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Title:
IEEE/CN - July 2026 Meeting "From Hidden IP Value to Courtroom Proof" - Shahram Shafie, MS ECE
Date:
July 20th
5:30 PM (2 hours)
Location:
Leucadia Pizza UTC / La Jolla
San Diego, CA
Abstract:

Monday, July 20, 2026

5:30pm – 7:30 pm

 IEEE Consultants' Network: JULY 2026 Meeting ("Home Base")

 From Hidden IP Value to Courtroom Proof:
A Silicon-to-System Framework for IP Evaluation

 

 

 Shahram Shafie, MS ECE

Engineering Expert Network: Antenna, ASIC, Algorithm | 4G/5G/6G, Radar, WiFi, SATCOM | Patent Litigation SME Sourcing & Expert Witness Support | For IP Law Firms, Startups & Venture Capital Firms

 

TOPIC

Many deep-technology programs encounter technical ambiguity not because the underlying innovation lacks merit, but because system-level interpretation, integration realities, and architecture assumptions are not fully understood until late-stage scrutiny occurs. 

This presentation explores how engineering value can become hidden, misinterpreted, or vulnerable when evaluated only within narrow product contexts rather than through broader system-level analysis. Using antenna systems and distributed RF behavior as representative examples, the discussion examines how technical primitives, architecture mapping, physical behavior, and real-world deployment constraints influence technical defensibility and interpretation. 

The discussion draws on observed patterns from real engineering and litigation contexts to illustrate how system-level interpretation influences technical outcomes in practice. 

The session presents a structured silicon-to-system perspective on evaluating complex engineering systems, with particular emphasis on antenna, ASIC, algorithm, wireless, radar, and SATCOM-related technologies.

 

LOCATION:
Leucadia Pizza UTC / La Jolla
7748 Regents Rd
San Diego, CA

Menu: https://leucadiapizza.com/menus/utc

COST: 
Free, but you are responsible for your own food/drinks/gratuity
          Order at the counter

 

PARKING:
Ample parking in front of restaurant

Are you on our LinkedIn group?

Meetup Link for this meeting:  https://www.meetup.com/san-diego-ieee-meetup/events/315014144/ 

Title:
The Data-Centric Workflow, Now With an Agent
Date:
July 21st
5:30 PM (1 hour)
Abstract:

6th Lecture of IEEE CS San Diego's 2026 Invited Seminar Series (Virtual)

Title:
IEEE Richland Section Ex-Com Meeting July 21
Date:
July 21st
5:45 PM (1.2 hours)
Location:
1435 George Washington Way
Richland, WA
Abstract:

Scheduling IEEE Richland EX-COM Meeting for 2026

Location: Round Table Pizza, 1435 George Washington Way, Richland, WA 99352

Food and social gathering at 5:45 PM, business meeting at 6:00 PM

Date(s) –  July 21, Aug 18, Sept 15, Oct 20, Nov 17, and Dec 15

________________________________________________________________________________

Microsoft Teams Need help?

Join the meeting now

Meeting ID: 243 106 218 013 08

Passcode: Xe2Zg9bj

Dial in by phone

+1 509-408-1681,,938429775# United States, Liberty Lake

Find a local number

Phone conference ID: 938 429 775#

For organizers: Meeting options | Reset dial-in PIN

________________________________________________________________________________

Title:
PCB Material Characterization for Measurement-Simulation Correlation
Date:
July 21st
6:00 PM (2 hours)
Location:
Q
San Diego, CA
Abstract:

This talk provides an overview of some prominent laminate material characterization techniques that are crucial for evaluating laminate permittivity and losses. These techniques are compared and contrasted with newer in-situ methodologies that excel at extracting parameters that yield highly accurate measurement-simulation correlation, highlighting where they excel and where they fall short.

The talk also demonstrates some common phenomena that can lead to dispersion in the measured time delay and effective dielectric constant, namely anomalous dispersion from discontinuities and non-TEM dispersion in microstrip structures.

