using https://events.vtools.ieee.org/meetings/xml/0/30/asc/6
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59 meetings
- Title:
- Soldering Race 2026
- Date:
- February 23rd
5:00 PM (1 hour) - Location:
- UA Electrical and Computer Engineering
Tucson, AZ - Abstract:
Soldering race for U of A students for eweek
- Title:
- Open Source FPGA Projects Roundtable
- Date:
- February 24th
10:00 AM (1 hour) - Abstract:
Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.
- Title:
- MOVE USA Feb 2026 Tech Talk - MOVE into STEM
- Date:
- February 24th
5:00 PM (1.5 hours) - Abstract:
STEM outreach doesn’t begin with specialized resources or complex programs — it begins with you. MOVE into STEM invites attendees to recognize and leverage the skills, networks, and passions they already possess to make a meaningful impact in their communities. This session is about turning readiness into action — showing how what you already bring can fuel outreach that is joyful, inclusive, and lasting. Through practical frameworks, real‑world examples, and shared experiences, participants will discover how everyday talents can be transformed into extraordinary opportunities for STEM engagement.
Attendees will leave empowered to spark curiosity, foster inclusion, and drive momentum in STEM education — ready to start where they stand and set STEM in motion.
- Title:
- SCV/OEB SSIT Chapter and ISTAS25 follow-up
- Date:
- February 24th
6:00 PM (1.5 hours) - Location:
- Sobrato Campus for Discovery and Innovation (SCDI), Santa Clara University
Santa Clara, CA - Abstract:
Feb 24 6PM-7:30PM Member/Open Meeting at Santa Clara University - with Pizza:
As we progress into 2026, we begin with our SCV/OEB SSIT Chapter and ISTAS25 follow-up on 24 February, 2026, from 6.00 pm to 7.30 pm in an hybrid mode. This is a member/open meeting at Santa Clara University to share information on the SSIT Chapter Officer Election Status and to encourage others to formally join our SSIT Chapter as part of their IEEE Membership. Moreover, it will also function as the ISTAS25 follow-up to explore the possibility of a Special ISTAS25 Issue of Technology & Society periodical/magazine and to plan for future SSIT events.
- Title:
- IEEE San Diego Section Life Member Affinity Group Monthly Meeting - February 24, 2026
- Date:
- February 24th
6:06 PM (2.0 hours) - Location:
- 124 Solna Hills Drive
Solana Beach, CA - Abstract:
Meeting Announcement: San Diego IEEE Life Members Affinity Group – Tuesday, February 24, 6 pm
Join us for our upcoming gathering!
We are pleased to announce the next meeting of the San Diego IEEE Life Members Affinity Group. All members are warmly invited to join us for an evening of camaraderie, conversation, and connection. This will be an in person meeting.
Meeting Details· Date: Tuesday, February 24, 2026
· Time: 6:00 PM – 8:00 PM
· Location: Crust Pizzeria
· 124 Solana Hills Dr.
· Solana Beach, CA 92075
· Phone: 858.356.9925
Speaker: Dr. Stan Rifkin, Topic: The Future of Electronics at the Subatomic Particle (Quantum) Level
We encourage all San Diego IEEE Life Members to attend and to bring along any colleagues or friends who may be interested. This is a great opportunity to network, share ideas, and enjoy delicious food in a friendly setting.
If you have any questions or require further information, please contact the venue or reach out to Bill Torre, 619-417-9410. We look forward to seeing you there!
Virtual meeting access will also be provided, below is a Zoom link:
https://us06web.zoom.us/j/88434602905?pwd=dKLqbKG4GhGegkB5iJuS7NbDPzXuRH.1
Meeting ID: 884 3460 2905 Passcode: 151647
--- One tap mobile +16699006833,,88434602905#,,,,*151647# US (San Jose) +14086380968,,88434602905#,,,,*151647# US (San Jose)
- Title:
- Tech Talk: Emotional Intelligence in AI
- Date:
- February 24th
7:00 PM (1 hour) - Abstract:
The San Francisco Bay Area chapter of the IEEE Computer Society invites to our free and open Virtual Tech Talks (no IEEE membership required):
Speaker: Dr.K.Venkata Nagendra (Connect on LinkedIn)
Title: Emotional Intelligence in AI
Abstract: AI emotional intelligence, also known as emotion AI or affective computing, is the ability of AI to detect, interpret, and simulate human emotions using through facial expressions, body language, voice tone and other cues. While AI can analyze emotional cues and even generate responses that seem empathetic, it lacks true consciousness, empathy, and personal experience, which are fundamental to genuine emotional intelligence. Instead of replacing human emotional intelligence, AI serves as a tool that can enhance it by providing insights, analyzing data at scale, and creating more natural human-machine interactions. AI technology uses various methods to recognize and respond to human emotions, including: Facial Recognition Technology is used to analyze facial expressions and detect emotions such as happiness, sadness, anger, and fear. This technology uses algorithms to analyze facial features such as the shape of the mouth, eyes, and eyebrows. And another one, Voice Recognition Technology is used to analyze the tone and pitch of a person's voice to detect emotions such as happiness, sadness, and anger. This technology uses machine learning algorithms to analyze speech patterns and identify emotional cues. The Benefits of Emotional Intelligence in AI, Creating More Meaningful Interactions between Humans and Machines, Enhanced education, shaping the Future of AI.
Bio: Dr. Kolluru Venkata Nagendra, graduated from Sri Venkateswara University in Tirupathi with a bachelor's degree in computer science. He later graduated from Jawaharlal Nehru Technological University in Hyderabad with a master's degree in computer applications. After that, he graduated from Acharya Nagarjuna University in Guntur with a Master of Technology in Computer Science and Engineering. Additionally, he graduated from Vikrama Simhapuri University in Nellore, Andhra Pradesh, with a Ph.D. in computer science. He graduated from Srinivasa University in Mangalore with a PDF (Post Doctoral Fellowship) in CSE. In addition to writing numerous computer science textbooks, Dr. Nagendra is the author of more than 70 research papers that have been published in journals with UGC and Scopus indexes. He served as a judge and reviewer for numerous conferences and journals. Having worked at several engineering colleges for more than 17 years, he is currently employed SRKR Engineering College, Bhimavaram, Andhra Pradesh. His research interests encompass Machine Learning, Deep Learning, and Data Mining.
- Title:
- IEEE OC PES Chapter Planning Meeting - Feb 25th 2026
- Date:
- February 25th
12:00 PM (1 hour) - Location:
- Applied Innovation Building
Irvine, CA - Abstract:
This is an in-person planning meeting for PES ExCom
- Title:
- IEEE UWT Student Branch - Servo Workshop (Arduino Workshop Part 3)
- Date:
- February 25th
12:30 PM (0 minute) - Location:
- Cherry Parkes
Tacoma, WA - Abstract:
This meeting we will continue our three part Arduino workshop series where we will teach beginner engineers how to use servos via Arduino controllers.
