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74 meetings

Title:
vTools Labs Meeting
Date:
July 15th
1:00 PM (1 hour)
Abstract:

See agenda for details. Registration is optional but will get you a meeting reminder and any updates.

Title:
Region 6 Young Professionals Game Night!
Date:
July 13th
6:00 PM (2 hours)
Abstract:

Join us for a Region 6 Young Professionals Game Night! We will be playing various Jackbox games.

Meet your peers, hang out with old friends.

Discord invite: https://discord.gg/8Pjgu3ju83

Title:
Summer BBQ Picnic
Date:
July 13th
10:00 AM (4 hours)
Location:
2021 NW 190TH STREET
SHORELINE , WA
Cost:
Admission fee may apply
Abstract:

Join us for our annual summer picnic, a fantastic day of fun, food, and networking at Richmond Beach Saltwater Park! This event is the perfect opportunity to relax, connect with fellow members, and enjoy the beautiful summer weather in a picturesque park setting.

Title:
EMBS Executive Officer Meeting
Date:
July 12th
12:00 PM (1 hour)
Abstract:

Meeting to catchup with leadership team, current status, planning for next few months.

Title:
IEEE Hawaii July ExCom
Date:
July 11th
9:30 PM (1 hour)
Location:
2540 Dole Street
Honolulu, HI
Abstract:

Monthly ExCom meeting. All Section members welcome.

Dinner will be provided for per person. Please give cash to Matt on the day of.

 

Title:
IEEE SPS SCV - Multimedia Forensics: Challenges and Opportunities in the Era of Large Models
Date:
July 11th
7:00 PM (1.5 hours)
Abstract:

With the implementation and wide application of related tools such as ChatGPT and Sora, people realized that seeing is indeed no longer believing. More recently, the emergence of diffusion models with powerful generation capabilities has driven this topic forward. Subsequently, as the powerful tools for deepfake generation, corresponding detection technologies continuously evolved hence raising more security concerns of the public. This talk will discuss the development of multimedia forensics and focus on researching four representative deepfake fields: face swapping/face reenactment, talking face generation, and facial attribute editing, as well as forgery and deepfake detection and will finally analyze the challenges and future research directions of the discussed fields.

Title:
IEEE OC Section ExCom Meeting - July 11th 2024, MOVED ON-LINE
Date:
July 11th
6:30 PM (2 hours)
Abstract:

IEEE Orange County Section Executive Committee Monthly meeting - occurs every 2nd Thursday of the month.

All IEEE OC Committee/Chapter/Affinity/SIG Chair/Key Volunteers (or their proxy) are requested to attend. Other IEEE members are also welcome to attend. Please RVSP here to receive the meeting login information. Routine attendance is required to qualify for your chapter annual IEEE rebate.

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

  

Title:
New Frontiers in Integrated Sensing and Communications
Date:
July 11th
6:00 PM (2 hours)
Location:
Global Innovation Exchange
Bellevue, WA
Abstract:

Abstract: In this talk, we focus on the recent developments toward integrated sensing and communications (ISAC). We consider a broad definition of coexistence, which covers ISAC, collaborative communications, and sensing with interference. Toward fully realizing the coexistence of the two systems, optimization of resources for both new/futuristic sensing and wireless communications modalities is crucial. These synergistic approaches that exploit the interplay between state sensing and communications are both driving factors and opportunities for many current signal processing and information-theoretic techniques. In addition, a large body of prior works considers collocated ISAC systems while distributed systems remain relatively unexamined. Building on the existing approaches, the tutorial focuses on highlighting emerging scenarios in collaborative and distributed ISAC, particularly at mm-Wave and THz frequencies, highly dynamic vehicular/automotive environments that would benefit from information exchange between the two systems. It presents the architectures and possible methodologies for mutually beneficial distributed co-existence and co-design, including sensor fusion and heterogeneously distributed radar and communications. The tutorial also considers recent developments such as the deployment of intelligent reflecting surfaces (IRS) in ISAC, 5G systems, passive internet-of-things, and ISAC secrecy rate optimization. This tutorial aims to draw the attention of the radar, communications, and signal processing communities toward an emerging area, which can benefit from the cross-fertilization of ideas in distributed systems.

Title:
2024 Richland Section Annual Picnic
Date:
July 11th
5:30 PM (2 hours)
Location:
South Shelter
richland, WA
Abstract:

IEEE Richland Section 2024 Annual Summer Picnic Thursday July 11th from 5:30 PM to 7:30 PM At Howard Amon South Shelter Join us for a summer social and delicious catered food! No IEEE membership or fee is required Feel free to bring guests BBQ and vegetarian options will be provided RSVP by Monday, July 8th 6pm

 

500 Amon Park Dr, Richland, Washington, United States, 99354

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
July 10th
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Kapili Maui Fundraiser Pau Hana
Date:
July 10th
8:00 PM (3 hours)
Location:
1318 South Beretania Street
Honolulu, HI
Abstract:

Join us for an evening of good pupus and opportunities to network with fellow industry colleagues and friends as we continue to support communities affected by the Maui Wildfires.

Title:
In-Person Distinguished Lecturer: New Frontiers in Integrated Sensing and Communications
Date:
July 10th
6:00 PM (2.2 hours)
Location:
Conference Room(Board Room)
Hillsboro
Abstract:

In this talk, we focus on the recent developments toward integrated sensing and communications (ISAC). We consider a broad definition of coexistence, which covers ISAC, collaborative communications, and sensing with interference. Toward fully realizing the coexistence of the two systems, optimization of resources for both new/futuristic sensing and wireless communications modalities is crucial. These synergistic approaches that exploit the interplay between state sensing and communications are both driving factors and opportunities for many current signal processing and information-theoretic techniques. In addition, a large body of prior works considers colocated ISAC systems, while distributed systems remain relatively unexamined. Building on the existing approaches, the tutorial highlights emerging scenarios in collaborative and distributed ISAC, particularly at mm-Wave and THz frequencies, highly dynamic vehicular/automotive environments that would benefit from information exchange between the two systems. It presents the architectures and possible methodologies for mutually beneficial distributed co-existence and co-design, including sensor fusion and heterogeneously distributed radar and communications. The tutorial also considers recent developments such as deploying intelligent reflecting surfaces (IRS) in ISAC, 5G systems, passive internet-of-things, and ISAC secrecy rate optimization. This tutorial aims to draw the attention of the radar, communications, and signal processing communities toward an emerging area, which can benefit from the cross-fertilization of ideas in distributed systems.

 


Biography

Kumar Vijay Mishra (S’08-M’15-SM’18) obtained a Ph.D. in electrical engineering and an M.S. in mathematics from The University of Iowa in 2015, and an M.S. in electrical engineering from Colorado State University in 2012, while working on NASA’s Global Precipitation Mission Ground Validation (GPM-GV) weather radars. He received his B. Tech. summa cum laude (Gold Medal, Honors) in electronics and communication engineering from the National Institute of Technology, Hamirpur (NITH), India, in 2003. He is currently a Research Scientist at the Institute for Systems Research, The University of Maryland, College Park, under the ARL-ArtIAMAS program; Technical Adviser to Singapore-based automotive radar startup Hertzwell and Boston-based imaging radar startup Aura Intelligent Systems; and honorary Research Fellow at SnT - Interdisciplinary Centre for Security, Reliability, and Trust, University of Luxembourg.

Previously, he had research appointments at the United States Army Research Laboratory (ARL), Adelphi; Electronics and Radar Development Establishment (LRDE), Defence Research and Development Organisation (DRDO) Bengaluru; IIHR - Hydroscience & Engineering, Iowa City, IA; Mitsubishi Electric Research Labs, Cambridge, MA; Qualcomm, San Jose; and Technion - Israel Institute of Technology. Dr. Mishra is the Distinguished Lecturer of the IEEE Communications Society (2023-2024), IEEE Aerospace and Electronic Systems Society (AESS) (2023-2024), IEEE Vehicular Technology Society (2023-2024), IEEE Geoscience and Remote Sensing Society (2024-2025), and IEEE Future Networks Initiative (2022). He is the recipient of the IET Premium Best Paper Prize (2021), IEEE T-AES Outstanding Editor (2021), U.S. National Academies Harry Diamond Distinguished Fellowship (2018-2021), American Geophysical Union Editors' Citation for Excellence (2019), Royal Meteorological Society Quarterly Journal Editor's Prize (2017), Viterbi Postdoctoral Fellowship (2015, 2016), Lady Davis Postdoctoral Fellowship (2017), DRDO LRDE Scientist of the Year Award (2006), NITH Director’s Gold Medal (2003), and NITH Best Student Award (2003). He has received Best Paper Awards at IEEE MLSP 2019 and IEEE ACES Symposium 2019.

