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42 meetings
- Title:
- IEEE/CN - July 2026 Meeting "From Hidden IP Value to Courtroom Proof" - Shahram Shafie, MS ECE
- Date:
- July 20th
5:30 PM (2 hours) - Location:
- Leucadia Pizza UTC / La Jolla
San Diego, CA - Abstract:
Monday, July 20, 2026
5:30pm – 7:30 pm
IEEE Consultants' Network: JULY 2026 Meeting ("Home Base")
From Hidden IP Value to Courtroom Proof:
A Silicon-to-System Framework for IP EvaluationShahram Shafie, MS ECE
Engineering Expert Network: Antenna, ASIC, Algorithm | 4G/5G/6G, Radar, Wi‑Fi, SATCOM | Patent Litigation SME Sourcing & Expert Witness Support | For IP Law Firms, Startups & Venture Capital Firms
TOPIC
Many deep-technology programs encounter technical ambiguity not because the underlying innovation lacks merit, but because system-level interpretation, integration realities, and architecture assumptions are not fully understood until late-stage scrutiny occurs.
This presentation explores how engineering value can become hidden, misinterpreted, or vulnerable when evaluated only within narrow product contexts rather than through broader system-level analysis. Using antenna systems and distributed RF behavior as representative examples, the discussion examines how technical primitives, architecture mapping, physical behavior, and real-world deployment constraints influence technical defensibility and interpretation.
The discussion draws on observed patterns from real engineering and litigation contexts to illustrate how system-level interpretation influences technical outcomes in practice.
The session presents a structured silicon-to-system perspective on evaluating complex engineering systems, with particular emphasis on antenna, ASIC, algorithm, wireless, radar, and SATCOM-related technologies.
LOCATION:
Leucadia Pizza UTC / La Jolla
7748 Regents Rd
San Diego, CAMenu: https://leucadiapizza.com/menus/utc
COST:
Free, but you are responsible for your own food/drinks/gratuity
Order at the counterPARKING:
Ample parking in front of restaurantAre you on our LinkedIn group?
Meetup Link for this meeting: https://www.meetup.com/san-diego-ieee-meetup/events/315014144/
- Title:
- The Data-Centric Workflow, Now With an Agent
- Date:
- July 21st
5:30 PM (1 hour) - Abstract:
6th Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)
- Title:
- IEEE Richland Section Ex-Com Meeting July 21
- Date:
- July 21st
5:45 PM (1.2 hours) - Location:
- 1435 George Washington Way
Richland, WA - Abstract:
Scheduling IEEE Richland EX-COM Meeting for 2026
Location: Round Table Pizza, 1435 George Washington Way, Richland, WA 99352Food and social gathering at 5:45 PM, business meeting at 6:00 PM
Date(s) – July 21, Aug 18, Sept 15, Oct 20, Nov 17, and Dec 15________________________________________________________________________________
Microsoft Teams Need help?
Meeting ID: 243 106 218 013 08
Passcode: Xe2Zg9bj
Dial in by phone
+1 509-408-1681,,938429775# United States, Liberty Lake
Phone conference ID: 938 429 775#
For organizers: Meeting options | Reset dial-in PIN
________________________________________________________________________________
- Title:
- PCB Material Characterization for Measurement-Simulation Correlation
- Date:
- July 21st
6:00 PM (2 hours) - Location:
- Q
San Diego, CA - Abstract:
This talk provides an overview of some prominent laminate material characterization techniques that are crucial for evaluating laminate permittivity and losses. These techniques are compared and contrasted with newer in-situ methodologies that excel at extracting parameters that yield highly accurate measurement-simulation correlation, highlighting where they excel and where they fall short.
The talk also demonstrates some common phenomena that can lead to dispersion in the measured time delay and effective dielectric constant, namely anomalous dispersion from discontinuities and non-TEM dispersion in microstrip structures.
- Title:
- IEEE-USA Livestream Webinar | Battling Burnout: How To Stay Effective When The Demands Don't Stop
- Date:
- July 22nd
11:00 AM (1 hour) - Abstract:
IEEE-USA will be streaming this presentation on our social channels. The webinar will be recorded.
Battling Burnout: How to Stay Effective When the Demands Don’t Stop is a practical, research-informed professional development workshop for high performers, leadership teams, and career-serious professionals. Led by David Sandhu, a former rocket scientist turned leadership speaker, the session helps participants understand how burnout builds gradually and gives them a clear framework for sustaining high performance without running themselves into the ground. Participants learn how to recover from stress, understand their real capacity, make better trade-offs under pressure, set boundaries without damaging their reputation, align their time with what matters most, and protect their energy and identity long term.
- Title:
- Navigating Your Career to Adjust for Changing Skills Demands
- Date:
- July 23rd
5:00 PM (4 hours) - Location:
- 550 Columbia Point Drive
Richland, WA - Abstract:
- Please join EWS-SWE and IEEE Women in Engineering (WIE) for a Joint Technical meeting with dinner at Anthony’s and speaker Evelyn Hirt presenting on "Navigating Your Career to Adjust for Changing Skills Demands"Where: Anthony’s at Columbia Point, 550 Columbia Point Drive Richland WA, 99352When: Thursday July 23rdSocial time: 5PMDinner: 6PMPresentation: 7PMCost: for professionals, for studentsMenu: Includes salad, non-alcoholic drinks, and one of three entrees. Meal Choices include:
Roasted Ocean Prawns GF: Oven roasted with garlic butter, lemon and gremolata.
