, Manager of Operations Planning at the California Independent System Operator (CAISO), will introduce the role of CAISO and discuss how transmission operations engineers plan for near-real-time system conditions, coordinate transmission outages, support real-time system operators, and perform studies to identify and mitigate reliability concerns.

Dear Exhibitor, this is the page for you to register for a table. Two lunches are included.  Additional lunches can be purchased on the regular attendee page, https://events.vtools.ieee.org/m/568539  The cost for a table is 0.

CLASTECH will be at the Eravant Facility this year.  We will have a 4 speakers on Microwave and Antenna topics.  There will be a box lunch from Panera Bread.

Space is limited - no onsite registration

1- Prof. Nick Miller, Michigan State., "Large-Signal Characterization and Modeling of GaN HEMTs to 100 GHz"

2- Dr. Hasan Sharifi, HRL Director, "Next-Generation Millimeter Wave Phased Array Technology Enabled By 3D Heterogeneous Integration"

3-  Mahmoud Wagih, Ph. D., University of Glasgow, "Making Microwaves Green: From Life Cycle Assessments to Chipless Sensing Solutions"

4- Satish Sharma, Department of Electrical and Computer Engineering San Diego State University, "Multifunctional Antennas and Arrays for Wireless Communications", 

Here is a link about Eravant https://www.eravant.com/ 

EXCOM Meeting for IEEE PES Seattle Officers 

Wideband gap III-V technologies are the backbone of modern high-power RF systems, from base stations to advanced radars. However, as modern architectures demand, achieving the required balance of high efficiency, suitable linearity, and wide bandwidth operation requires more than just standard design. It demands reliable nonlinear device models built on precision and accurate measurement data.

Therefore, advanced and accurate nonlinear modeling of RF diodes and transistors is needed to design improved high-performance circuits, modules, and complete systems. Trapping effects, memory effects, nonlinear parasitic components, scaling requirement, and thermal issues must be considered to extract a reliable device model.

Modern measurement systems enable well-controlled and accurate measurements to collect consistent data in short time. These systems allow multiple measurements without large modifications, such as double RF&DC pulsing, non-50 ohm measurements using modulated signals, vector load-pull at sub-THz frequencies, etc. Then, the innovative device models and modeling tools finalize the process to release a model that will be admired by design engineers.

In this workshop, experienced speakers from industry and academia will share their experiences and insights about III-V device characterization and advanced modeling. Fundamentals of large signal measurements, vector calibration for large signal measurements, calibration verification techniques, modern modeling methods, device size scaling issues, and measurement techniques to analyze nonlinear behaviors, such as trapping, will be covered. In addition to large signal topics, noise modeling of III-V devices will be discussed. The workshop will conclude with a networking session, offering a casual atmosphere to discuss challenges and share ideas about the topics.

Chairs:

• Osman Ceylan, PhD (Maury Microwave, USA)
• Seiya Takashima (Sumitomo Electric Device Innovations, Inc., Japan)

Web page

November Executive Committee Meeting

This 2-day symposium focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging.  This includes failure modes, stress levels, mechanisms, testing schemes, accelerated testing, and environmental stresses.  The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state-of-the-art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliabilit-yrelated aspects: design-for-reliability, manufacturing, reliability modeling and accelerated testing.

Location: In person at UCLA, and over IEEE WebEx
Dates: November 12-13, 2026
Cost: ( for IEEE members, for WebEx) through Oct. 16

IEEE Young Professionals — Connect, Innovate and Lead

The unprecedented growth of artificial intelligence (AI) is fundamentally transforming data center design. Industry initiatives centered around 800VDC power distribution have emerged as a promising pathway to reduce conversion stages, improve energy efficiency, lower copper usage, and support ultra-high-density computing environments. This presentation will examine the technical and economic drivers behind the transition toward Direct Current (DC) data centers, including increasing AI workloads, growing power demands, and evolving sustainability requirements. It will provide an overview of current industry developments, emerging technologies, and architectural approaches. 

Dear Colleagues,

On behalf of the Organizing Committee, I am delighted to invite you to participate in the IEEE International Conference on Smart Connected Systems and Emerging Technologies (IEEE SCSETech 2026), to be held December 1–3, 2026, at CPP Kellogg West, Pomona, California, USA, in a hybrid format (in-person and virtual participation available).

IEEE SCSETech 2026 will bring together researchers, engineers, industry professionals, students, and technology leaders from around the world to explore innovations and emerging trends in:

• Wireless Communication & Networking
• Artificial Intelligence & Machine Learning
• Cybersecurity & Privacy
• Internet of Things (IoT) & Internet of Vehicles (IoV)
• Smart Power & Sustainable Systems

The conference program will feature:

🎤 Distinguished keynote speakers
📄 Peer-reviewed technical paper presentations
🛠 Workshops and tutorials
🎓 Student paper and poster sessions
🏭 Industry presentations and demonstrations
🤝 Networking opportunities, including a Welcome Reception and Gala Dinner

Accepted and presented papers will be submitted for publication in the IEEE Xplore Digital Library, subject to IEEE quality and publication requirements.

Important Dates

• Paper Submission Deadline: July 30, 2026
• Notification of Acceptance: September 6, 2026
• Camera-Ready Submission: October 2, 2026
• Conference Dates: December 1–3, 2026

Whether you are interested in presenting your research, learning about the latest technological advances, networking with experts, or exploring collaborative opportunities, IEEE SCSETech 2026 offers an outstanding platform for professional engagement and knowledge exchange.

For conference information, registration details, and updates, please visit:

🌐 https://www.ieeescsetech.com/

We look forward to welcoming you to IEEE SCSETech 2026.

Sincerely,

Dr. Tamer Omar
Conference Chair
IEEE International Conference on Smart Connected Systems and Emerging Technologies (IEEE SCSETech 2026)

California State Polytechnic University, Pomona
Pomona, California, USA

📧 tromar@cpp.edu
🌐 https://www.ieeescsetech.com/

EXCOM Meeting for IEEE PES Seattle Officers