Dr. Mishra is Chair (2023-present) of the Synthetic Apertures Technical Working Group of the IEEE Signal Processing Society (SPS) and Vice-Chair (2021-present) of the IEEE Synthetic Aperture Standards Committee, which is the first SPS standards committee. He is the Chair (2023-2026) of the International Union of Radio Science (URSI) Commission C. He has been an elected member of three technical committees of IEEE SPS: SPCOM, SAM, and ASPS, and IEEE AESS Radar Systems Panel. He has been Senior Area Editor of IEEE Transactions on Signal Processing (2024-), Associate Editor of IEEE Transactions on Aerospace and Electronic Systems (2020-), and IEEE Transactions on Antennas and Propagation (2023-). He has been a lead/guest editor of several special issues in journals such as IEEE Signal Processing Magazine, IEEE Journal of Selected Topics in Signal Processing, IEEE Journal on Selected Areas in Communications, and IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing. He is the lead co-editor of three books on radar: Signal Processing for Joint Radar-Communications (Wiley-IEEE Press, 2024), Next-Generation Cognitive Radar Systems (IET Press Radar, Electromagnetics & Signal Processing Technologies Series, 2024), and Advances in Weather Radar Volumes 1, 2 & 3 (IET Press Radar, Electromagnetics & Signal Processing Technologies Series, 2024). His research interests include radar systems, signal processing, remote sensing, and electromagnetics.

   
Title:
Cheers Oceaneers! #3 – w/guest speaker Kevin Hardy: “SEALAB III: The Divers' Story”.
Date:
July 10th
5:30 PM (2.5 hours)
Location:
Leucadia Pizzeria
San Diego, CA
Abstract:

Cheers Oceaneers! #3 – w/guest speaker Kevin Hardy: “SEALAB III: The Divers' Story”.

Welcome to the third episode of monthly meetings for the IEEE Oceanic Engineering Society (OES), San Diego Chapter, which is hosting this meeting jointly along with TMA (The Maritime Alliance) and MTS (Marine Technology Society).

Please join us for networking and friendly conversation about everything oceanic, engineering, science, Blue Tech, and more, while enjoying pizza and drinks.  No need to be an IEEE or OES member, or TMA, or MTS.  Everyone is invited. 

This month, we have a special guest speaker, Kevin Hardy.  See speaker info section for details of presentation and speaker bio. 

 

July 10th, 2024, Wednesday

5:30pm-8:00pm

See agenda section for details.

Note: Monthly every 2nd Wednesday

 

Leucadia Pizzeria & Italian Restaurant

La Jolla / University City

7748 Regents Rd

San Diego, CA 92122

 

The enclosed patio is reserved for our group. 

No ticket required, but please order something for yourself from the restaurant.

The food and drinks are not being funded by the hosts.  Please open your own tab.

 

RSVPs are appreciated, but not required.  In your response, please indicate whether you are member of OES, TMA, and/or MTS.

Title:
IEEE Computer Society Seattle Chapter Speaker Event : Rahul Chaturvedi
Date:
July 10th
5:30 PM (1.5 hours)
Location:
450 110th Ave NE
Bellevue, WA
Abstract:
IEEE Computer Society Seattle Chapter is hosting a Tech Talk by Rahul Chaturvedi at Bellevue City Hall.  In person attendance is limited to the first 30 registrants, so make sure and register early. The presentation will be from 5:30 pm to 6:30 pm, with up to 30 minutes following the meeting for discussion.  Navigating Redis ecosystem: Exploring Scalable Redis Solutions for High Performance & Reliability Redis, a powerful in-memory data store, is renowned for its versatility and performance in handling high-speed data operations. In this talk, we delve into the Redis ecosystem and we will examine the unique challenges and bottlenecks each solution addresses, as well as their advantages in different scenarios. Attendees will gain insights into the decision-making process for selecting the appropriate Redis setup to meet specific performance and reliability requirements, ensuring they can effectively harness the power of Redis for their high-demand applications.  
Title:
IEEE-USA Livestream Webinar: Defeating the Four Horsemen of the Mandated Return to Office: Employee Resistance, Attrition, Quiet Quitting, and DEI Description
Date:
July 10th
11:00 AM (1 hour)
Abstract:

This dynamic session uses case studies drawn from the IEEE community to explore effective strategies to address the challenges of mandated office returns, including employee resistance, attrition, quiet quitting, and maintaining diversity, equity, and inclusion (DEI). We'll dissect the nuanced dynamics of resistance, from overt opposition to subtler forms, and examine attrition trends that see employees seeking new opportunities in response to return mandates. The phenomenon of quiet quitting, characterized by minimal employee engagement, prompts a reevaluation of engagement and inclusivity strategies. A critical focus will be the impact of return policies on DEI efforts, particularly on underrepresented groups who may prefer remote work due to various socio-economic factors. This session offers actionable insights and best practices to navigate these challenges, fostering a thriving and inclusive post-pandemic workplace. All attendees will have an opportunity to receive a complimentary copy of the speaker's best-selling book on which this talk is based, called Returning to the Office and Leading Hybrid and Remote Teams

 

Facebook:  https://bit.ly/webinar-7-10-24-fb
LinkedIn:  https://bit.ly/webinar-7-10-24-li
YouTube:  https://bit.ly/webinar-7-10-24-yt

Title:
Wind Energy: A New Approach for Capturing an Untapped Energy Source
Date:
July 9th
7:00 PM (2 hours)
Location:
567 Yosemite Dr
Milpitas, CA
Abstract:

This event will be available live at SEMI, as well as over Zoom. Get to SEMI by 6:30pm to network – and enjoy great pizza and refreshments! All attendees MUST register using the Eventbrite form (see link).

Although it is very eco-friendly, growth in the wind turbine industry is slowing down. Today’s wind farms generally employ Horizontal Axis Wind Turbines (HAWTs), but their construction involves the major logistical feat of transporting huge blades (as long as 118 meters) to locations that are often remote. However, as HAWTs cannot handle the most turbulent air, they must be placed high above the ground and far apart from one another.

Promising research out of CalTech, Stanford, and other universities predicts that Vertical Axis Wind Turbines (VAWTs), which are placed less than 100 feet above the ground in wind farms under existing HAWTs, will create synergies such that the overall energy output from their simultaneous operation is greater than what each would produce on its own.

Our speaker Kevin Wolf co-founded Wind Harvest International, a new company intending to introduce VAWTs. Their latest prototype has been able to operate in turbulent conditions at the UL test facility in Texas and achieve Technology Readiness Level 7. Core to this turbine’s success is its use of a VAWT aeroelastic engineering model validated using an earlier prototype’s field data. Out of this earlier experience, the engineering team came up with nine new inventions, including an innovative hinge design that is critical for the 70-year predicted fatigue life life based on a typical 15 million rotations per year.

Come to this event and learn about this innovative technology that could revive the wind turbine industry.

Title:
IEEE Alaska - ExCom
Date:
July 9th
7:00 PM (2 hours)
Abstract:

IEEE Alaska Executive Committee Meeting

Tuesday July 9, 2024 ⋅ 6pm – 8pm (Alaska Time - Anchorage)

Robert Posma is inviting you to a scheduled Zoom meeting using the IEEE Alaska Section Account

Join Zoom Meeting
https://zoom.us/j/98832778456?pwd=WnhVWFpOOGQ0YkZEVnlqMlJjWG5lZz09

Meeting ID: 988 3277 8456
Passcode: 269832

 

Title:
IEEE Oregon July Excom (Virtual)
Date:
July 9th
6:30 PM (1.5 hours)
Abstract:

IEEE Oregon July Excom

Title:
IEEE BV Talk: An Overview of Satcom Development and Recent Evolution
Date:
July 9th
6:30 PM (1.5 hours)
Location:
Cal Lutheran Center for Entrepreneurship (Hub101)
Westlake Village, CA
Abstract:

The field of satellite communications (Satcom)  has seen major changes and new developments  in the last few years. Most notably, we are experiencing the emergence of very large LEO (low earth orbit) constellations, major enhancements to space defense, important developments in earth observation as well as the required support associated with the new challenges of space exploration (lunar, planetary etc.)   

The traditional GEO (geostationary orbit) satcom market is facing major changes and challenges. The technical basis of satcom is highlighted and examples of important new architectures and applications are described.

This presentation focuses on non-military applications.

Title:
IEEE Foothill ExCom/OpCom July 2024 Monthly Hybrid Meeting
Date:
July 9th
6:30 PM (2.5 hours)
Location:
2970 Enland Empire Blvd
Ontario, CA
Abstract:

Every second Tuesday fo the month, the Foothill Section held its ExCom/OpCOm hybrid meeting.

Title:
Networking Night - hosted by the IEEE Orange County Section
Date:
July 9th
6:30 PM (1.5 hours)
Location:
Sgt. Pepperoni's Pizza Store
Irvine, CA
Abstract:

Networking Night

hosted by the IEEE Orange County Section

 

Join us for an in-person networking event for meet-and-greet with members of the IEEE Orange County Section.

 

Food will be provided. Register to allow for proper planning.