Lemon Chicken: Chargrilled chicken breast marinated in lemon zest and Herbes de Provence served over basmati rice pilaf.
Pasta Primavera: Fresh fettuccine tossed with seasonal vegetables and our herbed cream sauce. Finished with Parmesan cheese.
RSVP by 2PM Monday July 20th:
https://www.paypal.com/ncp/payment/XEDEV3TCUK4QW
- Title:
- STAK Energy Project Aaka - North Slope Power Campus Development
- Date:
- July 24th
12:30 PM (1.5 hours) - Location:
- Engineering & Industry Building (EIB)
Anchorage, AK - Abstract:
Please join us for the IEEE Alaska July Section meeting. This month’s program features a presentation on the STAK Energy Project Aaka, a multi-gigawatt, off-grid natural gas fired power plant on Alaska's North Slope by Ginger Kane, Project Director.
We will meet in person on the UAA campus. Park in the UAA Engineering & Industry Building south parking lot, come in the west building entrance, and head up to room 413.
UAA parking is free on Fridays.
Zoom will be available for those unable to join us on campus.
A complimentary light lunch will be provided, so advance registration is required. IEEE membership is NOT required to register.
- Title:
- IEEE Lecture - Co-Design and Tools for Heterogeneous Integration - Challenges and Opportunities
- Date:
- July 24th
3:00 PM (1.5 hours) - Location:
- Qualcomm Building Q Auditorium
San Diego, CA - Abstract:
The advent of artificial intelligence, high-performance computing, data centers, health, automotive and communication is driving the quest for more creative integration methods. Future packaging technologies will exhibit high interconnect densities and large numbers of diverse components and devices. Such schemes are expected to offer relaxed transactions between components, increased bandwidth, and better energy efficiency. To achieve these potentials, the implementation of these systems will require assistance from design tools that can handle unmatched levels of complexity and highly complex computational challenges. This talk will address recent developments in computer-aided design (CAD) tools for interconnects and packages. We will emphasize the signal integrity, power and bandwidth requirements. Multi-domain and multi-physics challenges will be explored as well as potential co-design solutions.
- Title:
- Fundamentals of Artificial Intelligence Security
- Date:
- July 24th
3:00 PM (1 hour) - Abstract:
Artificial Intelligence (AI) is rapidly transforming industries and organizations, but its growing adoption also introduces new security risks and challenges. This talk provides an introduction to the fundamentals of AI security, focusing on threats and vulnerabilities affecting AI models and applications. Participants will learn about common AI attacks, security risks associated with Generative AI and Large Language Models (LLMs), and fundamental approaches for protecting AI systems.
- Title:
- IEEE Seattle Bowling - Striking Connections
- Date:
- July 24th
6:00 PM (2 hours) - Location:
- Kenmore Lanes
Kenmore, WA - Cost:
- Admission fee may apply
- Abstract:
You're invited to join us for our IEEE bowling event, hosted at Kenmore Lanes, co-hosted by the IEEE Seattle Section SAC and the IEEE Seattle YP Affinity Group! Strengthen your professional and social network with other members in the community while enjoying a wonderful game of bowling. Our goal is simply to have fun together. There will be free food and drinks provided.
Before you enter, here are the registration fees:
- IEEE Members:
- Non-Members:
- Students: Free
- Title:
- From Data to Decisions: Smart Manufacturing Analytics in Semiconductor Production
- Date:
- July 24th
6:00 PM (1 hour) - Abstract:
Modern semiconductor fabs generate vast amounts of data from equipment, processes, sensors, metrology tools, and factory automation systems. The real challenge is transforming this data into actionable insights that improve yield, quality, productivity, and operational efficiency.
Join the IEEE Oregon Section Joint EDS & MTT-S Chapter for the webinar, "From Data to Decisions: Smart Manufacturing Analytics in Semiconductor Production."
This session will explore how advanced analytics, AI/ML, predictive maintenance, digital twins, and smart manufacturing technologies are enabling data-driven decision-making in semiconductor factories. Attendees will gain insights into how leading fabs use real-time data to optimize performance, enhance equipment utilization, and drive operational excellence.
Ideal for students, researchers, engineers, and industry professionals interested in the future of smart semiconductor manufacturing.
- Title:
- IEEE Hawaiʻi WIE Girls' Night Out: Piece by Piece
- Date:
- July 24th
9:00 PM (2 hours) - Location:
- 98-1005 Moanalua Rd
Aiea, HI - Abstract:
Join IEEE Hawaiʻi Women in Engineering (WIE) for a relaxing and creative Girls' Night Out! Take a break from work and school to unwind with fellow IEEE members while enjoying a Studio Ghibli puzzle activity and DIY keychain making.
This event is a wonderful opportunity to build friendships, network with other women in STEM, and enjoy a fun, welcoming evening together.
✨ Come relax, create, and connect with the IEEE WIE community. We look forward to seeing you!
🎨 Activities- 🧩 Complete a Studio Ghibli puzzle together
- 🔑 Design and create your own personalized keychain
- 💬 Enjoy conversations and connect with fellow women in engineering and STEM
IEEE members, students, and friends interested in supporting the IEEE WIE community are welcome.