- Title:
- REVERSE ENGINEERING THE INTERVIEW
- Date:
- February 25th
3:00 PM (2 hours) - Location:
- WSU Everett
Everett, WA - Abstract:
- Title:
- IEEE Computer Society Talks on Scalable System Design
- Date:
- February 25th
5:30 PM (2.5 hours) - Location:
- UW1
Bothell, WA - Abstract:
The IEEE Computer Society Seattle Section and the IEEE UW Bothell Student Chapter invite you to an evening of technical talks focused on designing and operating scalable systems in real-world environments.
Join industry experts as they share insights from building high-scale platforms, third-party integrations, and resilient distributed architectures.
As part of the program, Nikita Chhatre, Senior Software Development Manager at Amazon, will present “Embedded Apps in Amazon Seller Central: Building Scalable Third-Party Integration Architecture.”
Rashmesh Radhakrishnan, Senior Software Engineer specializing in large-scale secure platforms and device connectivity systems, will present “Designing for the Stampede: Rethinking the Thundering Herd.”
Why Attend?
Learn practical scalability strategies from industry leaders
Gain insights into large-scale integration architecture
Explore resilient system design patterns for distributed and IoT environments
Connect with engineers, architects and students
Hosted by: IEEE Computer Society Seattle Section & IEEE UW Bothell Student Chapter
Audience: Software engineers, system architects, cloud engineers, IoT developers, and students interested in scalable system designWe look forward to seeing you there!
- Title:
- AI is Accelerating the Shift to Advanced Packaging with PLP and Glass Cores
- Date:
- February 26th
9:00 AM (1 hour) - Abstract:
The semiconductor sector continues to expand rapidly, supported by growing needs in AI, automotive electronics, and consumer devices. As the limits of traditional scaling become increasingly evident with both physically and economically, advanced packaging is taking center stage as a critical driver of higher performance, tighter integration, and further miniaturization. In this context, next-generation packaging platforms such as panel-level packaging (PLP) and glass core substrates are emerging as key technologies shaping the industry's future direction.
PLP is gaining industry interest for its potential to reduce manufacturing costs and support ultra-large form-factor package. Nevertheless, its adoption introduces several materials and process challenges, including warpage management, thermal robustness, and process compatibility. To overcome the warpage issue, alternative material like glass core substrate is being explored for its exceptional dimensional stability and favourable electrical characteristics. Despite core cores advantages, the use of glass raises practical concerns in handling, via creation, and integration within existing assembly infrastructures.
This presentation will delve into these evolving technology pathways, examining market motivations, supply-chain considerations, and the broader ecosystem shifts surrounding them. It will outline both the opportunities these solutions present and the technical barriers that must be overcome as advanced packaging moves into its next phase of development.
- Title:
- Next-Gen Healing: Designed by Algorithms.
- Date:
- February 26th
12:00 PM (1 hour) - Abstract:
Advances in intelligent computing are redefining how we discover therapeutics and engineer regenerative tissues. This talk presents two complementary, algorithm-driven approaches aimed at transforming treatments for neurological and skeletal disorders. First, we introduce a computational peptidomics pipeline that mines genomic data to identify precursor sequences encoding neuroactive peptides, which are key modulators of signal transmission that bind heptahelical receptors. Traditional peptide discovery is slow and serendipitous; our algorithms predict peptide maturation pathways, including post-translational modifications, and pair these predictions with a high-sensitivity assay capable of detecting receptor-generated second messengers such as InsPs and cAMP. This integrated strategy has yielded promising peptide-based drug candidates for Parkinson’s disease and Osteoporosis, now advancing through animal testing. Parallel to this, we present a bioengineering framework for creating biomimetic, biocompatible bone scaffolds. Using uCT images of osteoporotic bone, we design and 3D-print trabecular structures optimized for both mechanical strength and osteoconductivity, addressing limitations of current synthetic scaffolds. These engineered matrices, enhanced by the osteogenic Calcitonin Receptor Fragment Peptide, support robust osteoblast growth and functional bone formation. Together, these innovations illustrate how algorithmic design and intelligent technologies can accelerate next-generation healing, from molecular therapeutics to regenerative tissues.
- Title:
- Rising Stars 2026 Conference Report at Avista
- Date:
- February 26th
5:00 PM (1.5 hours) - Location:
- Avista Building
Spokane, WA - Abstract:
Join us as students present their Rising Stars Conference experience! Students from Eastern Washington University and Gonzaga University attended Rising Stars, a conference dedicated to students and young professionals. For many of them, this was their first conference experience. Come listen as students give perspective on what they learned, and what they look forward to as they enter industry.
- Title:
- IEEE/CN - February 2026 Meeting (Away) "SD Hardware Meetup: Hardware for Defense"
- Date:
- February 26th
5:00 PM (2.5 hours) - Location:
- Downtown Works - Coworking Office Space Mission Valley
San Diego, CA - Abstract:
Thursday, February 26, 2026
5:00pm – 7:30 pm
SD IEEE Consultants' Network: February 2026 Meeting ("Away Game")
SD Hardware Meetup: Hardware for Defense
This month we will join the SD Hardware Meetup at Downtown Works Mission Valley.
SD Hardware Meetup is part of a national organization bringing together a community of people building physical products and hardware, from designers, founders, engineers, investors, and more, everyone is welcome. In addition to networking, there will be two speakers discussing their respective technologies in defense tech and dual use.
Please sign up here: https://eventship.com/event/8th-sd-hardware-meetup-downtown-works-mission-valley-hardware-for-defense
Optionally, but please also sign up below
And Meetup here: https://www.meetup.com/san-diego-ieee-meetup/events/313177847
When:
Thursday, February 26, 2026
5:00pm - 7:30pmCOST:
FreePARKING:
Free Onsite ParkingAre you on our Linked-in group?
https://www.linkedin.com/groups/2112928Join the IEEE/CN of San Diego newsletter mailing list:
http://www.ieeeconsultants.org/joinus
- Title:
- IEEE PES/IAS Lecture: Shaping the Future of Electronics through Nano-Engineered Materials
- Date:
- February 26th
5:00 PM (1.2 hours) - Abstract:
Nano-engineered materials are opening new pathways toward sustainable, high-performance electronic and sensing technologies. This talk presents a comprehensive overview of nanomaterial-based sensor systems and flexible optoelectronic devices, highlighting how structural and interfacial engineering at the nanoscale enables enhanced functionality. The discussion begins with the fundamentals of nanomaterials, including carbon dots and nanocomposites, emphasizing their high surface-to-volume ratio, quantum confinement, and tunable electronic properties. Room-temperature gas sensors based on MoS2–CuO nanocomposites will be presented, demonstrating sensitive and selective acetone detection through engineered heterojunction band alignment. A paper-based enzymatic chemiresistor for point-of-care ethanol breath detection will illustrate the integration of nanomaterials into low-cost, portable healthcare platforms. The talk further explores carbon-dot-decorated ZnO nanorod Schottky diodes fabricated on flexible paper substrates for self-powered UV photodetection. The enhanced rectification behavior, photovoltaic response, and mechanical durability demonstrate the potential of nano-engineered interfaces for flexible and energy-efficient optoelectronics. Collectively, these studies showcase how rational nanomaterial design, interface engineering, and device integration are shaping the next generation of sustainable electronics.