(Include any dietary restrictions during registration to allow organizers to adjust orders. We'll make an effort to meet your needs, but requests are not guaranteed)

Check out the group photo from our last Networking Night in June on our website: https://r6.ieee.org/ocs/2024/06/report-networking-night-2024-june/

Title:
Careers in Technology Summer Series 2024 - Amanda Alfaro - Leading Development Teams: An Agile Journey
Date:
July 9th
5:00 PM (1 hour)
Abstract:

Leading a development team in an agile environment mirrors guiding the Fellowship of the Ring. Both require a clear vision, diverse skills, strong collaboration, adaptability to challenges, and a foundation of trust and respect. This talk will explore how principles from the Lord of the Rings can be applied to agile practices, illustrating how unity and perseverance drive successful development teams.

Title:
An introduction to Li-Fi; Analysis and review of the new IEEE 802.11 bb standard
Date:
July 8th
5:30 PM (1 hour)
Abstract:

An introduction to Li-Fi; Analysis and review of the new IEEE 802.11 bb standard:

Abstract: We will begin by reviewing a brief overview of the current state of Li-Fi technology, the overall picture of previous Li-Fi systems, and ongoing research and industrial solutions. Then, we will cover the IEEE 802.11 bb PHY standard and its new definitions. This talk will cover the main topics of the standard: channel access, multiplexing methods, wavelength ranges, and TX/RX methods.
Eventually, we will propose Light Links' commercial approach for a hybrid, easy-to-implement Light Communication (LC) system derived from the IEEE 802.11 bb standard with the addition of a MAC layer protocol to enable co-existence with previous IEEE 802.11 standards.

Presenters:

Firouz Vafadari, CEO and founder of Light Links Inc. is a second-year Ph.D. student at UCSC and—the previous founder of a networking company in the Middle East.

Tyler B. Morton, CTO and co-founder of Light Links Inc., is a first-year Ph.D. student at UCSC with internship experience at the U.S. Navy and DoD.

 

Title:
Women in Engineering Leadership Panel: Project Management and Career Advancement
Date:
July 6th
1:00 PM (1 hour)
Abstract:

Join us for an inspiring and empowering virtual panel discussion on Project Management and Career Advancement, part of our celebration for Women in Engineering Day! 🌟. The panel will share their expertise and insights on effective leadership, project management, and career development for women in the engineering sector.

📅 Date: July 6
🕙 Time: 10:00 AM (Hawaii time)
📍 Location: Online

#womeninengineeringday #IEEEWIEDay #WIELead #womenempowerment

#engineer #IEEE #stem

Title:
Caffeinate&Connect: IEEE Young Professionals Networking Hour
Date:
July 6th
10:00 AM (1 hour)
Location:
Saranac Commons
Spokane, WA
Abstract:

Join us for an inspiring morning of professional growth and networking at our "Connect & Caffeinate: IEEE Young Professionals Networking Hour." Whether you're an early-career engineer, a student, or an industry enthusiast, this event provides an ideal platform to connect with like-minded professionals, exchange insights, and stay informed about upcoming IEEE events. Over freshly brewed coffee, we'll discuss exciting opportunities, share ideas, and build valuable networks.

As an added bonus, at the end of the hour, our Young Professionals officers will be hosting their meeting. All attendees are welcome to listen in, learn more about our initiatives, and even get involved in shaping the future of our community.

We look forward to seeing you there as we caffeinate, connect, and collaborate to boost your professional journey!

 

Sponsored by Black Label Brewing Company

Title:
CANCELLED! AI in Public Transit
Date:
July 4th
5:15 PM (1 hour)
Abstract:

This will be an amazing event. 

Title:
Ethics Talk — What is wrong with AI ethics and how do we fix it?
Date:
July 3rd
5:00 PM (1 hour)
Location:
SCDI
Santa Clara, CA
Abstract:

AI ethics are currently being done in a way that rely on methods of idealization—commonly used in ethics and philosophy—both in how individual issues are addressed but also in so far as the ethical landscaped is being distributed into subdisciplines of AI ethics (e.g., ethics of explainable AI and algorithmic fairness). This talk highlights how some of the features of this approach leads to challenges for ethical analysis, based on which he then sketches ways in which AI ethics can respond to these challenges.

Speaker: Dr. Björn Lundgren(vice president of the Int’l Association of Computing & Philosophy)
Title:
IEEE Smart Manufacturing
Date:
July 3rd
9:00 AM (13 hours)
Abstract:

Join us for a session on Smart Manufacturing. What makes a factory Smart? See how automation and robotics play a key role in the seemless operation of a smart manufacturing plant. 

Title:
IEEE CN Smart Cities Riyadh
Date:
July 3rd
7:00 AM (1 hour)
Abstract:

Join us for an intuitive session on Smart Cities Riyadh. How is this Saudi Arabian City excelling in the Smart Cities realm? Find out how this top city is advancing in health, mobility, virtual reality B2B, connectivity and water. 

 

Title:
BEHAWAI'I
Date:
July 2nd
7:30 PM (1 hour)
Location:
Room244, Holmes Hall, University of Hawaii at Manoa
Honolulu, HI
Abstract:

🚀 BEHawaii, a Hawaii nonprofit organization, empowers and elevates Hawaiiʻs people by raising awareness and providing support to create prosperity.

This workshop will present our initiative, the Lei Poina’ole Project, to support the sustainable growth and longevity of Hawaii's lei industry through community partnerships, educational programs, and a network of growers, makers, and vendors.

  • Refreshments provided
  • Lei-making session

#BusinessImprovement #BEHawaii #leiindustry #nonprofit #IEEEIndustry #IEEEWomeninEngineering

 

Title:
Seattle Local Organizing Committee to Support July General Meeting
Date:
July 2nd
5:30 PM (1 hour)
Abstract:

Meeting of all of the Local Organizing Committee Chairs and Support Team Members

Title:
A Hands-On introduction to Large Language Models like Microsoft Copilot Chat and ChatGPT
Date:
July 2nd
5:00 PM (3 hours)
Location:
SCDI
Santa Clara, CA
Abstract:
A three-hour hands-on workshop giving a brief history of the last few months of development of "Generative AI." These generative AI services and these Large Language Models, offer present promise and peril -- disruption -- to ways of working and of learning. Outside the "hype," these tools are "calculators for words" and allow the same manipulation and reflection of a user's words as a calculator offers for a user's numbers. This workshop introduces basic concepts, dispels myths, demonstrates effective prompting techniques, and offers a venue for Q&A around these services, how they work, and how we should use them. We hope to provide a webcast link, but in-person attendance is required for full participation, as is the use of a laptop for full participation in all exercises. Remember: a LLM is "Always confident and usually correct."
Title:
What resources can the IEEE provide?
Date:
July 2nd
3:30 PM (1 hour)
Abstract:

The IEEE recognizes that to attract more members as well as retain current members, we need to provide more benefits that they care about. The Young Professionals group is interested in hearing more from the local members on how we can better serve you. Join Michael Chavez, the Young Professionals of Northern Nevada Chair in learning about options we are exploring including PE preparation, merchandise, professional networking opportunities, and community enhancement.

Afterwords there will be time for questions, comments, and requests for additional programs. This meeting is for your benefit, but if you are unable to make it and would like some basic slides and notes sent your away, or otherwise have ideas you would like to send forward, please send them to Michael.Chavez@ieee.org.

Title:
Planning Life Member activities for rest of 2024
Date:
July 2nd
3:00 PM (1 hour)
Abstract:

This a meeting to plan Life Member events.

Please drop in on this virtual meeting or send email.

eugene.chang@ieee.org

Title:
Comsoc Sister Chapter Program (SCP) lecture series: IEEE senior member/fellow programs: requirements and nominations
Date:
July 2nd
7:30 AM (1.5 hours)
Abstract:

 

In the first part of the meeting, Dr. Zhang will cover the senior elevation process (why becoming senior, senior member requirements, application process, how to find references, how to calculate number of years of experiences, and how to prepare application materials,  etc.).

In the second part,  Dr. Don Tan will cover the Fellow program.  Under Don’s leadership, the IEEE Fellow Committee has planned a full implementation of the BoD approved improvements, particularly specific measures for geographical and technical diversity measures and DE&I. The IEEE fellow grade is a prestigious recognition by the IEEE Board of Directors to a single individual for his or her technical accomplishments and contributions impacting society at large. It commands global acclaim and is a prestigious honor eagerly pursued by individuals worldwide. How do you answer the question then:   Am I qualified to be considered for an IEEE fellow, particularly, as a member from industry? What is the best way to prepare a nomination package? This talk by Dr. Tan will provide a unique perspective from an IEEE Fellow Committee Immediate Past Chair's viewpoint. It aims to demystify the fellow nomination and evaluation process. He will discuss on recent fellow statistics (Particularly those for Region 6 ), nomination package preparation, contribution category selection, references, endorsements, and qualification matrix details. A few samples from past successful nominations will be presented and discussed as well.