- Title:
- Closed-Loop Intelligence: How AI Plans, Connects, Fails, and Learns Across the Hyperscale Infrastructure Lifecycle
- Date:
- July 25th
9:00 AM (2 hours) - Location:
- 1015 N Quincy St, Arlington
Airlington, VA - Abstract:
At AWS scale, a single capacity planning error misallocates hundreds of millions in CapEx. Spreadsheets don't survive at this velocity — closed-loop AI systems do.
This session delivers a practitioner's unfiltered view from inside hyperscale infrastructure planning at AWS. We examine how AI pipelines connect demand forecasting, gap analysis, build planning, and rack deployment into a single end-to-end system and what that looks like in operational reality. We explore how feedback loops enable planning systems to detect model drift, recalibrate on actuals, and compound forecast accuracy over time.
But intelligence without failure analysis is incomplete. We confront what happens when the forecast is wrong at scale, how failure cascades across procurement, deployment, and customer commitments, and how human-in-the-loop governance and explainable AI contain the damage and restore trust.
AI that plans, connects, fails, and learns.
- Title:
- IEEE Oregon Section Summer Social 2026
- Date:
- July 25th
10:00 AM (5 hours) - Location:
- Next Level Pinball Shop & Museum
Hillsboro - Cost:
- Admission fee may apply
- Abstract:
Please attend the 2026 IEEE Oregon Section Summer Social at Next Level Pinball Shop & Museum
25 July 2026 for individuals and for families.Food and entrance are included in the entry fee. Doors open 10:00am. We will be in the party room with Lunch snacks and beverages from 10:30 to 12:30 There will be food options for vegetarian, gluten free, dairy free, or regular.
- Title:
- Virtual Region 6 Volunteer all-hands
- Date:
- July 25th
11:00 AM (1.5 hours) - Abstract:
Dear IEEE Region 6 Volunteers,
Please plan on attending all or as much of this all-hands meeting as possible. There is much to discuss.
This event is open to all Region 6 volunteers (those who receive or should be receiving emails from this listserv: r6-leadership@listserv.ieee.org
- Title:
- Call for volunteers, Summer STEM Workshop: Continue Team Race Car Building
- Date:
- July 27th
2:00 PM (5 hours) - Location:
- 27709 Tyrrell Ave
Hayward, CA - Abstract:
- Calling all volunteers to join our Summer STEM Youth Workshop where you'll get hands-on experience with build a car servos, learn the mechanics behind it and race an obstacle course/ track! We will be helping students who build ACEBOTT 5DOF Smart Robot Arm Car Kit, 4WD Remote Control Car: Amazon Link (https://www.amazon.com/dp/B0DHX9QW5N?ref=ppx_yo2ov_dt_b_fed_asin_title&th=1) Because we have limited space available, registration will be first come, first served. There will be a mandatory zoom training for all volunteers working with children.
Sign up to volunteer today! Google Form Link (https://forms.gle/KSkkUYPK2QVNQrKS7)
Event DetailsWhere: Glad Tidings Family Life Complex
When: 7/27, 2pm to 7:00pm.
Who: For volunteering, college students and professionals are welcome to join!
Why STEM Education MattersSTEM education is more than just learning about technology or engineering—it’s about developing critical thinking, creativity, and problem-solving skills that are essential in today’s world. By exposing your child to STEM:
- Help them discover new interests and talents.
- Prepare them for high-paying and rewarding careers.
- Show them that they can be creators, innovators, and leaders.
Schedule:
2:15 - 2:30 PM | Welcome & Kickoff
- Welcome
- Event Overview
- Review of safety rules
- Introduction of volunteers, experiment leads, and technology demonstrators
2:30 PM | Presentation #1
Three classes (Build New Car/ attach Robot Arm, Troubleshoot Car/ Review/ Coding, and Art class)
2:45 PM- 5 PM | Build Car and Logo Art Design
5:00 PM– 5:40 PM | Dinner
6:00 PM– 6:45 PM | Finish Car Building, and Test obstacle course/ race track
6:45 – 7:00 PM | Closing, Photos & Thank You
Our Program’s Commitment
Through our partnership with the IEEE Oakland-East Bay Section, TryEngineering, and Glad Tidings, we are dedicated to fostering a supportive and inclusive environment. Here’s why this program is unique:
Mentors Who Care: STEM professionals from your community will guide your child every step of the way.
- Hands-On Learning: Engaging activities like designing bridges, building robots, and creating LED circuits make learning exciting.
Equity in Education: Our goal is to provide access and opportunity to all children, particularly those in underrepresented communities.
Parent InvolvementWe understand the vital role parents play in their child’s success. During the event, you’ll:
- See firsthand how STEM activities boost confidence and teamwork.
- Learn about free and affordable resources to continue your child’s STEM journey.
- Meet other parents who share the same goal of empowering their children.
This is a chance to show your child that their dreams matter and that they belong in STEM fields. Secure your spot today!
Register by March 23th
To ensure we have the proper supplies and resources, please RSVP by end of day March. 23, so we can better plan the workshop.Together, let’s inspire a generation of problem solvers, innovators, and dreamers. We look forward to seeing you there!
Warm regards,
Aaron Lin, IEEE
Benita McLarin, Glad Tidings
- Title:
- IEEE San Diego APS/CASS/EDS/MTTS/SSCS Chapter presents a Double-Header of Distinguished Lectures
- Date:
- July 27th
3:30 PM (2.5 hours) - Location:
- Qualcomm Q Auditorium
San Diego, CA - Abstract:
- Two phenomenal speakers. All we need for this to be a perfect afternoon of presentations is your participation. RSVP today!