About the Speaker:
Dr. Nirmal Roy is an Assistant Professor in the Department of Electronics and Communication Engineering at Motilal Nehru National Institute of Technology (MNNIT) Allahabad, India. He received his Ph.D. from the Indian Institute of Technology (IIT) Guwahati, and his M.Tech. in Microelectronics and VLSI Design from MNNIT Allahabad. His research focuses on nanoelectronics, 2D nanomaterials, gas and biosensors, IoT, POCT devices, optoelectronic devices, flexible electronics, supercapacitors, and VLSI design. Dr. Roy has published extensively in leading international journals, including IEEE Sensors Journal, Chemical Engineering Journal, ACS Applied Materials & Interfaces, Langmuir, Journal of Alloys & Compounds, Journal of Environmental Chemical Engineering, Microsystems & Nanoengineering, Optical Materials, Journal of Physics and Chemistry of Solids, Material Science & Engineering: B, Physica Scripta, etc. He holds two granted Indian patents and has delivered several invited talks at conferences and academic forums. He actively serves as a reviewer for reputed international journals across IEEE, Elsevier, ACS, IOP, and Springer publications.
- Title:
- SCV WIE Feb 2026 ExCom Meeting
- Date:
- February 26th
6:00 PM (1 hour) - Abstract:
SCV WIE Feb 2026 ExCom
ieeescvwie is inviting you to a scheduled Zoom meeting.
Join Zoom Meeting
https://us06web.zoom.us/j/87970173125?pwd=jmBrqlVYgnQ5jdmcRcJ1aH7ZQcBRX4.1Meeting ID: 879 7017 3125
Passcode: 229065---
One tap mobile
+16699006833,,87970173125#,,,,*229065# US (San Jose)
+16694449171,,87970173125#,,,,*229065# USJoin instructions
https://us06web.zoom.us/meetings/87970173125/invitations?signature=8IF6K5pz-R3xdls0sOEWYH9eNDEPHsCtib3HTHLA4KUWhen
Thursday Feb 26, 2026 ⋅ 6pm – 7pm (Pacific Time - Los Angeles)
Location
https://us06web.zoom.us/j/87970173125?pwd=jmBrqlVYgnQ5jdmcRcJ1aH7ZQcBRX4.1
- Title:
- Engineering Week Awards Mixer / NASA's NISAR Mission Talk
- Date:
- February 26th
6:00 PM (2.5 hours) - Location:
- Hub101 - Cal Lutheran Center for Entrepreneurship
Westlake Village, CA - Abstract:
Join us for an exciting Lecture on NASA's NISAR Mission, Scholarship Awards and free dinner from Stonefire Grill. Welcome to the Engineering Week Awards Mixer at Hub101 - Cal Lutheran Center for Entrepreneurship! Join us on February 26, 2026 at 6:00 PM for a night of celebration and inspiration. During the event, we will have a special talk on NASA's NISAR Mission by expert in the field. Don't miss this opportunity to learn about NASA's flagship Earthscience Mission!
This event is hosted by IEEE BV Section and promises to be a fun and informative evening. Come network with fellow engineers and enthusiasts in a welcoming environment. Mark your calendars and get ready for an exciting night! We can't wait to see you there.
Event is free but registration is required.
- Title:
- Critical Aerodynamics and Flight Dynamics Challenges of Mars Rotorcraft
- Date:
- February 26th
6:45 PM (1.2 hours) - Abstract:
Operating rotorcraft in the thin Martian atmosphere presents unique aerodynamic and flight dynamics challenges—first addressed during NASA’s Ingenuity Mars Helicopter mission in 2021. This seminar reviews these challenges for both current and future Mars rotorcraft. Topics include the characteristics of the Martian aerodynamic regime, Earth-based testing approaches, and Ingenuity’s flight dynamics validation on Mars.
Future rotorcraft concepts will be significantly larger and more complex than Ingenuity’s coaxial design. Multi-rotor configurations introduce additional modeling difficulties, particularly in accurately capturing rotor wake interactions without resorting to computationally expensive blade-resolved CFD. To address this, the seminar will also discuss the application of the Viscous Vortex Particle Method (VVPM) as a mid-fidelity tool for simulating rotor wakes in Mars rotorcraft.
- Title:
- An Overview of Metamaterials from A Transmission-Line Perspective
- Date:
- February 27th
12:00 PM (1 hour) - Abstract:
In this webinar, a broad overview of metamaterials and related engineered electromagnetic structures, with particular emphasis on understanding and designing them through a transmission-line approach will be presented. This perspective provides powerful physical intuition and offers a straightforward route toward implementing such engineered media.
Key scientific and technological milestones achieved over the past two decades will be highlighted. These include the demonstration of flat Veselago–Pendry lenses capable of focusing electromagnetic waves into subwavelength spots, the development of surface electromagnetic cloaks, and a wide range of multifunctional microwave components and antennas enabled by these engineered media.
- Title:
- Tour of Puget Sound Energy's Load Office (Control Center)
- Date:
- February 27th
12:00 PM (1.5 hours) - Location:
- Puget Sound Energy Load Office
Redmond, WA - Cost:
- Admission fee may apply
- Abstract:
IEEE-PES Seattle and Puget Sound Energy (PSE) are hosting a tour of PSE's transmission control center ("Load Office") in Redmond, WA. This control center is one of many centers PSE uses to monitor and control the generation and transmission of electricity on PSE's electrical grid, and ensure reliable service to PSE's 1.2 million electrical customers. Participants will have the opportunity to see the Load Office in person, learn about day-to-day and emergency operations, and speak with control center operators.