 

 

Title:
IEEE-USA Livestream Webinar | Battling Burnout: How To Stay Effective When The Demands Don't Stop
Date:
July 22nd
11:00 AM (1 hour)
Abstract:

IEEE-USA will be streaming this presentation on our social channels. The webinar will be recorded.

Battling Burnout: How to Stay Effective When the Demands Don’t Stop is a practical, research-informed professional development workshop for high performers, leadership teams, and career-serious professionals. Led by David Sandhu, a former rocket scientist turned leadership speaker, the session helps participants understand how burnout builds gradually and gives them a clear framework for sustaining high performance without running themselves into the ground. Participants learn how to recover from stress, understand their real capacity, make better trade-offs under pressure, set boundaries without damaging their reputation, align their time with what matters most, and protect their energy and identity long term. 

 

Title:
Navigating Your Career to Adjust for Changing Skills Demands
Date:
July 23rd
5:00 PM (4 hours)
Location:
550 Columbia Point Drive
Richland, WA
Abstract:
Please join EWS-SWE and IEEE Women in Engineering (WIE) for a Joint Technical meeting with dinner at Anthony’s and speaker Evelyn Hirt presenting on "Navigating Your Career to Adjust for Changing Skills Demands"Where: Anthony’s at Columbia Point, 550 Columbia Point Drive Richland WA, 99352When: Thursday July 23rdSocial time: 5PMDinner: 6PMPresentation: 7PMCost:  for professionals, for studentsMenu:  Includes salad, non-alcoholic drinks, and one of three entrees.   Meal Choices include:

Roasted Ocean Prawns GF: Oven roasted with garlic butter, lemon and gremolata.

Lemon Chicken: Chargrilled chicken breast marinated in lemon zest and Herbes de Provence served over basmati rice pilaf.

Pasta Primavera: Fresh fettuccine tossed with seasonal vegetables and our herbed cream sauce. Finished with Parmesan cheese.

 RSVP by 2PM Monday July 20th:
https://www.paypal.com/ncp/payment/XEDEV3TCUK4QW
Title:
STAK Energy Project Aaka - North Slope Power Campus Development
Date:
July 24th
12:30 PM (1.5 hours)
Location:
Engineering & Industry Building (EIB)
Anchorage, AK
Abstract:

Please join us for the IEEE Alaska July Section meeting. This month’s program features a presentation on the STAK Energy Project Aaka, a multi-gigawatt, off-grid natural gas fired power plant on Alaska's North Slope by Ginger Kane, Project Director.

We will meet in person on the UAA campus.  Park in the UAA Engineering & Industry Building south parking lot, come in the west building entrance, and head up to room 413.

UAA parking is free on Fridays.

Zoom will be available for those unable to join us on campus. 

A complimentary light lunch will be provided, so advance registration is required. IEEE membership is NOT required to register.

 
Title:
Fundamentals of Artificial Intelligence Security
Date:
July 24th
3:00 PM (1 hour)
Abstract:

Artificial Intelligence (AI) is rapidly transforming industries and organizations, but its growing adoption also introduces new security risks and challenges. This talk provides an introduction to the fundamentals of AI security, focusing on threats and vulnerabilities affecting AI models and applications. Participants will learn about common AI attacks, security risks associated with Generative AI and Large Language Models (LLMs), and fundamental approaches for protecting AI systems. 

Title:
IEEE Lecture - Co-Design and Tools for Heterogeneous Integration - Challenges and Opportunities
Date:
July 24th
3:00 PM (1.5 hours)
Location:
Qualcomm Building Q Auditorium
San Diego, CA
Abstract:

The advent of artificial intelligence, high-performance computing, data centers, health, automotive and communication is driving the quest for more creative integration methods. Future packaging technologies will exhibit high interconnect densities and large numbers of diverse components and devices. Such schemes are expected to offer relaxed transactions between components, increased bandwidth, and better energy efficiency. To achieve these potentials, the implementation of these systems will require assistance from design tools  that can handle unmatched levels of complexity and highly complex computational challenges. This talk will address recent developments in computer-aided design (CAD) tools for interconnects and packages. We will emphasize the signal integrity, power and bandwidth requirements. Multi-domain and multi-physics challenges will be explored as well as potential co-design solutions.