Distinguished Lecturer Talk #1: Gilson Wirth 3:30-4:45pm PDTDistinguished Lecturer Talk #2: Xinfei Guo 4:45-5:45pm PDT
- Title:
- 2026 GET-AI SERIES: 4 . Driving Business Efficiency with AI
- Date:
- July 27th
4:30 PM (2.5 hours) - Location:
- Beall Applied Innovation
IRVINE, CA - Abstract:
Artificial Intelligence is rapidly transforming how organizations generate revenue, streamline operations, and automate complex business processes. From intelligent sales prospecting and personalized customer engagement to autonomous AI agents capable of reasoning, planning, and executing multi-step workflows, AI is becoming an essential driver of business efficiency and competitive advantage.
Following our June session on AI-Powered Productivity, the IEEE Orange County Computer Society GET-AI Series continues with a practical, demo-driven July session focused on how organizations can leverage AI to improve efficiency, reduce operational costs, accelerate business processes, and build intelligent enterprise applications.
This double-feature session combines business and technical perspectives to demonstrate how AI can optimize both customer-facing and enterprise workflows through intelligent automation, advanced prompting techniques, and production-ready AI agent architectures.
🔒 July Focus: Driving Business Efficiency with AIAs organizations increasingly adopt AI across their operations, the challenge is no longer simply using AI it is applying it strategically to create measurable business value.
This session explores how AI can help organizations:
- Improve operational efficiency through intelligent automation
- Reduce manual effort and operational costs
- Increase sales pipeline quality using AI-driven insights
- Automate repetitive business workflows
- Build enterprise-grade autonomous AI agents to Save Cost
Whether you're a business leader, consultant, architect, developer, product manager, or AI enthusiast, this session provides practical strategies and demonstrations that can be immediately applied within your organization.
Session 1: Building Efficient Enterprise AI Systems with LangGraph (45 mins)Through live demonstrations, this session explores how LangGraph enables developers to build production-ready AI systems that are reliable, scalable, and designed to create efficient enterprise workflows. Attendees will learn how to move beyond simple LLM applications to intelligent agent architectures that streamline operations, optimize resource utilization, and reduce the cost of developing and operating AI-powered solutions.
Topics include- LangGraph fundamentals
- Designing efficient AI workflows
- Enterprise AI agent architecture
- Memory and state management
- Tool orchestration and workflow automation
- Human-in-the-loop approvals
- Multi-agent collaboration
- Enterprise automation and cost optimization patterns
- Best practices for building scalable, production-ready AI systems
👉 Takeaway: Learn how to build efficient, enterprise-grade AI systems that automate complex workflows, optimize business operations, reduce development and operational costs, and deliver measurable business value through intelligent automation.
Session 2: AI-Powered Sales Intelligence: Building Smarter Pipelines with Intelligent Prospecting (45 Min)This session demonstrates how AI can fundamentally transform go-to-market execution by identifying real-time business opportunities through trigger events, market signals, sentiment analysis, and intelligent prospecting.
Through live demonstrations, attendees will learn how AI can generate highly personalized outreach, automate prospect research, and enable sales teams to focus on meaningful customer engagement instead of manual list building.
Topics include:- AI-driven sales intelligence
- Intelligent prospect discovery
- Event-driven customer engagement
- Effective prompting for business workflows
- Hyper-personalized outreach
- Reducing customer acquisition costs
- Improving pipeline quality through AI
👉 Takeaway: Learn how AI can improve sales efficiency, reduce manual effort, and create higher-quality business opportunities through intelligent automation.
About the OrganizerPradyumna Kodgi
Principal Product Manager | Oracle Health & AI
IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County
Member, IEEE AI Agentic Systems & AI Policy Committees📍 California, USA
📧 pkodgi@ieee.org
🔗 linkedin.com/in/pkodgi
- Title:
- IEEE IAS Lecture: Physical AI in Automotive Assembly
- Date:
- July 28th
5:00 PM (1.2 hours) - Abstract:
In this talk, we will explore the evolving automation landscape in automotive manufacturing as physical AI and humanoids emerge, unlocking new opportunities. We will analyze how specialized and end-2-end AI models are expanding the capabilities and operational envelope for robots in perception, grasping, manipulation and assembly tasks. The talk concludes with an industrial view and discussion around strategic factors influencing adoption of physical AI in serial production.
Dr. Parag Patre is an engineering leader with expertise in advanced robotics, physical AI, control systems, and autonomous technologies. Currently serving as a Senior Manager for Advanced Robotics at Magna International, with past tenures at Siemens, TE Connectivity and NASA — he specializes in bridging the gap between academic research and large-scale industrial applications. He holds a PhD in Mechanical Engineering from the University of Florida, a B.Tech. from IIT Madras, and is a widely published expert dedicated to industrializing advanced robotics.
- Title:
- San Diego IEEE Electronics Packaging Society (EPS) Meeting - Part 5
- Date:
- July 28th
5:00 PM (1.5 hours) - Location:
- Qualcomm Building S
San Diego, CA - Abstract:
We are organizing part5 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.