NOTE: VALID, GOVERNMENT ISSUED PHOTO ID IS REQUIRED TO ENTER THE FACILITY. ALL ATTENDEES MUST BRING A VALID, GOVERNMENT ISSUED PHOTO ID TO THE TOUR IN ORDER TO ENTER THE CONTROL ROOM. Parking is limited at this location - carpooling or ridesharing are encouraged. For more information on what a typical transmission control center looks like, here are some examples of other utility control rooms in New York and Texas:Take a look inside National Grid's Transmission Control CenterERCOT Control Room Video
- Title:
- Friday Lockdown Study
- Date:
- February 27th
1:00 PM (4 hours) - Location:
- Science North
Hayward, CA - Abstract:
Join us this Friday for a productive study session! SN237
Group study session with unlimited free pizza. Bring your homework laptop/charger. Questions for your peers and officers
Free pizza, collaborative learning environment, and get help from IEEE officers and members
- Title:
- Eastern Idaho Engineering Week Banquet
- Date:
- February 27th
6:00 PM (2 hours) - Location:
- Manwaring Center
Rexburg, ID - Cost:
- Admission fee may apply
- Abstract:
Come join us for a banquet dinner to celebrate engineering in Eastern Idaho!
Hosted by Brigham Young University - Idaho, the Idaho American Nuclear Society, American Society of Mechanical Engineers, and Eastern Idaho Section of the Institute of Electrical and Electronics Engineers have come together in a joint effort to organize an Engineering week banquet.
Many of you are aware that Eastern Idaho is growing and growing fast! It will be thanks to many of the engineering community's efforts that this growth is possible. Many other engineering disciplines are seeing incredible growth as well, especially our friends from INL as they help advance nuclear reactors, power generation, and grid management. We came together to organize this event as our way to say thank you for all your efforts in whatever field you serve. While our funds didn't allow us to make the event free, we tried to make it as cheap as possible for you.
We look forward to seeing professionals and future professionals alike join us for a wonderful evening of camaraderie and community!
For information on where to park on the BYU-I Campus, the parking lots outlined in green are available for parking after 5PM. The Manwaring Center is outlined in red.
- Title:
- vTools and OU Analytics virtual training
- Date:
- February 28th
7:30 AM (1.5 hours) - Abstract:
This training will be targeted to volunteers who are fairly new to vTools and OU Analytics and want to learn to use them more effectively. It will include live walkthroughs of common tasks. Please feel free to forward this invite to others who are interested.
- Title:
- Speaker Series Event
- Date:
- March 2nd
5:00 PM (1 hour) - Location:
- Stanford, CA
- Abstract:
As part of the Stanford IEEE continuing Speaker Series throughout the year.
- Title:
- Open Source FPGA Projects Roundtable
- Date:
- March 3rd
10:00 AM (1 hour) - Abstract:
Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.
- Title:
- IEEE X MESA: SMUD Hydro Generation Information Session
- Date:
- March 3rd
12:00 PM (1 hour) - Location:
- TEB
Sacramento, CA - Abstract:
Join the Sacramento State IEEE student chapter in collaboration with MESA for a discussion about SMUD's Hydro Generation department. Our speaker, Dan Stricklin, is a Sac State alumnus with 20 years of experience in the utility industry.
Dan will share insights from his experience in the industry, information on career paths within SMUD, and what it is like working with hydroelectric generation. Q&A to immediately follow the presentation. This event is open to all, with internship and employment opportunities for several engineering disciplines including electrical, mechanical, civil, and Instrument & Controls.Food will be provided!
- Title:
- Student Officer Meeting
- Date:
- March 3rd
3:30 PM (0 minute) - Location:
- Lilibridge
Pocatello, ID - Abstract:
Officer Meeting to plan for the next 2 weeks.
To go over the Schedule, Budget, and Special Opportunities the student branch/club has.
- Title:
- Recent Advancements in Image Generation and Understanding
- Date:
- March 3rd
5:30 PM (1 hour) - Abstract:
2nd Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)
- Title:
- SusTech Talk March 2026 - Sand-Like Particles for High-Temperature Thermal Energy Storage
- Date:
- March 3rd
6:00 PM (1 hour) - Abstract:
- “Sand-Like Particles for High-Temperature Thermal Energy Storage: Enabling a Resilient Renewable Energy Future”
with Shin Young Jeong, faculty member of the Center for Advanced Turbomachinery and Energy Research, University of Central Florida.
Date/Time: Tuesday, March 3, 6pm - 7 pm Pacific Time
Abstract:
The transition to renewable energy has increased the need for reliable, large-scale storage to balance intermittent generation with continuous demand. Thermal energy storage (TES) offers a cost-effective solution by capturing excess energy as heat and releasing it when needed, supporting long-duration storage and grid stability. Unlike batteries, TES can scale to industrial levels, provide process heat, and deliver electricity through power cycles. Recent advances use abundant, low-cost materials such as sand-like particles serving as both heat transfer media and storage. This talk will highlight emerging TES technologies and their role in a resilient, decarbonized energy future.
- Title:
- The Making of a Chip: Technology, Tools, and Careers
- Date:
- March 3rd
6:00 PM (2 hours) - Location:
- Riverside Hall
Sacramento, CA - Abstract:
The Making of a Chip is an introductory technical and career-focused session designed to provide participants with a comprehensive overview of the complete ASIC development lifecycle. The event will guide attendees through each critical phase of chip creation, starting from system and ASIC/VLSI specifications, progressing through design and verification, and concluding with post-silicon validation.
Participants will gain insights into how real-world requirements are translated into silicon-ready designs, the role of RTL design and functional verification, and the importance of validation after fabrication to ensure performance, reliability, and compliance. In addition to the technical flow, the session will highlight current industry practices, tools, and skills required at each stage of the semiconductor lifecycle.
The event will also focus on career opportunities for graduates in the semiconductor industry, outlining various job roles such as ASIC/VLSI design engineer, verification engineer, validation engineer, and related entry-level positions. Industry expectations, essential skill sets, and career pathways will be discussed to help students and early-career professionals prepare for roles in chip design and development.
This session is ideal for engineering students and graduates who are interested in understanding ASIC/VLSI design workflows and exploring career opportunities in the semiconductor domain.
- Title:
- IEEE Alaska - March ExCom Meeting
- Date:
- March 3rd
7:00 PM (1.5 hours) - Abstract:
IEEE Alaska Executive Committee Meeting
Tuesday, March 3, 2026 ⋅ 6:00 – 7:30pm (Alaska Time - Anchorage)
Jeremie Smith is inviting you to a scheduled Zoom meeting using the IEEE Alaska Section Account
Join Zoom Meeting
https://zoom.us/j/98832778456?pwd=WnhVWFpOOGQ0YkZEVnlqMlJjWG5lZz09Meeting ID: 988 3277 8456
Passcode: 269832Please register if you will be attending.