Title:
From Data to Decisions: Smart Manufacturing Analytics in Semiconductor Production
Date:
July 24th
6:00 PM (1 hour)
Abstract:

Modern semiconductor fabs generate vast amounts of data from equipment, processes, sensors, metrology tools, and factory automation systems. The real challenge is transforming this data into actionable insights that improve yield, quality, productivity, and operational efficiency.

Join the IEEE Oregon Section Joint EDS & MTT-S Chapter for the webinar, "From Data to Decisions: Smart Manufacturing Analytics in Semiconductor Production."

This session will explore how advanced analytics, AI/ML, predictive maintenance, digital twins, and smart manufacturing technologies are enabling data-driven decision-making in semiconductor factories. Attendees will gain insights into how leading fabs use real-time data to optimize performance, enhance equipment utilization, and drive operational excellence.

Ideal for students, researchers, engineers, and industry professionals interested in the future of smart semiconductor manufacturing.

Title:
IEEE Seattle Bowling - Striking Connections
Date:
July 24th
6:00 PM (2 hours)
Location:
Kenmore Lanes
Kenmore, WA
Cost:
Admission fee may apply
Abstract:

You're invited to join us for our IEEE bowling event, hosted at Kenmore Lanes, co-hosted by the IEEE Seattle Section SAC and the IEEE Seattle YP Affinity Group! Strengthen your professional and social network with other members in the community while enjoying a wonderful game of bowling. Our goal is simply to have fun together. There will be free food and drinks provided.

Before you enter, here are the registration fees:

  • IEEE Members:
  • Non-Members:
  • Students: Free

 

 

Title:
IEEE Hawaiʻi WIE Girls' Night Out: Piece by Piece
Date:
July 24th
9:00 PM (2 hours)
Location:
98-1005 Moanalua Rd
Aiea, HI
Abstract:

Join IEEE Hawaiʻi Women in Engineering (WIE) for a relaxing and creative Girls' Night Out! Take a break from work and school to unwind with fellow IEEE members while enjoying a Studio Ghibli puzzle activity and DIY keychain making.

This event is a wonderful opportunity to build friendships, network with other women in STEM, and enjoy a fun, welcoming evening together.

Come relax, create, and connect with the IEEE WIE community. We look forward to seeing you!

🎨 Activities
  • 🧩 Complete a Studio Ghibli puzzle together
  • 🔑 Design and create your own personalized keychain
  • 💬 Enjoy conversations and connect with fellow women in engineering and STEM
👥 Who Can Attend

IEEE members, students, and friends interested in supporting the IEEE WIE community are welcome.

Title:
Closed-Loop Intelligence: How AI Plans, Connects, Fails, and Learns Across the Hyperscale Infrastructure Lifecycle
Date:
July 25th
9:00 AM (2 hours)
Location:
1015 N Quincy St, Arlington
Airlington, VA
Abstract:

At AWS scale, a single capacity planning error misallocates hundreds of millions in CapEx. Spreadsheets don't survive at this velocity — closed-loop AI systems do.

This session delivers a practitioner's unfiltered view from inside hyperscale infrastructure planning at AWS. We examine how AI pipelines connect demand forecasting, gap analysis, build planning, and rack deployment into a single end-to-end system and what that looks like in operational reality. We explore how feedback loops enable planning systems to detect model drift, recalibrate on actuals, and compound forecast accuracy over time.

But intelligence without failure analysis is incomplete. We confront what happens when the forecast is wrong at scale, how failure cascades across procurement, deployment, and customer commitments, and how human-in-the-loop governance and explainable AI contain the damage and restore trust.

 

AI that plans, connects, fails, and learns.