The agenda is as follows:
- Next technical lectures
- About EPS subsidy
- Webpage development & Linkedin page
- IMAPS collaboration
- Ask EPS for merchandise/swag
- Membership drive
- Invite student chapters
- Booth at local events
- Title:
- SusTech Talk July 2026 - Preparing for 100% Clean and Renewable Energy Systems
- Date:
- July 28th
6:00 PM (1 hour) - Abstract:
“Preparing for 100% Clean and Renewable Energy Systems”
with Dr Ahmed Mousa, Chief Innovation Officer for Galileo Group, Inc.
Date/Time: Tuesday, July 28, 6pm – 7 pm Pacific Time
Abstract:
This talk will outline the characteristics of 100% clean and renewable energy systems, and how we can prepare for them, considering the guidelines of IEEE Planet Positive. Utilities must supply critical leadership in addressing climate change, sustainability, socioeconomic issues, and environmental stewardship. The transition to a sustainable future requires balancing today’s short-term needs with future planning for 100% clean and renewable energy systems. Issues include global collaboration, the role of inverter-based resources, climate change mitigation, large load vs. energy efficiency/load management and the future role of energy control centers. Supporting equity and inclusion mandates planning for rural electrification and for providing affordable power to disadvantaged communities.
- Title:
- IEEE San Diego Section Life Member Affinity Group Monthly Meeting - July 28, 2026
- Date:
- July 28th
6:00 PM (3 hours) - Location:
- 124 Solna Hills Drive
Solana Beach, CA - Abstract:
Meeting Announcement: San Diego IEEE Life Members Affinity Group – Tuesday, July 28, 6 pm
Join us for our upcoming gathering!
We are pleased to announce the next meeting of the San Diego IEEE Life Members Affinity Group. All members are warmly invited to join us for an evening of camaraderie, conversation, and connection. This will be an in person meeting.
Meeting Details:· Date: Tuesday, June 23, 2026
· Time: 6:00 PM – 8:00 PM
· Location: Crust Pizzeria
· 124 Solana Hills Dr.
· Solana Beach, CA 92075
· Phone: 858.356.9925
Speaker: Dr. Stan Rifkin
Topic for Discussion: The Future of Electronics at the Subatomic Particle (Quantum) Level. (This was the topic that was supposed to be presented at our February meeting earlier this year.)
"Our Life Member roles in helping young people understand the future of electricity and electronics - at the subatomic level." We Life Members have exhibited considerable interest in helping students at all levels understand electricity, electronics, and our professions. I am wondering if we are preparing them for a different understanding of electricity than we learned, one that has gained currency (pun optional).
We encourage all San Diego IEEE Life Members to attend and to bring along any colleagues or friends who may be interested. This is a great opportunity to network, share ideas, and enjoy delicious food in a friendly setting.
If you have any questions or require further information, please contact the venue or reach out to Bill Torre, 619-417-9410. We look forward to seeing you there!
Virtual meeting access will also be provided, below is a Webex link:
Agenda
- Introductions
- Logistics - Order Food
- The Future of Electronics at the Subatomic Particle (Quantum) Level.
- Summary of Meeting with San Diego STEAM Generation (San Diego HS STEM)
- Next Meeting
Webex Meeting Information:
A Webex meeting link for this meeting will be sent out separately soon. Thanks.
- Title:
- Engaging Video Analytics and Generative AI
- Date:
- July 29th
5:30 PM (2 hours) - Location:
- Sobrato Campus for Discovery and Innovation (SCDI) Room 1302
Santa Clara, CA - Abstract:
In this talk, Dr. Jianquan Liu presents an industry perspective on the convergence of video analytics and generative AI. The talk begins with an overview of video analytics, covering advancements in action recognition, object tracking, human-object interactions, scene recognition, and behavioral pattern analysis. These technologies enable efficient extraction, retrieval, visualization, and summarization of video content. The presentation then explores the impact of generative AI, particularly large language models (LLMs), on video understanding. It discusses how LLMs enhance object recognition, semantic segmentation, action recognition, captioning, visual question answering, and storytelling. Dr. Liu provides industry case studies to illustrate these applications while also addressing limitations and challenges. The talk introduces NEC's narrative summarization framework, designed to tackle key challenges in video analytics. It concludes with a demonstration of "Video with LLM" technology, showcasing its practical application in automating traffic accident investigation reports. This presentation offers valuable insights into the current state and future potential of AI-driven video intelligence, bridging the gap between technical innovation and practical application for both industry professionals and general audiences.
- Title:
- IEEE CENTRAL COAST FREE EVENT – 29 JULY @ 6PM @ Encina Meadows Clubhouse - “The Alarming Problem of Trash in Space” - Dr. Behrooz Parhami UCSB Distinguished Professor Emeritus
- Date:
- July 29th
6:00 PM (2.5 hours) - Location:
- Clubhouse
Goleta, CA - Abstract:
Humans have managed to pollute the land, the seas, and the atmosphere of our precious planet. We now realize the dangers of such pollution and are working hard to reverse, to the extent possible, the processes that create such pollution. Another kind of pollution is beginning to endanger our well-being as a species. The problem is often referred to as “space junk.” In the seven decades since the advent of space flight in 1957, we have launched a large number of satellites, some of which are still functional and provide valuable services in communications, monitoring, observation, navigation, and surveillance. The number of such satellites has been growing steadily and is slated for even greater growth with our insatiable need for additional communication bandwidth and proposals for exotic projects such as energy harvesting and space-based data centers. Alongside the functioning satellites, we also have dead satellites and a host of space trash: Discarded rocket parts, ballistic missile pieces, debris created by explosions or collision between space objects, dropped tools, coolant droplets, and thermal paint flakes. Until now, we have managed to deal with such space junk, given the fairly low density of objects and the vastness of space. We are now at a critical stage when detection followed by evasive maneuvers to dodge space junk is becoming less feasible. NASA estimates that by early 2025, there were more than 25,000 fairly large objects in Earth's orbit. The number of space junk items may increase exponentially due to collisions between existing items. It is high time that we give serious thought to dealing with trash in space, as we do on Earth.