- Title:
- IEEE-USA Livestream Webinar: Beyond the Application: How Strategic Networking Unlocks the Hidden Job Market
- Date:
- March 4th
11:00 AM (1 hour) - Abstract:
In today’s saturated job market, submitting applications alone is rarely enough. This session explores advanced job-search strategies that go beyond online postings, with a focus on purposeful networking that leads to real conversations, referrals, and opportunities. Participants will learn how to identify the right people to connect with, how to approach networking in a professional and authentic way, and how to position themselves for roles that may never be publicly advertised. This webinar is designed to help job-seeking professionals compete effectively in a highly crowded market.
- Title:
- IEEE OC PES/IAS Chapter ExCom Meeting - March 4th 2026, MOVED ON-LINE
- Date:
- March 4th
6:00 PM (0 minute) - Abstract:
IEEE Orange County PES/IAS Chapter's ExCom meeting
All IEEE OC PES/IAS Chapter members are requested to attend this meeting.
To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.
The zoom link is given below:
Topic: IEEE OC PES/IAS ExCom meeting
Time: Mar 4, 2026 06:00 PM Pacific Time (US and Canada)
Join Zoom Meeting
https://tae.zoom.us/j/86949880492?pwd=UP0LCD1qQXesboqCIbnbSagUtVOyKf.1Meeting ID: 869 4988 0492
Passcode: 228799
- Title:
- IEEE PES SEATTLE EXCOM MEETING
- Date:
- March 4th
8:00 PM (1 hour) - Abstract:
EXCOM Meeting for IEEE PES Seattle Officers
- Title:
- From Idaho to the Moon: Building the Future of Intelligent Robotic Mapping
- Date:
- March 5th
5:30 PM (1.5 hours) - Location:
- Micron Center for Materials Research (MCMR)
Boise, ID - Abstract:
Annika Thomas is a Ph.D. candidate at MIT whose work lies at the intersection of robotics, computer vision, and spatial intelligence. After beginning her academic path in Idaho at Renaissance High School and The College of Idaho, she went on to study mathematics, physics, and engineering through a dual-degree program at Columbia University, then to MIT. Over the course of her studies, she has contributed to astrophysics research, rocket propulsion, and the design and deployment of satellites currently in orbit, and she has worked in field robotics labs around the globe.
Her current research focuses on developing photorealistic, semantically rich, and shareable map representations for autonomous robots using Gaussian Splatting and multi-modal sensor fusion. These structured world models enable multi-agent mapping, loop closure, and planetary-scale localization. Applications range from terrestrial robotic perception to lunar surface mapping for upcoming space missions with NASA.
Her journey illustrates how a STEM career can unfold from small-town beginnings to cutting-edge global research. Alongside her technical work, she is committed to clear and accessible scientific communication, which has led her to share ideas on collaborative robotics for lunar and Martian exploration through TEDx talks and international presentations across four continents. Annika ultimately aims to launch her own lab centered on intelligent mapping and embodied AI while contributing to a more inclusive culture for women in STEM.
The talk is co-hosted by the following organizational units in the IEEE Boise Section:
IEEE Boise Communications Society/Robotics & Automation Society/Signal Processing Joint Chapter
IEEE Boise Computer Society Chapter
IEEE Boise Women In Engineering Affinity Group
IEEE Boise Young Professional Affinity Group
IEEE Boise State University Student BranchThis talk is free and open to the public. Registration is optional but helps us plan the headcount.
- Title:
- 2026 CES Download - Tom Coughlin and Avery Lu, March 5th, 2026
- Date:
- March 5th
5:30 PM (2.5 hours) - Location:
- 440 N. Wolfe Road, Suite 71,
Sunnyvale,, CA - Abstract:
Greetings and welcome to our annual IEEE San Francisco Bay Area Consumer Technology Society (CTSoc) event, bringing a comprehensive summary of latest and most innovative technologies unveiled at the 2026 Consumer Electronics Show (CES) in Las Vegas.
CES has long been the world's premier showcase for consumer technology, and its scope continues to expand well beyond traditional consumer electronics across a diverse range of categories—from wearables and smart home ecosystems to autonomous robotics, commercial and recreational drones, cutting-edge medical and healthcare devices, automotive technology, sustainable energy and accessibility innovations, that are reshaping how we live, work, and interact with the world around us.
Please join us as our expert speakers distill the most significant trends and breakthrough technologies from the show.
Speakers:
Tom Coughlin: President, Coughlin Associates
2024 IEEE President & IEEE Fellow, Tom is a world-renowned digital storage expert and industry analyst. Having served as the global leader of IEEE, he brings unparalleled insight into the hardware and infrastructure driving the latest consumer trends.
Avery Lu: Partner & Head of Business Development, Aventurine Capital Group
2025-2026 Chair of the IEEE Santa Clara Valley Section, Avery is a seasoned venture capitalist and deep-tech executive. His expertise in semiconductors and AI allows him to identify the startups and technologies with the highest potential for commercial success and market disruption.
This will be a hybrid event (in-person and online). Register early, do not miss this event to get a glance into the future of consumer technologies.
In-Person joining locations -
Plug and Play Tech Center, Sunnyvale, San Francisco Room
440 N. Wolfe Road, Suite 71, Sunnyvale, California, United States 94085
Online Webex joining links -
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Meeting number:2534 876 5158
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- Title:
- SFBAC Officers Training
- Date:
- March 7th
8:00 AM (6 hours) - Location:
- Plug and Play Tech Center
Sunnyvale, CA - Abstract:
PLEASE NOTE THAT THIS IS FOR CHAPTER OFFICERS OF SANTA CLARA VALLEY SECTION, SAN FRANCISCO SECTION AND OAKLAND-EAST BAY SECTION ONLY
Greetings!
This year's officer training is being conducted for officers of San Francisco Bay Area Council at the Plug and Play Tech Center in San Jose, CA. This is meant to provide the Chapter officers with training related to the different aspects of the chapter operations. Below are some of the topics that will be covered in the training:
1. vTools2. Concur Expense
3. Nextgen banking and reporting
4. Senior member elevation program
5. How to run an effective chapter
6. Web presence
More detailed agenda will be shared soon along with presenter details.Please register using the link and save the date for the officer training.
- Title:
- Foundations of Artificial Intelligence and Machine Learning
- Date:
- March 7th
12:00 PM (1 hour) - Abstract:
Pragathi Prema Kumar will lead this introduction to the Foundations of Machine Learning and Artificial Intelligence session. Participants will gain foundational skills and knowledge on how to incorporate ML / AI into computing and computer science projects.
This is the first of several San Diego IEEE WIE hosted sessions designed to engage participants on the latest innovations and empower them to learn more.
- Title:
- Open Source FPGA Projects Roundtable
- Date:
- March 10th
10:00 AM (1 hour) - Abstract:
Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.