Title:
Battery Technologies
Date:
July 2nd
7:00 AM (1 hour)
Abstract:

Analytical Strategies for Battery Reliability and Safety: A Lifecycle Perspective

Ensuring the stability and longevity of batteries is paramount. In this presentation we will dive into the critical points of stability and lifecycle testing which are essential for advancing battery performance and safety.

Hosted by Simon Taylor, Segment Business Development Manager (Battery Technology) at METTLER TOLEDO, this session will explore the significance of thermal stability, electrolyte integrity, and material degradation. Simon leverages over 20 years of experience in analytical chemistry and product management to drive strategic solutions in the battery industry.

We will highlight how Analytical techniques such as Thermogravimetric Analysis (TGA), Differential Scanning Calorimetry (DSC), Karl Fischer titration, pH measurement and UV-Vis spectroscopy are utilized to assess and enhance battery reliability and lifespan. We will also discuss the integration of LabX software in streamlining testing processes, ensuring compliance with industry standards.

Additionally, we will briefly spotlight the new collaboration between ABB Robotics and METTLER TOLEDO, which aims to boost laboratory and at-line testing through enhanced automation, driving efficiency and productivity for customers in rapid scale-up cycles.

This presentation is an excellent opportunity for professionals and researchers to gain valuable insights into the essential aspects of battery lifecycle testing, driving innovation and sustainability in battery technologies.

Join us for a session on battery technologies. What is the best battery type for your application? Battery energy storage systems, cell phones, EV, electric airplanes, data centers, and long haul trucking vehicles. What types of materials make the best battery? What types of batteries have the longest charge? Longest life? most economical $$? Where do old batteries go? How to monitor the health of your battery? Find out this and more today as we take a deep dive into battery technologies. 

Title:
IEEE Battery Technologies
Date:
July 1st
10:00 AM (1 hour)
Abstract:

Join us for a session on Battery Technologies. Find out which battery type and quantity is best for your application. What is the best charge level to keep a battery at? What technologies have the longest battery life? Find out where the industry will be 3-5 years from now. Why are large data centers investing in batteries? What are the components that make-up a battery? Can the astronauts make batteries with the elements on the moon? Find out this and more today at our session! 

Title:
Fostering Inclusive Workplaces: Building a Culture of Diversity and Equality in Engineering through Advocacy and Allyship
Date:
June 30th
9:30 AM (1.5 hours)
Abstract:

IEEE Women in Engineering Oregon Section and Hawaii Section Affinity Group are teaming up to host a dynamic panel discussion a panel discussion titled,  "Fostering Inclusive Workplaces: Building a Culture of Diversity and Equality in Engineering through Advocacy and Allyship ," to celebrate the 2024 IEEE WIE Day.

We, IEEE Women in Engineering Oregon Section and Hawaii Section AG, are dedicated to promoting diversity and inclusion within the engineering community. We believe that creating inclusive workplaces is essential for fostering a thriving and innovative industry through the advancement of AI and 4IR technologies. 

The panel discussion will explore various strategies for promoting diversity and equality in engineering for the advancement of AI and 4IR technologies, with a focus on advocacy and allyship. 

Let’s encourage each other to support the advancement of women in STEM across the globe!

 

Title:
IEEE PES Bay Area Social BBQ at SF Presidio Tunnel Tops
Date:
June 29th
11:00 AM (4 hours)
Location:
Presidio Tunnel Tops
San Francisco, CA
Abstract:

Come socialize with fellow IEEE members at the beautiful SF Presidio Tunnel Tops!  Our IEEE SF PES Chapter is hosting this summer BBQ to bring together members, your family and/or friends. IEEE SF PES will provide the food. Enjoy the sun and toss a frisbee or football and enjoy the amazing Golden Gate Bridge views! Picnic tables are limited to 56 people, so please provide your group count when you register. We look forward to seeing everyone!

Please be advised that the parking lot adjacent to Picnic Place is extremely limited. There are several parking lots in the Main Post area of the Presidio within a short walking distance. Use the address 122 Anza Ave, SF CA 94129 to get to the large parking lot across the street from the Presidio Tunnel Tops. There is also parking near 220 Halleck Street at the intersection of Halleck St and French Ct. Please note that most parking lots in the Presidio charge an hourly fee, which is paid at the kiosk in the lot. 

Picnic Place is easily accessible via public transit! If you are coming via the free Presidio Shuttle, exit the Shuttle at the Presidio Transit Center. 

Title:
OCCS DVP Talk: Facilitating Security and Trust among Multiple Parties through Blockchain Techniques
Date:
June 28th
3:00 PM (3 hours)
Location:
5270 California Ave
Irvine, CA
Cost:
Admission fee may apply
Abstract:

*Hybrid event but in-person attendance encouraged - opportunity to meet and greet the distinguished lecturer as well as local IEEE ExCom members!  

With the prosperity of edge computing, massive users and devices at the network edge are more actively involved in the networks, pushing the information collection, computation, storage, and communications more towards end users. In these more decentralized systems, how to enable efficient and trustworthy interactions among different parties becomes an essential issue. 

Blockchain has been considered as a promising approach to facilitate the establishment of decentralized trustworthy computing systems with non-repudiated information records. For example, Bitcoin has attracted wide attention as a secure and decentralized platform to enable peer-to-peer exchanges of digital currency. Ethereum then generalizes blockchain as a state machine and enables smart contracts, a piece of code that can support complex logic and be self-executed when certain conditions are met. Such generalization enables blockchain to potentially serve as a computing infrastructure and opens new opportunities for blockchain to facilitate secure and decentralized interactions among any parties without making high trust assumptions about them.

In this talk, we will discuss some key characteristics of blockchain and a few promising applications of blockchain that can facilitate security and trust among multiple parties. Some examples include designing a secure and efficient multi-signature scheme to facilitate multi-party approval process on Fabric, an enterprise blockchain platform; applying blockchain to secure software updates for resource-constrained IoT networks; and to facilitate fair trading in transactive energy market.

Title:
IEEE Hawaii WIE Excom - June
Date:
June 27th
8:30 PM (1 hour)
Abstract:

IEEE Hawaii WIE ExCom monthly meeting to discuss future events and initiatives.

Title:
Leveraging RCM to Reduce Operating Costs
Date:
June 27th
5:00 PM (2 hours)
Location:
Washington County Chamber of Commerce
Hillsboro
Abstract:

Our speaker this month will be Micah Rolfe of PdM Specialists. He will be talking about maintaining and improving lab machinery for accuracy, reliability and longevity. Both EMC and Product Safety use large equipment for performing tests, and knowing how and why equipment performance degrades over time can greatly impact how we budget for and approach equipment maintenance, as well as a framework on what to plan for future installations of new equipment. 

Title:
Facilitating Security and Trust among Multiple Parties through Blockchain Techniques
Date:
June 27th
2:30 PM (2 hours)
Location:
Building Q
San Diego, CA
Cost:
Admission fee may apply
Abstract:

*Hybrid event but in-person attendance encouraged - opportunity to meet and greet the distinguished lecturer as well as local IEEE ExCom members!  

With the prosperity of edge computing, massive users and devices at the network edge are more actively involved in the networks, pushing the information collection, computation, storage, and communications more towards end users. In these more decentralized systems, how to enable efficient and trustworthy interactions among different parties becomes an essential issue. 

Blockchain has been considered as a promising approach to facilitate the establishment of decentralized trustworthy computing systems with non-repudiated information records. For example, Bitcoin has attracted wide attention as a secure and decentralized platform to enable peer-to-peer exchanges of digital currency. Ethereum then generalizes blockchain as a state machine and enables smart contracts, a piece of code that can support complex logic and be self-executed when certain conditions are met. Such generalization enables blockchain to potentially serve as a computing infrastructure and opens new opportunities for blockchain to facilitate secure and decentralized interactions among any parties without making high trust assumptions about them.

In this talk, we will discuss some key characteristics of blockchain and a few promising applications of blockchain that can facilitate security and trust among multiple parties. Some examples include designing a secure and efficient multi-signature scheme to facilitate multi-party approval process on Fabric, an enterprise blockchain platform; applying blockchain to secure software updates for resource-constrained IoT networks; and to facilitate fair trading in transactive energy market.

Title:
From Rocks to Chips: What the History of the Transistor Says About the Future
Date:
June 27th
10:00 AM (1.5 hours)
Abstract:

The discovery, then invention, of the transistor sits almost exactly midway between Ferdinand Braun’s discovery of solid-state rectification in 1874 and the modern era of gigascale ICs. As with other epoch-shattering inventions, the story of the transistor isn’t quite as neatly linear as some recountings might suggest. Very few EEs have ever heard of Mervin Kelly, although we all owe our jobs to him. This talk will try to right that wrong, as well as answer questions such as, “What really led Bob Noyce to create the planar integrated circuit?” Retracing some of the steps of the pioneers generates important insights into the nature of innovation, and teaches us valuable lessons about the critical role of a very few visionaries and how “the will to think” can allow luck to prevail. As the 75th (+ epsilon) anniversary of the transistor dovetails with the end of lithographic scaling, we find ourselves on the threshold of a major technological discontinuity. Studying the story of previous ones just might provide us with our best guide to the next.