- Title:
- IEEE Oakland-East Bay Communications Society Distinguished Lecturer Series
- Date:
- July 29th
6:00 PM (1.5 hours) - Abstract:
The IEEE Oakland-East Bay Communications Society Chapter is pleased to host an IEEE Communications Society Distinguished Lecturer presentation by Dr. Wei Gao, Principal Engineer at Broadcom.
Presentation Title
Meta-Learning-Assisted Predistortion for Power Amplifier Linearization in Wireless Communication Systems
Abstract
Modern wireless communication systems require highly efficient RF power amplifiers while maintaining excellent signal linearity. This presentation introduces recent advances in AI-assisted digital predistortion techniques, focusing on meta-learning-based approaches that improve power amplifier linearization for IEEE 802.11 Wi-Fi systems. The talk discusses practical implementation challenges, optimization techniques, and industrial applications developed through years of experience at Broadcom.
Speaker
Dr. Wei Gao
IEEE Communications Society Distinguished Lecturer (2025–2026)
Principal Engineer, BroadcomEveryone is welcome, including IEEE members, students, researchers, and industry professionals.
- Title:
- Video Coding Standards in the Age of AI
- Date:
- July 30th
6:00 PM (3 hours) - Location:
- Tencent Office
Palo Alto, CA - Abstract:
The IEEE Signal Processing Society Industry Board and Santa Clara Valley Chapter are pleased to announce an upcoming event on Video Coding Standards in the Age of AI which will be held on July 30, 2026 in Palo Alto, CA.
As AI continues to evolve, it is playing an increasingly important role in next-generation signal processing and multimedia technologies. At the same time, major international and open-source standardization organizations are actively exploring how AI can be integrated into future standards. This event will bring together experts from industry and the standards community to discuss the latest advances in AI for video coding, current standardization efforts, and future research directions.
Speakers
This event features distinguished speakers from industry and standardization community:
- Arianne Hinds (INCITS L3 Chair)
- Debargha Mukherjee (Google, Principal Engineer / Director)
- Alican Nalci (Meta, Research Scientist)
- Leo Zhao (Tencent, Principal Research Scientist)
Whether you are a researcher, engineer, student, or practitioner interested in AI and video compression, we warmly welcome you to join us for an evening of technical discussions and networking with leaders from academia and industry.
- Title:
- IEEE OC Senior Membership Elevation Dinner - July 2026
- Date:
- July 31st
6:00 PM (2 hours) - Location:
- Mimi's Cafe
Irvine, CA - Cost:
- Admission fee may apply
- Abstract:
One of the requirements for elevation for Membership in IEEE is to have a minimum of 2 senior members to write recommendation letters in support of the the enrollee/ candidate. As many do not know many Senior Members, the Orange County IEEE Section will be conducting an Elevation Day with Senior members present to provide the needed support.
https://www.ieee.org/membership/senior
Announcing…
IEEE Senior Member Grade
Elevation NightSponsored by the IEEE Orange County Section
Date: 31 July 2026
Time: 6 p.m. to 8 p.m.
Where: Mimi's Cafe, 4030 Barranca Pkwy, Irvine, CA 92604Who: All IEEE Members who qualify for Senior Membership
You are invited to an important event – an opportunity to apply for IEEE Senior Member grade!
All IEEE members who meet the qualifications below are encouraged to attend and meet with Senior Members, Fellows, and Honorary Members. Bring your application, obtain Senior Member references and learn more about what Senior membership means. Refreshments are complimentary.
Do you qualify as a Senior Member?
1) Candidates shall be an engineer, scientist, educator, technical executive, or originator in IEEE-designated fields (Bylaw 1-104.11)
2) Candidates shall have been in professional practice for at least ten years (see full qualifications)
3) Candidates shall have shown “significant performance” over a period of at least five of those years in professional practice.
For all information and the application form
https://www.ieee.org/membership/seniorPlease bring to the event four copies of both your completed application form and your detailed resume or CV, complete with full details and a strict timeline of dates.
IEEE Senior Members, or above, are invited as reviewers and endorsers. Event has limited seating. This event is exclusive to IEEE members applying for IEEE Senior Membership or serving as reviewers and endorsers, other individuals are kindly asked to refrain from attending this special event. If your availability or willingness to attend changes, please contact the organizing team to cancel your registration to allow for others to attend.
Questions?
Contact Dr Ahmed Saber - ahmed.saber@etap.com
IEEE Senior Members Make a Difference!
- Title:
- IEEE Alaska - August ExCom Meeting
- Date:
- August 4th
7:00 PM (1.5 hours) - Abstract:
IEEE Alaska Executive Committee Meeting
Tuesday, August 4, 2026 ⋅ 6:00 – 7:30pm (Alaska Time - Anchorage)
Jeremie Smith is inviting you to a scheduled Zoom meeting using the IEEE Alaska Section Account
Join Zoom Meeting
https://zoom.us/j/98832778456?pwd=WnhVWFpOOGQ0YkZEVnlqMlJjWG5lZz09Meeting ID: 988 3277 8456
Passcode: 269832Please register if you will be attending.