- Title:
- San Diego IEEE Electronics Packaging Society (EPS) Meeting - Part 2
- Date:
- March 10th
5:00 PM (1.5 hours) - Location:
- Qualcomm Building S
San Diego, CA - Abstract:
We are organizing part2 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.
Agenda: The following topics would be discussed as follow up from the first meeting in February 2026.
- List of IEEE EPS technical and non-technical events
- Collaboration with IMAPS
- Additional officers beyond the 4 assigned, especially webmaster
- Budget feedback from SD section, plan for EPS subsidy
- Title:
- The FPGA: 40 Years of Change
- Date:
- March 10th
7:00 PM (2 hours) - Location:
- 925 Thompson Place
Sunnyvale, CA - Abstract:
This is a hybrid in-person and online event. Pre-registration is required for either.
In 1984, the Field Programmable Gate Array (FPGA) was invented at Silicon Valley startup Xilinx by its co-founder Ross Freeman. It was not an obviously good technology as it had serious drawbacks in speed, cost, power, and capacity. However, its novel design transformed the technology industry as it rode the wave of Moore’s Law. As this transformation was not a straight road, companies that did not recognize fundamental industry changes created by the FPGA fell by the wayside. If companies did not stretch to find new uses for this technology, or did not deploy its resources in building a new ecosystem, they also failed.
Xilinx’s FPGA invention led to the major industry transformation of the Fabless semiconductor model, and step-by-step Xilinx navigated this field of potential failure. These steps tell of a company growing from a hyper-lean adrenaline-driven startup to a multi-billion-dollar success story. Not every step was correct, and certainly there was some luck. However, considerable effort was required to achieve that luck, and even more effort to capitalize on it.
In this talk, IEEE Fellow Steve Trimberger will discuss change: the changing value of semiconductor scaling, the changing needs of EDA, the changing barriers to entry, the changing application of the technology, and the changing role of consultants and corporate relationships over the course of many years. These changes got us to 2026 – what change is next?
Please note that an IEEE Milestone for the FPGA will be dedicated on Thu, March 12. Information about attending its dedication online will be available soon.
- Title:
- IEEE-USA Livestream Webinar: Put Your Retirement Plan to Work
- Date:
- March 11th
11:00 AM (1 hour) - Abstract:
Will discuss the value of your company 401k, matching, options when retiring or leaving your company, investment options outside of your 401k and lastly a recap of market conditions
- Title:
- A Scalp-EEG Tool for Epilepsy Diagnosis: Getting Patients the Right Answers, Faster
- Date:
- March 11th
11:30 AM (1 hour) - Abstract:
Every year, over one million people in the U.S. rush to the emergency room after experiencing their first seizure or seizure-like event. For many, the journey that follows is frustrating and uncertain. Epilepsy is notoriously difficult to diagnose - so much so that nearly 30% of patients receive the wrong diagnosis. The most common mistake? Being told they have epilepsy when they do not. These misdiagnosed patients spend months or even years trying ineffective medications, enduring unnecessary side effects, and living with the fear of seizures they don’t actually have only to later discover they have a completely different condition. Why is diagnosing epilepsy so difficult? Unlike other diseases, there has been no reliable biomarker. Our team has identified an EEG-based biomarker for epilepsy, a game-changing discovery that is currently being tested in three major epilepsy centers across the U.S. This new tool, EpiScalp, has the potential to revolutionize epilepsy diagnosis, ensuring patients receive the right answers and the right treatment from their very first visit to a neurologist.
- Title:
- March 2026 Networking Night - IEEE Orange County Section
- Date:
- March 11th
6:30 PM (2 hours) - Location:
- Sgt. Pepperoni's Pizza Store
Irvine, CA - Abstract:
Join us for delicious pizza from Sgt Pepperoni's Pizza Store and meet other IEEE members in person at our monthly networking event in Irvine! There will be Senior IEEE members who can provide endorsement for members looking for senior membership. Please register with your IEEE #. There will be both meat and vegetarian pizza. If you have any projects, please bring them along!
Group photo - October 2025: https://r6.ieee.org/ocs/2025/10/october-2025-ieee-day-celebration/
- Title:
- Projected Field Electromagnets for Controllable Magnetic Field at a Point
- Date:
- March 11th
6:30 PM (1.5 hours) - Location:
- 1120 Ringwood Ct.
San Jose, CA - Abstract:
Ian Walker of GMW Associates will review the development of projected-field electromagnets for device testing.
- Title:
- Seattle EMC and AP/ED/MTT Joint Chapter Half-Day Workshop on EMC and Aerospace Measurement Challenges
- Date:
- March 12th
1:00 PM (4 hours) - Location:
- 2-122
Seattle, WA - Abstract:
TECHNICAL PROGRAM
This program is dedicated to the memory of Omar Zubi, Boeing's longtime EMC Lab Manager, who passed away suddenly on January 31, 2026.
EMC Challenges for ‘New Space’ Small Satellite Development
By Russell Carroll, EMI/EMC Consulting Engineer, EMI Sleuth, El Segundo, CA, USA
Abstract: This presentation discusses EMC challenges seen by engineers in the ‘new space’ world of small satellite development. These challenges include non-standardized launch vehicle and host interface requirements, unspecified lightning protection requirements, and schedule constraints on EMC testing and development. Technical challenges include power and signal isolation, crosstalk from long pigtails in wire harnesses, limited physical space for filters and shielding, and large apertures in the vehicle faraday cage.
Speaker Biography: Russell Carroll is a consulting engineer with extensive experience in the analysis, design, and testing of electromagnetic effects on units and systems including space satellites and industrial electronics. His research is focused on developing useful analysis tools and methods for unit and system level EMC analysis. Mr. Carroll is a registered Professional Engineer and an iNARTE certified EMC Engineer. He received the B.S. and M.S. degrees in electrical engineering from the University of Alaska Fairbanks in 2013 and 2014. He may be reached at russell@emisleuth.com.
CISPR and ANSC C63® Overview on Site Validation Measurements from 18 GHz to 40 GHz - Latest Advances in EMC Test Site Evaluation Using Advanced Antenna Measurement Techniques
By Zhong Chen, Chief Engineer, ETS-Lindgren, Cedar Park, Texas, USA
Abstract: This presentation introduces a novel approach for EMC chamber validation beyond 18 GHz, currently under consideration in ANSI C63 and CISPR standards. By integrating Cylindrical Mode Filtered Site Voltage Standing Wave Ratio (CMF SVSWR) with Compressed Sensing (CS), we address inherent challenges in traditional SVSWR methods, such as inconsistency and slow data acquisition. CMF SVSWR utilizes circular path measurements and mode domain post-processing to discern antenna and chamber reflections, crucial for comprehensive VSWR analysis. Compressed Sensing, a data-driven machine learning technique, exploits signal sparsity to reconstruct data from fewer randomly sampled measurement points, thereby reducing test times and eliminating the need for precise turntable positioning.