Title:
Introduction of High-Power Electric Testing Lab: Two 850-MW Electrical Short-circuit Test Generators that Allow Testing up to 100 kA RMS Symmetrical and Up to 230 kV
Date:
June 26th
11:00 AM (1 hour)
Abstract:

S&C's corporate headquarters in Chicago is home to one of the world's leading electrical testing laboratories. Our 20,000-square-foot Nicholas J. Conrad Laboratories (NJC) is well equipped to meet the rigorous testing requirements for electrical equipment; it has two 850-megawatt electrical short-circuit test generators that allow testing up to 100 kA rms symmetrical and up to 115,000 volts. This presentation will focus on the NJC Laboratories High Power Lab Generators, including their design, operation, protection, controls and personnel required to operate them for high power electrical testing.

Title:
IEEE-USA Livestream Webinar: R&D Tax Credits
Date:
June 26th
11:00 AM (1 hour)
Abstract:

The IRS’ definition of R&D and industry’s definition of R&D differ. A large majority of R&D performed in the US is done in the private sector, rather than done by universities and the work that qualifies for R&D Tax Credits is much broader (and more lucrative) than you would think. The program that pays for this R&D work is the Research Tax Credit, which is administered by the IRS. This presentation, R&D Tax Credits for Engineers and Scientists, is a high level basic primer that will teach you what type of R&D work that you already do qualifies for the credit and the general steps required to present your work successfully to the IRS. 

 

Facebook livestream:  https://bit.ly/webinar-6-26-24-fb
LinkedIn livestream:  https://bit.ly/webinar-6-26-24-li
YouTube livestream:  https://bit.ly/webinar-6-26-24-yt

Title:
Recent Advances on Cu-Cu and Hybrid Bonding for Advanced Packaging Platforms and Applications
Date:
June 26th
7:00 AM (1 hour)
Abstract:

Bonding technology is the key to the success of vertical stacking in 3D integration, heterogeneous integration, and advanced packaging applications. Furthermore, developing a bonding technology which can be performed at low temperature becomes significant to avoid the concerns of low thermal budget, low mechanical stress, and high reliability in many applications. Among various bonding technologies, bumpless Cu-based hybrid bonding has become the main solution to the requirement of high speed and density since Cu has its excellent electrical performances, thermal properties, and readiness in the backend and packaging fabrication, as well as cost consideration.
This talk will describe the history and advances of current Cu-Cu bonding, including technology development and solutions of low temperature Cu-Cu bonding. A wetting/passivation technique for room temperature Cu bonding and its mechanism will be presented. Next, hybrid bonding, an enabling technology for fine pitch/size bonding in multiple 3D integration and advanced packaging applications, will be mentioned with its history development. Current Status, challenges and their solutions, such as fine pitch, warpage, and mechanical and thermal stress, to reach hybrid bonding will be discussed. Finally, applications and recently developed platforms based on hybrid bonding with be introduced.

Title:
Advancing Network Sustainability - Challenges and Solution Approaches
Date:
June 25th
5:30 PM (1 hour)
Abstract:

Title: Advancing Network Sustainability - Challenges and Solution Approaches

Reducing humankind’s carbon footprint and greenhouse gas emissions to slow climate change is one of humanity’s Grand Challenges. Communication networks play a key role in addressing that challenge, enabling applications that reduce the need for physical travel as well as solutions that optimize efficiency of resource and energy usage. Examples range from teleworking to remote operations, from smarter agriculture to more energy-efficient factory floors. However, for all their benefits, networks also have a significant environmental footprint themselves that collectively rivals that of entire countries. It is thus becoming important to make networks themselves "greener" and devise solutions that allow networks to be operated in ways that make them more sustainable while continuing to meet increasing traffic demands and service requirements.
Many of today’s network sustainability improvements relate to general advances in energy efficiency of computing hardware as well as in transmission technology (antennas, lasers). While this is where arguably the biggest opportunities lie, the question arises regarding the role that other layers in the networking stack can play in advancing network sustainability. For example, can data planes be designed in ways that make them inherently more energy-efficient? What protocol advances might enable greener networking solutions? How can networks be optimized not just for QoS or utilization but for carbon and what novel tools are needed to operate networks more sustainably? How can we even properly account for energy usage and other sustainability parameters to be optimized? In which ways can network programmability, faster control loops, and AI- or intent-based networking help?
This presentation will provide a brief introduction into network sustainability and discuss some of the key challenges that solutions need to address. A number of solution approaches will be presented and opportunities for further research and engagement on this topic pointed out. The presentation will draw on some of the activities that are currently taking place in the IETF and the Internet Architecture Board's E-Impact program.


Bio: Dr. Alexander Clemm is a recognized expert in network management technology and networking software in which he has been involved throughout his career. His most recent activities have been in the areas of sustainable networking, future networking services, intent-based networking, service assurance, and telemetry. After 7+ years as a Distinguished Engineer at Futurewei and prior to that 18 years at Cisco, he recently decided to pursue an academic sabbatical and embark on new adventures. Alex has for many years been regularly serving on the committees of IEEE conferences, including NOMS/IM and NetSoft as a member of the steering committee and on several occasions as general co-chair or TPC co-chair. He is the recipient of the 2020 Salah Aidarous Award given by IEEE CNOM and IFIP TC6.6 to "an individual who has provided unremitting service and dedication to the IT and Telecommunications Network Operations and Management community." Alex has an extensive publication record including 70+ papers, 70+ patents, and 15 RFCs. He holds an M.S. degree from Stanford University and a Ph.D. from the University of Munich, Germany, both in Computer Science.

Title:
MOVE Tech Talk - Jun 2024 - Emergency Radio systems, Interoperability, and the NC VIPER Radio System
Date:
June 25th
5:00 PM (1.5 hours)
Abstract:

In today's dynamic and fast-paced operational environments, effective communication is paramount. This training session aims to elevate the MOVE team's radio communication skills by delving into key concepts and systems that enhance interoperability and operational efficiency.

Objectives:

  1. Understanding Interoperability:
  2. Introduction to P25 Standards:
  3. VIPER System Overview:
  4. Effective Radio Communication Techniques:
  5. Practical Applications and Scenarios:
Title:
IEEE UFFC Seattle Tech Talk - Ultrasound and Microbubbles for Anticancer Drug Delivery (June 25)
Date:
June 25th
3:00 PM (1.5 hours)
Location:
William H. Foege Hall
Seattle, WA
Abstract:

The Seattle Chapter of the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society (UFFC-S) aims to provide UFFC-S members with opportunities for professional and personal growth as well as network with the local, vibrant UFFC community.

Dr. Ayache Bouakaz, PhD will be our guest speaker.  Dr. Bouakaz is Director of Research at the Imaging & Brain Institute of the Institut National de la Santé et de la Recherche Médicale (INSERM) in Tours, France.  His research focuses on imaging and therapeutic applications of ultrasound.  He is a prolific author and inventor.  He is notably the IEEE UFFC Distinguished Lecturer for 2023-2024.

Dr. Bouakaz will present on "Ultrasound and microbubbles for anticancer drug delivery: From physics to clinics." 

This meeting will be co-sponsored by the University of Washington in Seattle and the IEEE UFFC Seattle Chapter. The University of Washington will host this event. Please register so that organizers can plan accordingly. 

NOTE: Dr. Bouakaz will be in the Seattle area for two nights. On June 24th he will present at Philips Healthcare in Bothell. On June 25th he will present at the University of Washington in Seattle. Feel free to attend either or both events.

Title:
IEEE SF PES AdComm Meeting
Date:
June 25th
12:00 PM (0 minute)
Abstract:

Final planning for our 6/29 Social BBQ at SF Presidio Tunnel Tops

Title:
Every Day Engineers Celebrate Women in Engineering (WIE) Lunch and Learn Virtual
Date:
June 25th
12:00 PM (1.0 hour)
Abstract:

Every Day Engineers discuss their engineering roles, achievements, and how engineering has changed your own perspective on life.  Additional discussions will identify obstacles that must be overcome for more women and minorities to enter the field along with real-world ways to reduce external barriers.

Panel members:

Michelle Mountain Thompson, CEO Open Research & San Diego IEEE Section Chair

Kenz McManus, a Senior. Electrical Engineer at Tandem Diabetes Care

Neha Goel, a Senior. AI Innovation Engineer at Microsoft

Sam Litvin, is the CEO of LEHI Partners and Educator in the local San Diego area. 