- Title:
- IEEE Hawaii August ExCom
- Date:
- August 4th
8:30 PM (1 hour) - Location:
- TBD
Honolulu, HI - Abstract:
August Executive Committee Meeting
- Title:
- IEEE PES SEATTLE EXCOM MEETING
- Date:
- August 5th
8:00 PM (1 hour) - Abstract:
EXCOM Meeting for IEEE PES Seattle Officers
- Title:
- Dual Seed Semi-Additive and Damascene Processes: Enabling Fine-Pitch Interconnects for Advanced Packaging
- Date:
- August 6th
4:00 PM (1 hour) - Abstract:
As AI, high-performance computing, and heterogeneous integration continue to scale, advanced packaging is facing growing interconnect challenges across redistribution layers, IC substrates, HDI boards, silicon vias, and emerging glass-core platforms. Higher bandwidth and larger package form factors require finer wiring, smaller vias, higher fan-out density, and more reliable vertical interconnects. In this context, copper seed formation and via metallization are becoming increasingly important bottlenecks for next-generation package and substrate scaling.
Conventional copper deposition technologies, including physical vapor deposition, electroless plating, and electroplating, each play essential roles in today’s manufacturing flows. However, as via structures become smaller, deeper, rougher, or higher in aspect ratio, limitations such as step coverage, liquid circulation, process uniformity, and seed-layer continuity become more difficult to manage. These challenges are especially relevant across multiple interconnect layers, including motherboard HDI PCBs, IC substrates, RDL, memory and interposer silicon vias, and Si BEOL metal, etc.
This presentation will introduce Nano Copper Deposition as a solution family for AI-era interconnect scaling. The talk will cover DeepVia™ HDI for high-aspect-ratio via metallization in motherboard HDI PCBs, DS-SAP™ for resolving the trade-off between thin surface seed layers and robust via coverage in IC substrates, and other applications such as Dual Seed Damascene for fine and high-aspect-ratio damascene structures in BEOL and RDL applications, and DeepVia™ Silicon for memory and interposer silicon vias. The discussion will highlight how these approaches can support higher I/O density, improved escape routing, reduced layer-count dependency, and broader process flexibility for next-generation advanced packaging.
- Title:
- IEEE Seattle Student Intern / YP Hangout
- Date:
- August 7th
3:00 PM (6 hours) - Location:
- Log Boom Park
Kenmore, WA - Abstract:
We hope you are having a great summer break. We are excited to invite student interns, recent graduates, young professionals, and industry leaders to our outdoor casual networking event at Log Boom Park in Kenmore, WA. Enjoy this relaxed setting to connect and share your experiences. Food and drinks will be provided.
We look forward to seeing you there.
- Title:
- IEEE Electronic Packaging Design and Characterization Summer School 2026
- Date:
- August 10th
8:00 AM (3 days) - Location:
- San Diego State University
San Diego, CA - Abstract:
The IEEE Electronics Packaging Society (EPS) San Diego Chapter, in partnership with San Diego State University (SDSU), is pleased to present a three-day summer school focused on the fundamentals and emerging trends in electronic packaging design and characterization.
The program is designed for senior undergraduate students, graduate students, recent graduates, and practicing engineers interested in advanced packaging technologies, heterogeneous integration, signal integrity, power integrity, thermal management, materials, package characterization, and electronic design automation.
- Title:
- IEEE OC PES/IAS Chapter ExCom Meeting - July 1st 2026, MOVED ON-LINE
- Date:
- August 10th
6:00 PM (0 minute) - Abstract:
IEEE Orange County PES/IAS Chapter's ExCom meeting
All IEEE OC PES/IAS Chapter members are requested to attend this meeting.
To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.
- Title:
- SusTech Talk August 2026 – Heat Adaptation in Practice: Community-Facing Approaches to Extreme Heat in Singapore and India
- Date:
- August 11th
6:00 PM (1 hour) - Abstract:
“Heat Adaptation in Practice: Community-Facing Approaches to Extreme Heat in Singapore and India”
with Veerappan Swaminathan, CEO of SL2 Group, Singapore
Date/Time: Tuesday, August 11, 6pm – 7 pm Pacific Time
Abstract:
Extreme heat is an increasingly urgent climate adaptation challenge, especially for older adults and heat-vulnerable households living in dense urban and tropical environments. While heat resilience is often discussed through the lens of policy, urban planning, or public health, effective adaptation also depends on practical socio-technical systems that can work in real homes, care facilities, and communities.
This talk will share lessons from two ongoing community-facing projects: StayCool in Singapore, which combines heat and humidity sensors, physiological wearables, an app, heat alerts, and trained volunteers to support vulnerable households; and a heat adaptation project at Muthiyor Nanban Home in Tamil Nadu, India, which uses site assessment, environmental measurement, stakeholder engagement, and targeted interventions to improve thermal comfort for elderly residents. The talk will highlight implementation lessons for engineers interested in climate resilience, sensing, community systems, and adaptation in practice.
- Title:
- CHEERS OCEANEERS! August 12th, 2026 - Teagan Darling of Miramar College Engineering Club: RoboSub 2026
- Date:
- August 12th
5:30 PM (3 hours) - Location:
- Quantum Brewing
San Diego, CA - Abstract:
CHEERS OCEANEERS! August 12th, 2026
This month is about RoboSub! Our main presentation is from Teagan Darling and other team members from Miramar College Engineering Club.