Speaker Biography: Zhong Chen is Chief Engineer at ETS-Lindgren, located in Cedar Park, Texas. He has more than 25 years of experience in RF testing, anechoic chamber design, as well as EMC antenna and field probe design and measurements. He is an active member of the ANSC C63® committee currently serving as Vice-Chair and is the immediate past Chair of Subcommittee 1 which is responsible for the antenna calibration (ANSI C63.5) and chamber/test site validation standards (ANSI C63.4 and the ANSI C63.25 series). Mr. Chen is chair of the IEEE Standard 1309 committee responsible for developing calibration standards for field probes, and IEEE Standard 1128 for absorber evaluation. He is a former member of the IEEE EMC Society Board of Governors and the Antenna Measurement Techniques Association (AMTA) Board of Directors. He is a past Distinguished Lecturer for the EMC Society and is recognized as an AMTA Fellow. His research interests include measurement uncertainty, time domain measurements for site validation and antenna calibration, and development of novel RF absorber materials. Several papers authored and co-authored by Mr. Chen have received best paper recognition at global conferences. Zhong Chen received his M.S.E.E. degree in Electromagnetics from the Ohio State University at Columbus. He may be reached at zhong.chen@ets-lindgren.com.
EMC Lab Tour and Demo Overview
By Dennis Lewis, Technical Fellow, The Boeing Company, and Zhong Chen, ETS-Lindgren
Abstract:
We will demonstrate how data post-processing can be used to extract antenna and chamber parameters.
The first demo highlights time-domain techniques for evaluating absorber performance in anechoic chambers. In aerospace EMC testing, measurements are typically performed per MIL-STD 461, which requires only 10 dB attenuation above 250 MHz—allowing chambers to remain relatively reflective and without system-level validation. Using time-gated antenna reflection measurements, we show a practical method to verify and quantify actual chamber performance.
If time permits, we will also demonstrate the Cylindrical Mode Filtered (CMF) technique. This method measures the antenna pattern with an intentional offset (e.g., placing the antenna at the edge of the turntable). The complex S21 versus angle at each frequency is transformed into the spectral domain, where filtering removes chamber contributions mathematically, producing a “clean” antenna pattern even in a nonideal environment. For site validation, standing-wave ripples are obtained by comparing the original chamber pattern to the filtered result. The demo will cover the full measurement workflow, including real-time post-processing. The CMF SVSWR technique is under consideration in the draft ANSI C63.25.3 by ANSC C63 and in CISPR 16 site validation standards for EMC test sites from 18 GHz to 40 GHz.
- Title:
- IEEE OC Section ExCom Meeting - March 12th 2026, MOVED ON-LINE
- Date:
- March 12th
6:30 PM (1.8 hours) - Abstract:
IEEE Orange County Section Executive Committee Monthly meeting - occurs every 2nd Thursday of the month. This March is an exception as our IEEE OC Chair was not available on the second Thursday of the month.
All IEEE OC Committee/Chapter/Affinity/SIG Chair/Key Volunteers (or their proxy) are requested to attend. Other IEEE members are also welcome to attend. Please RVSP here to receive the meeting login information. Routine attendance is required to qualify for your chapter annual IEEE rebate.
To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.
- Title:
- IEEE Foothill YP & Members: Pi Day Pizza & Networking Mixer
- Date:
- March 14th
12:00 PM (2 hours) - Location:
- 1 N Indian Hill Blvd
Claremont, CA - Abstract:
Join the IEEE Foothill Section for a casual "Pi Day" Pizza & Mixer in Claremont!
Since it’s March 14th (3.14), we are celebrating the best way engineers know how—with circular food and great conversation. This event is all about direct connection, bringing together Students, Young Professionals (YP), and Section Members for a lunch of informal networking and community building.
There is no formal agenda or presentation—just a space for our local engineering community to meet face-to-face and celebrate Pi Day together.
What to bring/expect:
Networking: Shake hands and meet the people driving technology in the Foothill area.
Career Growth: Bring your resume or digital contact info if you're looking for feedback or new opportunities.
Advice: Students and recent grads are encouraged to come and ask seasoned professionals for career insights.
Community: Find out how to get more involved with the IEEE Foothill Section.
Please RSVP by registering so we can get an accurate headcount for the space. We look forward to seeing you there!
- Title:
- IEEE MOVE USA - 10th Anniversary Townhall
- Date:
- March 17th
6:30 AM (1.5 hours) - Abstract:
Come join us for MOVE’s 10th Anniversary Town Hall Meeting—a special opportunity to celebrate a decade of impact and hear from leaders shaping the future of MOVE.
Featured speakers include:
Mary Ellen Randall, MOVE Founder & IEEE President
Barry Tilton, IEEE-USA President
Brad Kieserman, Vice President, Disaster Operations & Logistics, American Red Cross National Headquarters
MOVE Global and Local Leads: Francisco Carrero, Loretta Arellano, and Sadhana Attavar, highlighting key achievements from 2025 and what’s ahead in 2026
Learn more about MOVE’s 10-year journey, upcoming milestones, and the celebrations planned throughout the anniversary year. We hope you’ll join us for this engaging and informative event.
- Title:
- Open Source FPGA Projects Roundtable
- Date:
- March 17th
10:00 AM (1 hour) - Abstract:
Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.
- Title:
- IEEE Richland Section Ex-Com Meeting Mar 17 2026
- Date:
- March 17th
5:45 PM (1.2 hours) - Location:
- 1435 George Washington Way
Richland, WA - Abstract:
Scheduling IEEE Richland EX-COM Meeting for 2026
Location: Round Table Pizza, 1435 George Washington Way, Richland, WA 99352Food and social gathering at 5:45 PM, business meeting at 6:00 PM
Date(s) – Feb 17, Mar 17, Apr 21, May 19, June 16, July 21, Aug 18, Sept 15, Oct 20, Nov 17, and Dec 15________________________________________________________________________________
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- Title:
- Eastern Idaho Section ExCom
- Date:
- March 18th
4:30 PM (1.5 hours) - Abstract:
Bi-Monthly ExCom Meeting held on the third Wednesday of every odd month.
- Title:
- Chapter Open House and talk on AI Infrastructure
- Date:
- March 18th
4:45 PM (1.2 hours) - Location:
- Dr. Martin Luther King, Jr. Library (SJSU)
San Jose, CA - Abstract:
Join us for a talk on how SmartNICs and RDMA Power AI in the Cloud, and get insights into the state of the Chapter.