Michelle Thompson, completed an MSEE from USC in Information Theory while working at Qualcomm Incorporated. Her interest in microwave circuit design was sparked by the wide variety of practical circuit designs in amateur radio. Michelle has a long volunteer career at IEEE ranging from Student Branch Officer to San Diego Section Chair. She founded the San Diego Chapter of the Information Theory Society in 2020 and the Open Source Digital Radio local group in 2023. Her IEEE work focuses on industry involvement and citizen science.  She was a Distinguished Visitor for IEEE 2019-2021 and received the Don Hilliard award in 2018. Michelle is founder and CEO of Open Research Institute, a non-profit R&D firm that publishes Open Source work to the general public. She is responsible for major regulatory reform in the amateur satellite service. She represents ORI on the FCC Technological Advisory Council, is a Technical Specialist and Technical Advisor for ARRL, and she also serves as the Vice President of an independent telephone company in rural Mississippi.

Kenz McManus is a Senior Electrical Engineer.

Kenz earned honors while quadruple-majoring in science and engineering at Gonzaga University where they earned Bachelors of Science in Electrical Engineering, Computer Engineering, Physics and Mathematics-Computer Science. Kenz's work, is mainly in research and development with some time spent in sustaining work. The projects range from researching, testing, and selecting components, verifying and debugging PCBAS, developing and executing protocols for a variety of test procedures, and complete PCBA design using Altium Designer. Kenz is a volunteer extraordinaire, who serves many roles for different organizations, like AnitaB.org as a Program and Event Manager.

Sam Litvin is the CEO of LEHI Partners as well as a teacher and professor at San Diego Unified School District, Cuyamaca College and UC San Diego. He holds a bachelor's of science from UC San Diego in Physics and Electrical Engineering with an emphasis in Photonics as well as a Master of Environmental Science from Tel Aviv University and MBA from Northwestern Kellogg School of Management. Sam's experience includes work at General Atomics, Luxtera, Delta Design and consulting projects with General Electric, Biomed Simulation, Energy 311 as well as several startups. He is currently focused on growing LEHI Partners, a consulting consortium and teaching engineering to students of all ages in San Diego.

Neha Goel is a Senior AI Engineer at Microsoft, Responsible AI Entrepreneur in Residence, & Chair of the Women in AI Leadership program at AI 2030, and Founder of N23 Studio. She has extensive experience in integrating AI for a diverse range of clients, including Fortune 100 industries, startups, and academic institutions.

In addition to her roles, Neha serves as an Expert AI Mentor for Microsoft's startup programs, offering guidance to AI Venture studios and startups within the Microsoft Founders Hub. She is a board member of women-led startups PrevLife Health and Vendorspace.

Neha's academic background includes a Bachelor's degree in Computer Science from India, a Master's degree specializing in Artificial Intelligence from Loyola University, Chicago, and an MBA from the Kellogg School of Management at Northwestern University. In 2016, she co-founded a Medtech company in just three days during a startup Hackathon.

Title:
IEEE SSCS Oregon Chapter June Meeting and Seminar (Virtual) (Second Talk)
Date:
June 25th
10:00 AM (1 hour)
Abstract:

IEEE SSCS Oregon Chapter June Meeting and Seminar

Join us for a talk from SSCS Distinguished Lecturer Prof. Mingoo Seok from Columbia University, New York, on Tuesday, June 25th, 2024. The seminar will be held from 10:00am to 11:00am (PST) via a Virtual format. Please register for the meeting link and information.

 

Topic:

SRAM-based In-Memory Computing Hardware: Analog vs Digital and Macros to Microprocessors

 

Abstract:

In the last decade, SRAM-based in-memory computing (IMC) hardware has received significant research attention for its massive energy efficiency and performance boost. In this seminar, first, we will introduce two very recent macro prototypes which achieve state-of-the-art performance and energy efficiency yet leverage very different computing mechanisms. Specifically, one adopted analog-mixed-signal (AMC) computing mechanisms (capacitive coupling and charge sharing), whereas the other adopted a fully digital approach. After this macro-level introduction, we will present recent microprocessor prototypes that employ IMC-based accelerators, which can perform on-chip inferences at very high energy efficiency and low latency.

 

Speaker Biography:

Mingoo Seok is an associate professor of Electrical Engineering at Columbia University. He received his B.S. from Seoul National University, South Korea, in 2005, and his M.S. and Ph.D. degree from the University of Michigan in 2007 and 2011, respectively, all in electrical engineering. His research interests are various aspects of VLSI circuits and architecture, including ultra-low-power integrated systems, cognitive and machine-learning computing, an adaptive technique for the process, voltage, temperature variations, transistor wear-out, integrated power management circuits, event-driven controls, and hybrid continuous and discrete computing. He won the 2015 NSF CAREER award and the 2019 Qualcomm Faculty Award. He is the technical program committee member for multiple conferences, including IEEE International Solid-State Circuits Conference (ISSCC). In addition, He has been an IEEE SSCS Distinguished Lecturer for Feb/2023-Feb/2025 and an associate editor for IEEE Transactions on Circuits and Systems Part I (TCAS-I) (2014-2016), IEEE Transactions on VLSI Systems (TVLSI) (2015-present), IEEE Solid-State Circuits Letter (SSCL) (2017-2022), and as a guest associate editor for IEEE Journal of Solid-State Circuits (JSSC) (2019).

Title:
Artificial Intelligence of Things for Smart Cities
Date:
June 24th
5:00 PM (1 hour)
Abstract:

                                                                                            

Abstract: Cities worldwide are transitioning quickly towards a low-carbon environment, high quality of living, and resource-efficient economy. Artificial Intelligence of Things (IoT) is a combination of Artificial intelligence (AI) and the Internet of Things (IoT) to enable autonomous decision-making, data analytics, and system optimization. This talk will share our experiences on AIoT for smart cities. The first work is called Green IoT, which provides artificial intelligence and open data for sustainable city development. In this work, we developed an intelligent IoT system for air pollution monitoring in Uppsala, Sweden. The second work, called Smart Water Auditing, uses IoT and machine learning to provide insights into how much water is consumed in different domestic use categories. It aims to reduce water consumption and raise awareness of people's water consumption habits. This talk will present our AIoT system designs, machine learning algorithms, implementation, and experimental results in Hong Kong and Sweden.

                                                                           

Bio: Dr. Edith C.H. Ngai is an Associate Professor in the Department of Electrical and Electronic Engineering at the University of Hong Kong. Before joining HKU in 2020, she was an Associate Professor in the Department of Information Technology at Uppsala University, Sweden. Her research interests include IoT, edge intelligence, smart cities, and smart health. Her co-authored papers received a Best Paper Award in QShine 2023 and Best Paper Runner-Up Awards in ACM/IEEE IPSN 2013 and IEEE IWQoS 2010. She was an Area Editor of IEEE Internet of Things Journal from 2020 to 2022. She is an Associate Editor in IEEE Transactions of Mobile Computing and IEEE Transactions of Industrial Informatics. She has been a TPC co-chair in IEEE SmartCity 2015, IEEE GreenCom 2022, and IEEE/ACM IWQoS 2024. She was a project leader of the "Green IoT" in Sweden, which was named on IVA's 100 List by the Royal Swedish Academy of Engineering Sciences in 2020. She received a Meta Policy Research Award in Asia Pacific in 2022. She is a Distinguished Lecturer in the IEEE Communication Society from 2023 to 2024.

                                  
HKU IoT Lab: https://www.eee.hku.hk/~iotlab/
                            

At the time of the event, go to https://simnet.zoom.us/j/91698723639?pwd=M05JeHAzUWlYRmVXTDdheEhzamQyUT09

Or on the Zoom app
Meeting ID: 91698723639
Meeting Passcode: 848898


Title:
IEEE UFFC Seattle Tech Talk - Ultrasound and Microbubbles for Anticancer Drug Delivery (June 24)
Date:
June 24th
5:00 PM (1.5 hours)
Location:
Philips Healthcare
Bothell, WA
Abstract:

The Seattle Chapter of the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society (UFFC-S) aims to provide UFFC-S members with opportunities for professional and personal growth as well as network with the local, vibrant UFFC community.

Dr. Ayache Bouakaz, PhD will be our guest speaker.  Dr. Bouakaz is Director of Research at the Imaging & Brain Institute of the Institut National de la Santé et de la Recherche Médicale (INSERM) in Tours, France.  His research focuses on imaging and therapeutic applications of ultrasound.  He is a prolific author and inventor.  He is notably the IEEE UFFC Distinguished Lecturer for 2023-2024.

Dr. Bouakaz will present on "Ultrasound and microbubbles for anticancer drug delivery: From physics to clinics." 

This meeting will be hosted by our friends and colleagues at Philips Healthcare. The meeting will be hybrid. Please register so that organizers can plan accordingly. Online meeting details will be made available well in advance of the event.

In-person seating is limited. Light refreshments will be provided. All guests must enter through Building A and be escorted to the meeting room.

NOTE: Dr. Bouakaz will be in the Seattle area for two nights. On June 24th he will present at Philips Healthcare in Bothell. On June 25th he will present at the University of Washington in Seattle. Feel free to attend either or both events.