Title:
IEEE Oregon Section Summer Social 2026
Date:
July 25th
10:00 AM (5 hours)
Location:
Next Level Pinball Shop & Museum
Hillsboro
Cost:
Admission fee may apply
Abstract:

Please attend the 2026 IEEE Oregon Section Summer Social at Next Level Pinball Shop & Museum

25 July 2026  for individuals and for families.Food and entrance are included in the entry fee. Doors open 10:00am. We will be in the party room with Lunch snacks and beverages from 10:30 to 12:30 There will be food options for vegetarian, gluten free, dairy free, or regular.
Title:
Virtual Region 6 Volunteer all-hands
Date:
July 25th
11:00 AM (1.5 hours)
Abstract:

Dear IEEE Region 6 Volunteers,

Please plan on attending all or as much of this all-hands meeting as possible. There is much to discuss.
This event is open to all Region 6 volunteers (those who receive or should be receiving emails from this listserv: r6-leadership@listserv.ieee.org

Title:
Call for volunteers, Summer STEM Workshop: Continue Team Race Car Building
Date:
July 27th
2:00 PM (5 hours)
Location:
27709 Tyrrell Ave
Hayward, CA
Abstract:
Calling all volunteers to join our Summer STEM Youth Workshop where you'll get hands-on experience with build a car servos, learn the mechanics behind it and race an obstacle course/ track! We will be helping students who build ACEBOTT 5DOF Smart Robot Arm Car Kit, 4WD Remote Control Car: Amazon Link (https://www.amazon.com/dp/B0DHX9QW5N?ref=ppx_yo2ov_dt_b_fed_asin_title&th=1) Because we have limited space available, registration will be first come, first served. There will be a mandatory zoom training for all volunteers working with children.

Sign up to volunteer today! Google Form Link (https://forms.gle/KSkkUYPK2QVNQrKS7)

Event Details

Where: Glad Tidings Family Life Complex

When: 7/27, 2pm to 7:00pm.

Who: For volunteering, college students and professionals are welcome to join!

Why STEM Education Matters

STEM education is more than just learning about technology or engineering—it’s about developing critical thinking, creativity, and problem-solving skills that are essential in today’s world. By exposing your child to STEM:

  • Help them discover new interests and talents.
  • Prepare them for high-paying and rewarding careers.
  • Show them that they can be creators, innovators, and leaders.

Schedule:

2:15 - 2:30 PM | Welcome & Kickoff

  • Welcome
  • Event Overview
  • Review of safety rules
  • Introduction of volunteers, experiment leads, and technology demonstrators

2:30 PM | Presentation #1

Three classes (Build New Car/ attach Robot Arm, Troubleshoot Car/ Review/ Coding, and Art class)

2:45 PM- 5 PM | Build Car and Logo Art Design

5:00 PM– 5:40 PM | Dinner  

6:00 PM– 6:45 PM | Finish Car Building, and Test obstacle course/ race track

6:45 – 7:00 PM | Closing, Photos & Thank You

 

Our Program’s Commitment

Through our partnership with the IEEE Oakland-East Bay Section, TryEngineering, and Glad Tidings, we are dedicated to fostering a supportive and inclusive environment. Here’s why this program is unique:

Mentors Who Care: STEM professionals from your community will guide your child every step of the way.

  • Hands-On Learning: Engaging activities like designing bridges, building robots, and creating LED circuits make learning exciting.

Equity in Education: Our goal is to provide access and opportunity to all children, particularly those in underrepresented communities. 

Parent Involvement

We understand the vital role parents play in their child’s success. During the event, you’ll:

  • See firsthand how STEM activities boost confidence and teamwork.
  • Learn about free and affordable resources to continue your child’s STEM journey.
  • Meet other parents who share the same goal of empowering their children.
Don’t Miss Out!

This is a chance to show your child that their dreams matter and that they belong in STEM fields. Secure your spot today!

Register by March 23th
To ensure we have the proper supplies and resources, please RSVP by end of day March. 23, so we can better plan the workshop.