Training modern Large Language Models (LLMs) requires tens of thousands of GPUs acting as a single "AI Supercomputer." To build this "AI Hypercomputer," we must first address the CPU bottlenecks of traditional general-purpose networking. This talk begins by analyzing why standard TCP/IP processing limits Model Training performance and introduces the concept of "Kernel Bypass" and the role of SmartNICs in offloading network processing from the host CPU. We will explore why modern AI clusters have moved toward hardware offloads (like RDMA) to achieve the high throughput and low latency required for GPU-to-GPU communication. We will also discuss the specific challenges of running lossless transport protocols over lossy Ethernet, where congestion and packet drops can cause severe performance degradation ("tail latency") in large-scale training jobs. The session concludes by analyzing the architectural design patterns required to optimize flow control and ensure reliable delivery in massive AI infrastructure environments.
This event features a leading industry expert from Google addressing this important topic, followed by updates on the state of our chapter from the IEEE CIS SCV Chair.
🎤 Talk 1
The Infrastructure of AI: How SmartNICs and RDMA Power the Cloud
Speaker: Sujithra Periasamy, Google🎤 Talk 2
State of the Chapter
Speaker: Dr. Vishnu S. Pendyala, Chair, IEEE CIS Santa Clara Valley Chapter
- Title:
- Birds of a Feather: Our Favorite DIY Projects
- Date:
- March 18th
9:30 PM (2 hours) - Location:
- Zippy's Vineyard
Honolulu, HI - Abstract:
Our Favorite DIY Projects
Our Birds of a Feather (BOF) meetings are about sharing.
Come and share (tell us about) your favorite hand-built project.What makes it special?
Should our young engineers (or students) build it too?
Are there "simple" and inexpensive projects that really show off (visualize or experience) an engineering concept?
So much of modern technology is invisible. Miniaturized into invisibility.
Are there projects that bring concepts back into view?Are there projects we should bring to the young engineers?
This meeting is a no-host event. Come and share a drink or a meal together.
- Title:
- IEEE PES Lecture: Power Electronics Modernizing the Power Grid
- Date:
- March 19th
5:00 PM (1.2 hours) - Abstract:
The present power grid faces increasing challenges arising from congestion and blackouts associated with high penetration of distributed energy resources (DERs) and growing demand, compounded by lagging infrastructure upgrades. This presentation discusses how advanced power electronics is modernizing existing transmission and distribution networks. It further highlights the development of universal One-Cycle Control–based power electronic systems for rapid and precise control of grid operations, with objectives including the enhancement of power quality, provision of reactive power support, and mitigation of congestion. Case studies demonstrate that these approaches enhance system resilience, operational flexibility, and overall efficiency, thereby supporting sustainable long-term growth.
About the Speaker:
Keyue Ma Smedley, Keyue Smedley, IEEE Fellow, received her BS in EE from Zhejiang University and her MS and Ph.D. in EE from Caltech. Dr. Smedley was the chief designer of magnet power converters for all accelerator rings at DOE Superconducting Super Collider Lab in early 1990s. She is currently a Professor in EECS, University of California, Irvine (UCI) and Founder/Director of the UCI Power Electronics Lab since 1992. In addition, she is a co-founder of One-Cycle Control, Inc., that commercializes OCC technology. Dr. Smedley’s research is in power electronics. She is the inventor of the One-Cycle Control (OCC) method. Initially groundbreaking in high-fidelity audio applications during 1990s, OCC later unified four-quadrant control of single and three-phase power converters in the early 2000s. Today, OCC technology is widely applied across various market sectors, including professional audio, renewables, storage, power quality, grid stabilization, and defense. Dr. Smedley’s team also invented the Hexagram multilevel converter in the late 2000s, deployed and tested the first fault current limiter on the U.S. grid in the 2010s, and demonstrated OCC-DVC technology for fast and precise grid control during the same period. More recently, her team has achieved breakthroughs in full-range gain control of resonant switched-capacitor converters, opening the door to magnetic-less power conversion and enabling significant reductions in the size and weight of power electronic converters. Dr. Smedley is dedicated to innovation and impact. Her research has yielded >200 publications, >15 US and international patents, two startup companies, and wide industry acceptance. She has received numerous recognitions, including UCI Innovation Award in 2005, IEEE Fellow in 2008, and a DOD Achievement Award in Pentagon 2010 with OCC, Inc. She was an IEEE PEL Distinguished Lecturer in 2021-2024. Dr. Smedley won 2024 IEEE Power Electronics Society RD Middlebrook Achievement Award.
- Title:
- Edge AI Meets Wireless Systems: Implications for Connectivity, Architecture, and RF Design
- Date:
- March 23rd
6:00 PM (2.5 hours) - Location:
- Sobrato Campus for Discovery and Innovation
Santa Clara, CA - Abstract:
- Title:
- Open Source FPGA Projects Roundtable
- Date:
- March 24th
10:00 AM (1 hour) - Abstract:
Zoom call hosted by Open Research Institute (ORI). IEEE members and guests are welcome. This is a technical roundtable of FPGA projects from the Open Source hardware community. Participants report what they've done over the past week, what they have planned for the next week, if they have any roadblocks, and if they need any resources. The roundtable is sometimes followed by open office hours if anyone has additional questions or discussions.
- Title:
- Wearable Sensors and Artificial Intelligence Algorithms for Monitoring Chronic and Infectious Diseases
- Date:
- March 25th
11:00 AM (1 hour) - Abstract:
The majority of the health care costs related to the treatment of chronic and infectious diseases are attributed to direct care costs (e.g., hospital admissions and readmissions). The prevalence of chronic diseases and associated costs in the United States is growing at an alarming pace. The COVID-19 pandemic has further impacted the health of high-risk individuals by increasing the likelihood of more severe illness for those with underlying health conditions and associated healthcare costs. There have been ample efforts from researchers and clinicians to develop remote healthcare systems and wearable devices to manage patients with chronic and infectious diseases in home settings, which has reduced the burden on inpatient care facilities and gained further momentum during the COVID-19 pandemic. Yet, there is a lack of reliable wearable devices that can provide clinically acceptable information to healthcare professionals, as well as a lack of emphasis on validating wearable and artificial intelligence technologies in representative populations to enable a reliable and equitable remote health management system. This talk will present the challenges and potential solutions for developing tools (i.e., wearable sensors and computational algorithms) for reliable and equitable remote patient monitoring systems for chronic and infectious diseases.
- Title:
- IEEE OC PES Chapter Planning Meeting - March 25th 2026
- Date:
- March 25th
12:00 PM (1 hour) - Location:
- Applied Innovation Building
Irvine, CA - Abstract:
This is an in-person planning meeting for PES ExCom
59 meetings. Generated Tuesday, February 24 2026, at 4:42:12 PM. All times America/Los_Angeles