Title:
IEEE VTS Region 10 Chapter Chairs training at VTC-Spring 2024 Singapore
Date:
June 23rd
5:00 PM (10 hours)
Location:
Marina Bay Sands Expo & Convention Centre
Singapore, SNG
Abstract:

IEEE VTS Region 10 Chapter Chairs training at VTC-Spring 2024 Singapore

8:00    Welcome and opening remarks, participants introduction by VTS President Prof Weihua Zhuang & VP Membership Dr. Neeli Prasad
8:30    History of VTS presented by Prof. David Michelson
9:30    How to run a successful Chapter presented by Prof. David Michelson
10:00    Coffee break & Networking
10:30    IEEE vTools & OU Analytics training presented virtually by Alon Newton
11:00    DLT & DS programs presented by Dr. Neeli prasad
12:00    Lunch break
13:00    STEM group activity facilitated by Dr. Neeli Prasad
14:00    Group Photo - Location TBD
14:30    Conducting Executive meeting (Robert's Rules) by Dr. Neeli Prasad
15:00    Coffee break & Networking
15:30    Public speaking exercise, elevator pitch & networking techniques facilitated by Dr. Neeli Prasad
16:00    Current issues and best practice round table each chapter present for 5 minutes
17:00    REACH, TryEngineering, ILN presentations. Ideas how to increase VTS membership by Dr. Neeli Prasad
18:00    Closing remarks, Concur instructions and break before VTS reception

Title:
IEEE YP BOWLING: STRIKING CONNECTIONS
Date:
June 22nd
12:30 PM (2.5 hours)
Location:
4505 39th Ave SW
Seattle, WA
Cost:
Admission fee may apply
Abstract:

RSVP:

You're invited to join us at the IEEE Bowling event, hosted by the Young Professionals affinity group. The event will take place at West Seattle Bowl, offering an exciting opportunity for networking and fun.

Kindly register your attendance using the provided link. Registration is applicable to both members, non-members and students. Your registration is essential to ensure an accurate headcount, as spots are limited.

We look forward to seeing you there!

 

About the event:

The IEEE YP AG Bowling Networking Event aims to bring together IEEE members, non-members, students, and professionals in the fields of electrical engineering and computer science for an evening of team engagement, networking, and relationship-building in a relaxed and enjoyable environment. Beyond the recreational aspect of bowling, this event serves as a platform to foster meaningful connections, break down barriers, and strengthen the professional network within the community.

 

 

 

Title:
IEEE PES Oregon Chapter June 21st Tech. hour -Enabling Sustainable Power Systems Through Innovations in Optimal System Dispatch-
Date:
June 21st
12:30 PM (1 hour)
Abstract:

12:30 Chair Makes Announcements and Introduces the Speaker
12:35-1:15 Speaker gives presentation
1:15-1:30 Q&A by the speaker, and final comments by the Chair

-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-~-

 
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Oregon Section PES Chapter Monthly meeting

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Title:
IEEE SSCS Oregon Chapter June Meeting and Seminar (Hybrid)
Date:
June 21st
11:00 AM (1 hour)
Location:
Jones Farm Conference Center
Hillsboro
Abstract:

IEEE SSCS Oregon Chapter June Meeting and Seminar

Join us for a talk from SSCS Distinguished Lecturer Prof. Dongsuk Jeon from Seoul National University, Seoul, South Korea, on Friday, June 21st, 2024. The seminar will be held from 11:00am to 12:00pm (PST) via a Hybrid format. Please register for the meeting link and information.

 

Topic:

Designing a hardware solution for deep neural network training

 

Abstract:

The size and complexity of recent deep learning models continue to increase exponentially, causing a serious amount of hardware overheads for training those models. Contrary to inference-only hardware, neural network training is very sensitive to computation errors; hence, training processors must support high-precision computation to avoid a large performance drop, severely limiting their processing efficiency. This talk will introduce a comprehensive design approach to arrive at an optimal training processor design. More specifically, the talk will discuss how we should make important design decisions for training processors in more depth, including i) hardware-friendly training algorithms, ii) optimal data formats, and iii) processor architecture for high precision and utilization.

 

Speaker Biography:

Dongsuk Jeon received a B.S. degree in electrical engineering from Seoul National University, Seoul, South Korea, in 2009 and a Ph.D. degree in electrical engineering from the University of Michigan, Ann Arbor, MI, USA, in 2014. From 2014 to 2015, he was a Post-doctoral Associate with the Massachusetts Institute of Technology, Cambridge, MA, USA. He is currently an Associate Professor with the Graduate School of Convergence Science and Technology, Seoul National University. His current research interests include hardware-oriented machine learning algorithms, hardware accelerators, and low-power circuits.

Dr. Jeon was a recipient of the Samsung Scholarship for Graduate Studies in 2009, the Samsung Humantech Thesis Contest Gold Award in 2021, and the Best Design Award at International Symposium on Low Power Electronics and Design (ISLPED) in 2021. He has served for the Technical Program Committee of the ACM/IEEE Design Automation Conference (DAC), IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC), and IEEE Asian Conference on Solid-State Circuits (ASSCC). He was also a TPC subcommittee chair of DAC 2024 and TPC vice chair of ASP-DAC 2024. He is now serving as a Distinguished Lecturer of the IEEE Solid-State Circuits Society and an Associate Editor of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Title:
Seminar on Artificial Intelligence Hardware by Dr Liang of NVIDIA June 20th 6:30PM
Date:
June 20th
9:30 PM (1.5 hours)
Location:
Holmes Hall
Honolulu, HI
Abstract:

Join us Thursday night June 20th from 6PM to 8PM at UH/Manoa Holmes Engineering Building room #244 for a seminar presentation by Dr Yue Liang, a distinguished engineer of NVIDIA Corporation's Advanced Technology Group.  Her talk title is "Advanced Semiconductor Technology for Artificial Intelligence Hardware". 

Abstract:  The exponential growth of artificial intelligence (AI) has become a driving force in semiconductor technology development.  The increasingly complex and data-intensive AI models create an insatiable demand for system performance, energy efficiency, and specialized hardware solutions.  In this talk, we will examine key challenges and requirements for continuous scaling of chip performance, power and area.  We will explore the development of cutting-edge semiconductor processes, emerging technologies and the integration of advanced packing solutions to enable the next generation AI-driven application.       

Title:
4G Network on the Moon Live Streaming
Date:
June 20th
4:00 PM (1 hour)
Abstract:

Join us for a session on 4G telcom on the Moon. How is NASA and Nokia building this platform? Find out all the details today. 

The connectivity space race is heating up - and expanding beyond Earth orbit. Nokia is working with Intuitive Machines and SpaceX to put a 4G cellular network on the moon, and NASA is paying SpaceX and Blue Origin to look into creating satellite-based communication networks for Mars. What would such networks be used for, and how might they open the way for an interplanetary internet? Science journalist Alan Boyle, who's been covering space-based networking for more than two decades, provides his perspective.

Title:
Impact of Electric Vehicles on AM Radio Reception
Date:
June 20th
2:30 PM (2 hours)
Abstract:

Southeastern Michigan IEEE EMC Chapter technical meeting.

 

Event Slides: http://www.emcsociety.org/wp-content/uploads/2024/06/EV-Impact-on-AM-Radio-Reception.pdf

ZOOM LINK:  https://us02web.zoom.us/j/82921221917?pwd=c0xEeWg4a25hK0hTR0RIZkMwbmZjdz09

 

 

Keith Frazier

Sponsor:  Southeastern Michigan IEEE EMC Society.  We will have a drawing for 3 Amazon Gift Cards after the presentation.  You must be present to win. 

Title:
2.5D Silicon Photonics Interposer Flip Chip Attach
Date:
June 20th
12:00 PM (1 hour)
Abstract:

In the field of silicon photonics, advanced packaging integration is key to achieving product performance. Flip chip attach of Silicon Photonics devices poses new challenges and limitations not encountered for flip chip attach and underfill of mainstream silicon devices. The first challenge in 2.5D silicon photonics die integration is its susceptibility to cracking during downstream reflow processing. The second challenge is to keep the edge-coupling waveguide facet of the silicon photonics die uncontaminated after all MCM assembly processes, for optical coupling. The third challenge is the post-reflow flip chip standoff variation and the underfill coverage under the silicon photonics die that affect optical coupling sensitivity between the edge-coupling waveguide and the planar lightwave circuit (PLC). We have successfully demonstrated flip chip attach of silicon photonics optical light engine (OLE) on an organic substrate using both thermocompression bonding and mass reflow processes with custom tooling to achieve defect-free and uniform standoff bonding of Pb-free flip chip bumps. Various underfill control methods were explored to achieve maximum coverage and avoid underfill creeping onto the waveguide facet. Furthermore, we achieved stable optical coupling post-stress testing. More investigation would be necessary to further improve coupling efficiency stability.

Title:
Quantum Dots for micro-LEDs
Date:
June 20th
11:30 AM (1.5 hours)
Location:
==> Use corner entrance: Kifer Road / San Lucar Court ==> Do not enter at main entrance on Kifer Road
Sunnyvale, California, CA
Abstract:
Quantum Dots for micro-LEDs:Direct nanoparticle lithography for next-gen energy efficient displays

 

Abstract:

 

NanoPattern Technologies is developing inorganic nanoparticle photoresists to enable the next generation of energy efficient electronics and displays.