Together, let’s inspire a generation of problem solvers, innovators, and dreamers. We look forward to seeing you there!

Warm regards,
Aaron Lin, IEEE
Benita McLarin, Glad Tidings

Title:
IEEE San Diego APS/CASS/EDS/MTTS/SSCS Chapter presents a Double-Header of Distinguished Lectures
Date:
July 27th
3:30 PM (2.5 hours)
Location:
Qualcomm Q Auditorium
San Diego, CA
Abstract:
Two phenomenal speakers. All we need for this to be a perfect afternoon of presentations is your participation. RSVP today!

Distinguished Lecturer Talk #1:  Gilson Wirth 3:30-4:45pm PDTDistinguished Lecturer Talk #2:  Xinfei Guo 4:45-5:45pm PDT

Title:
2026 GET-AI SERIES: 4 . Driving Business Efficiency with AI
Date:
July 27th
4:30 PM (2.5 hours)
Location:
Beall Applied Innovation
IRVINE, CA
Abstract:

 

Artificial Intelligence is rapidly transforming how organizations generate revenue, streamline operations, and automate complex business processes. From intelligent sales prospecting and personalized customer engagement to autonomous AI agents capable of reasoning, planning, and executing multi-step workflows, AI is becoming an essential driver of business efficiency and competitive advantage.

Following our June session on AI-Powered Productivity, the IEEE Orange County Computer Society GET-AI Series continues with a practical, demo-driven July session focused on how organizations can leverage AI to improve efficiency, reduce operational costs, accelerate business processes, and build intelligent enterprise applications.

This double-feature session combines business and technical perspectives to demonstrate how AI can optimize both customer-facing and enterprise workflows through intelligent automation, advanced prompting techniques, and production-ready AI agent architectures.

 

🔒 July Focus: Driving Business Efficiency with AI

As organizations increasingly adopt AI across their operations, the challenge is no longer simply using AI it is applying it strategically to create measurable business value.

This session explores how AI can help organizations:

  • Improve operational efficiency through intelligent automation
  • Reduce manual effort and operational costs
  • Increase sales pipeline quality using AI-driven insights
  • Automate repetitive business workflows
  • Build enterprise-grade autonomous AI agents to Save Cost

Whether you're a business leader, consultant, architect, developer, product manager, or AI enthusiast, this session provides practical strategies and demonstrations that can be immediately applied within your organization.

 

 

Session 1: Building Efficient Enterprise AI Systems with LangGraph (45 mins)

Through live demonstrations, this session explores how LangGraph enables developers to build production-ready AI systems that are reliable, scalable, and designed to create efficient enterprise workflows. Attendees will learn how to move beyond simple LLM applications to intelligent agent architectures that streamline operations, optimize resource utilization, and reduce the cost of developing and operating AI-powered solutions.

Topics include
  • LangGraph fundamentals
  • Designing efficient AI workflows
  • Enterprise AI agent architecture
  • Memory and state management
  • Tool orchestration and workflow automation
  • Human-in-the-loop approvals
  • Multi-agent collaboration
  • Enterprise automation and cost optimization patterns
  • Best practices for building scalable, production-ready AI systems

👉 Takeaway: Learn how to build efficient, enterprise-grade AI systems that automate complex workflows, optimize business operations, reduce development and operational costs, and deliver measurable business value through intelligent automation.

Session 2: AI-Powered Sales Intelligence: Building Smarter Pipelines with Intelligent Prospecting (45 Min)

This session demonstrates how AI can fundamentally transform go-to-market execution by identifying real-time business opportunities through trigger events, market signals, sentiment analysis, and intelligent prospecting.

Through live demonstrations, attendees will learn how AI can generate highly personalized outreach, automate prospect research, and enable sales teams to focus on meaningful customer engagement instead of manual list building.