Miramar College Engineering Club: RoboSub 2026 Overview
The Miramar College Engineering Club just competed in its first year of the RoboSub competition. This competition tasks students from around the world with creating Autonomous Underwater Vehicles (AUVs) with the goal of completing a series of increasingly difficult tasks and claiming the title of RoboSub 2026 Champion.
This talk will give an overview of the team’s trials, tribulations, innovative fixes, spectacular… let’s call them missteps, and great connections formed over the past year.
In addition, we will have Leverett Bezanson, Chair of the Marine Technology Society (MTS), present information about their last cycle of internships including some details about the projects that they worked on.
***Welcome to the monthly event for the IEEE Oceanic Engineering Society (OES), San Diego Chapter, which is hosting this meeting jointly along with TMA BlueTech (The Maritime Alliance), and MTS (Marine Technology Society).
Please join us for the main presentation and also plenty of time for networking and friendly conversation about everything oceanic, engineering, science, Blue Tech, and more. No need to be an IEEE or OES member, or TMA, or MTS. Everyone is invited.
This month, we will be at Quantum Brewing again, a cool science-themed brewery founded by a biochemist.
No ticket required, but please order something for yourself from the brewery.
Please grab a bite from a nearby restaurant, which is okay to bring into the brewery per the owner.
The food and drinks are not being funded by the hosts. Please open your own tab.
- Title:
- IEEE Hawaii YP August ExCom
- Date:
- August 12th
8:30 PM (1 hour) - Location:
- 733 Bishop Street
Honolulu, HI - Abstract:
August ExCom
- Title:
- IEEE OC Section ExCom Meeting - August 13th, 2026, ONLINE
- Date:
- August 13th
6:30 PM (2 hours) - Abstract:
IEEE Orange County Section Executive Committee Monthly meeting - occurs every 2nd Thursday of the month.
All IEEE OC Committee/Chapter/Affinity/SIG Chair/Key Volunteers (or their proxy) are requested to attend. Other IEEE members are also welcome to attend. Please RSVP here to receive the meeting login information. Routine attendance is required to qualify for your chapter's annual IEEE rebate.
To AVOID unauthorized attendance, you MUST REGISTER for this event so that you can be sent the meeting link.
- Title:
- From Physics to Flash: An Industry Perspective on 3D NAND Technology, Reliability, and High-Performance SSDs
- Date:
- August 14th
1:00 PM (1 hour) - Abstract:
Three-dimensional NAND flash memory has become a cornerstone of modern data storage, powering everything from mobile devices to hyperscale data centers fueling the AI revolution. As the industry pushes toward both higher storage density through aggressive
vertical scaling and faster operation to meet the demands of next-generation highperformance SSDs, low-latency AI/ML workloads, and real-time data-intensive applications, the challenges of maintaining robust device reliability grow increasingly complex. This talk provides an industry perspective on the co-evolution of 3D NAND density and performance, covering advances in cell architecture and scaling strategies alongside the reliability challenges that arise when optimizing for both capacity and speed. The presentation will also share practical insights on working as an engineer in the semiconductor memory industry and the career path from academia to industry, aimed at students and young professionals entering the field
- Title:
- AI Adoption Exchange – IEEE San Diego (Informal Networking)
- Date:
- August 14th
6:30 PM (0 minute) - Location:
- Del Mar Highlands Town Center (Sky Deck area)
San Diego, CA - Abstract:
How are companies actually adopting AI today?
This informal IEEE networking session is designed for engineers, researchers, and industry practitioners to share real-world experiences around AI adoption — what’s working, what’s not, and where teams are facing challenges.
This is not a talk or presentation.
There are no slides — just a curated, peer-level discussion.Topics may include:
- Where teams are in their AI adoption journey (experimentation → production)
- Use of LLMs and AI systems in real-world workflows
- Challenges in scaling AI beyond prototypes
- Measuring impact and ROI
- Build vs. buy decisions
The session is intentionally kept small to enable meaningful interaction.
Format- Short introductions (name, role, current AI focus)
- Open discussion guided by participant experiences
- Informal networking
- Engineers and ML practitioners working on AI systems
- Product and platform leaders involved in AI adoption
- Founders and technical decision-makers
- Researchers interested in applied AI systems
- No presentations or sales pitches
- Participation is encouraged — come ready to share and learn
- Limited capacity to maintain quality of discussion
Chhavi Jain
Vice Chair, IEEE Signal Processing Society – San Diego ChapterThis session is part of an ongoing IEEE initiative to connect practitioners working on real-world AI systems and deployment challenges.
- Title:
- Among Us Night
- Date:
- August 14th
7:00 PM (2 hours) - Abstract:
- Title:
- Excomm (August) - PES Chapter of IEEE Boise Section (Monthly)
- Date:
- August 17th
10:30 AM (1 hour) - Location:
- Micron Engineering Center (MEC)
Boise, ID - Abstract:
This is the monthly PES chapter's Executive Committee meeting. Typically, an hour to discuss old business and new business.
We focus on the upcoming events. Senior member activity, Section Picnic, and Holiday Party, Future City Event. + technical events.
42 meetings. Generated Monday, July 20 2026, at 11:54:23 AM. All times America/Los_Angeles