 

Using our photosensitive ligand technology, we have developed formulations to directly coat and pattern inorganic materials such as InP, CdSe, TiO2, and ZrO2 with no added vacuum or high temperature annealing steps.

 

Because the nanoparticles are not diluted in a polymer matrix, our inorganic photoresists achieve close to 70% volume loading and retain properties close to the pure, fully dense material. As a result, properties like high optical absorption or high refractive index can be achieved while avoiding the multiple costly fabrication steps of vacuum deposition processes.

 

We will describe a focused application on the advantages of our InP quantum dot color converter photoresists to enable next generation energy efficient displays. Bio:

 

Dr. Danielle Chamberlin, CTO at NanoPattern Technologies, is an expert in optics and optoelectronics ranging from THz to the UV.

 

Danielle has deep knowledge in the fields of LEDs and nanotechnology, having led down-converter R&D at Lumileds from 2009-2019. She holds over 15 patents on topics ranging from biosensors to microLEDs.

 

Danielle holds a PhD and MS in Materials Science from UC Berkeley and an S.B. Degree in Materials Science from MIT. 
Title:
IEEE Central Coast Event - 19 June @ 6PM - "Large Hadron Collider" - Dr. Benjamin Carlson, Westmont College
Date:
June 19th
6:00 PM (2.5 hours)
Location:
Rusty's Pizza
Goleta, CA
Abstract:

 

In-Person Location - Rusty’s Pizza ­­ 5934 Calle Real, Goleta, CA 93117

or Optional Virtual Webex Attendance   

6:00 PM – Complimentary Pizza, Salad, Beverage­

6:25 PM – Central Coast Status

6:30 PM – Dr. Benjamin Carlson Presents

Please join us on June 19th when Dr. Ben Carlson, Westmont College, will give a seminar on his work connected with The Large Hadron Collider at CERN. Guests are welcome. Please Register Now below. Note Attendance Type: In-Person or Virtual. Best regards, Ruth Franklin IEEE Central Coast Chair

Title:
2024 Monthly San Diego IEEE EXCOM - June Meeting
Date:
June 19th
5:30 PM (2.5 hours)
Location:
ATEC
San Diego, CA
Abstract:

Executive Committee meets to discuss San Diego IEEE activities at this monthly meeting. All IEEE members are welcome to attend. Please register. 

Title:
SusTech Talk June 2024 – Multi-Stakeholder Consortia: Agile Responses to Global Challenges
Date:
June 18th
6:00 PM (1 hour)
Abstract:

IEEE SusTech is hosting talks on Sustainability topics.

“Multi-Stakeholder Consortia: Agile Responses to Global Challenges”

with Joel Cutcher-Gershenfeld, Heller School for Social Policy and Management, Brandeis University

Date/Time: June 18, 2024, 6:00 – 7:00 pm PDT

Abstract:

In the face of global challenges such as the U.N.’s Sustainable Development Goals (SDGs), social institutions face a dilemma. Institutions are the stable foundations of society, operating with incremental rates of change to maintain stability. Yet the global challenges all involve rapid rates of change. This talk will focus on climate change, artificial intelligence, and fragile supply chains, each of which are beyond the scope of individual organizations, requiring many forms of institutional action. Multi-stakeholder consortia will be presented as institutional arrangements that can simultaneously ensure stability and agility.

 

Title:
June 18 Richland ExCom Meeting
Date:
June 18th
5:45 PM (1.8 hours)
Location:
1435 George Washington Way
Richland, WA
Abstract:

June 18 Richland Section ExCom meeting.

Pizza will be available at 5:45PM with business starting at 6PM.

Please join us at Round Table Pizza at 1435 George Washington Way, Richland, WA 99352

 

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Title:
Weekly Project / Update Meeting
Date:
June 18th
4:30 PM (1 hour)
Location:
Rexburg, ID
Abstract:

Meet with project teams :)

Title:
EXPO ANNIVERSARY PHM MIDPOINT MIXER at EWU Catalyst
Date:
June 18th
11:30 AM (3.2 hours)
Location:
EWU Catalyst Building
Spokane, WA
Abstract:

This June 17,18,19  – midway during Spokane’s 50th Anniversary of its World’s Fair, Expo '74, the world is once again gravitating to Spokane, including IEEE’s PHM Technology World via the June 17-19 IEEE International Conference on PHM (ICPHM), the highly interdisciplinary group that most comprehensively embodies the IEEE motto, 'Advancing Technology for Humanity'

 

IEEE Spokane’s EXPO ANNIVERSARY PHM MIDPOINT MIXER will be a casual drop-in-anytime event, from 11:30 am to 2:45 pm on Tuesday June 18, at the EWU Catalyst, where attendees can visit with Spokane IEEE at its ICPHM IEEE exhibit table, while meeting this diverse worldwide group of PHM experts whose broad interests range from software repair to smart lighting to block-chain in healthcare -- and much more. 

 

For the past 25 years, there has been a growing worldwide interest in monitoring the ongoing "health" of complex software/hardware products and systems, in order to maintain operational quality, predict failures and provide warnings to avoid catastrophic failures.  Today, the application of system ‘health’ monitoring -- also referred to as 'prognostics' --  is well established for a wide variety of complex systems, and has now become known worldwide by the acronym, 'PHM' for 'Prognostics and Health Management.' 

 

For a closer look at ICPHM 2024, and to appreciate the breadth of the complex systems topics covered, see the conference website:  https://phmconf.org

Title:
Student Design Competition - Reflectionless High-pass Filter Design for Load-Pull Measurement Setups
Date:
June 18th
6:00 AM (3 hours)
Location:
Exhibition Area
Washington, DC
Abstract:

In this design competition, the students will design a reflectionless filter to use in a load-pull setup to improve the stability of the DUT.

Students can contact the organizing committee for their questions and technical guidance anytime. We are more than happy to answer their questions and share our design and fabrication experience. The Design Competition is open to teams of undergraduate and/or graduate students that are registered at a university or other educational institution. Students must show a valid student ID during the competition.
Students may enter as individuals or as a team. There may be no more than three students on a team. Each student may be a member of only one team. Each team may submit up to two entries but can only receive an award for one entry. There is no age restriction.

Click here for the competition rules and detailed description

Title:
Seminar on Semiconductor Challenges For Edge Artificial Intelligence Adoption by Dr. Chidambaram of Qualcomm on June 17th at 7PM
Date:
June 17th
10:00 PM (1.5 hours)
Location:
Holmes Hall
Honolulu, HI
Abstract:

Join us Monday night June 17th from 7PM to 8PM at UH/Manoa Holmes Engineering Building room #244 for a seminar presentation by Dr PR. Chidambaram, Vice President of Engineering at Qualcomm.  His talk title is "Semiconductor Challenges For Edge Artificial Intelligence Adoption". 

Abstract:  Edge AI will drive the growth of the consumer electronics industry in the next few years.  We will take a look at some of the edge AI systems and what are some of the key semiconductor implementation challenges to address the edge AI systems.  Lack of leading CMOS scaling, memory band width demands and connectivity challenges will be addressed.

Title:
CLAS Executive Committee Meeting for the Month of June - Online
Date:
June 17th
7:30 PM (1.5 hours)
Abstract:

CLAS June 2024 Executive Committee Meeting

Title:
Distributed Vertical Power Delivery for High-Performance Computing Systems
Date:
June 17th
6:00 PM (1 hour)
Abstract:

Distributed Vertical Power Delivery for High-Performance Computing Systems

High-performance computing plays a key role in supporting the advancement of modern and emerging high-power applications. With the advent of 2.5D and 3D packaging solutions, systems that consume tens of kilowatts of power become viable. Considering the high current and power density requirements in these systems, the path forward with traditional power delivery approaches is, however, unsustainable with respect to energy efficiency and thermal challenges. In response to these challenges, vertical power delivery has emerged as a promising solution to address the unprecedented power loss encountered in high-performance computing systems at the package level. With this approach, high-power is distributed through package-level networks at a low current and converted with power-efficient converters in close horizontal proximity to the functional dies/chiplets. As a result, the distribution of high-current power is limited to short vertical interconnect between the converters and points-of-load, mitigating power loss and thermal challenges. While vertical power delivery is a promising approach to manage high-current high-density power, how to distribute the active and passive power converter components around the periphery and on the backside of functional dies/chiplets and how to efficiently convert power within limited footprint near points-of-load are topics of active research. Package-to-die power delivery architectures and design methodologies, power circuits for efficient power conversion, and vertically-stacked, highly dense and efficient passive components is the key for enabling high-performance computing. This talk will explore these issues in detail and investigate possible ways to mitigate the existing power delivery challenges in the context of high-performance computing.

 

74 meetings. Generated Monday, July 15 2024, at 10:25:52 PM. All times America/Los_Angeles