Topics include:
  • AI-driven sales intelligence
  • Intelligent prospect discovery
  • Event-driven customer engagement
  • Effective prompting for business workflows
  • Hyper-personalized outreach
  • Reducing customer acquisition costs
  • Improving pipeline quality through AI

👉 Takeaway: Learn how AI can improve sales efficiency, reduce manual effort, and create higher-quality business opportunities through intelligent automation.

About the Organizer

Pradyumna Kodgi
Principal Product Manager | Oracle Health & AI
IEEE Senior Member | Vice Chair, IEEE EMBS – Orange County
Member, IEEE AI Agentic Systems & AI Policy Committees

📍 California, USA
📧 pkodgi@ieee.org
🔗 linkedin.com/in/pkodgi

Title:
San Diego IEEE Electronics Packaging Society (EPS) Meeting - Part 5
Date:
July 28th
5:00 PM (1.5 hours)
Location:
Qualcomm Building S
San Diego, CA
Abstract:

We are organizing part5 of the IEEE San Diego Electronics Packaging Society (EPS) chapter meeting.

The agenda is as follows:

  1. Next technical lectures
  2. About EPS subsidy
  3. Webpage development & Linkedin page
  4. IMAPS collaboration 
  5. Ask EPS for merchandise/swag 
  6. Membership drive
  7. Invite student chapters 
  8. Booth at local events 

 

Title:
IEEE IAS Lecture: Physical AI in Automotive Assembly
Date:
July 28th
5:00 PM (1.2 hours)
Abstract:


In this talk, we will explore the evolving automation landscape in automotive manufacturing as physical AI and humanoids emerge, unlocking new opportunities. We will analyze how specialized and end-2-end AI models are expanding the capabilities and operational envelope for robots in perception, grasping, manipulation and assembly tasks.  The talk concludes with an industrial view and discussion around strategic factors influencing adoption of physical AI in serial production.

 

 

Dr. Parag Patre is an engineering leader with expertise in advanced robotics, physical AI, control systems, and autonomous technologies. Currently serving as a Senior Manager for Advanced Robotics at Magna International, with past tenures at Siemens, TE Connectivity and NASA — he specializes in bridging the gap between academic research and large-scale industrial applications. He holds a PhD in Mechanical Engineering from the University of Florida, a B.Tech. from IIT Madras, and is a widely published expert dedicated to industrializing advanced robotics.

 

Title:
IEEE San Diego Section Life Member Affinity Group Monthly Meeting - July 28, 2026
Date:
July 28th
6:00 PM (3 hours)
Location:
124 Solna Hills Drive
Solana Beach, CA
Abstract:

Meeting Announcement: San Diego IEEE Life Members Affinity Group – Tuesday, July 28, 6 pm

Join us for our upcoming gathering!

We are pleased to announce the next meeting of the San Diego IEEE Life Members Affinity Group. All members are warmly invited to join us for an evening of camaraderie, conversation, and connection.  This will be an in person meeting.

Meeting Details:

·       Date: Tuesday, June 23, 2026

·       Time: 6:00 PM – 8:00 PM

·       Location: Crust Pizzeria

·       124 Solana Hills Dr.

·       Solana Beach, CA 92075

·       Phone: 858.356.9925

 

Speaker: Dr. Stan Rifkin

Topic for Discussion: The Future of Electronics at the Subatomic Particle (Quantum) Level. (This was the topic that was supposed to be presented at our February meeting earlier this year.)

 "Our Life Member roles in helping young people understand the future of electricity and electronics - at the subatomic level."  We Life Members have exhibited considerable interest in helping students at all levels understand electricity, electronics, and our professions. I am wondering if we are preparing them for a different understanding of electricity than we learned, one that has gained currency (pun optional).

 

We encourage all San Diego IEEE Life Members to attend and to bring along any colleagues or friends who may be interested. This is a great opportunity to network, share ideas, and enjoy delicious food in a friendly setting.

If you have any questions or require further information, please contact the venue or reach out to Bill Torre, 619-417-9410. We look forward to seeing you there!

Virtual meeting access will also be provided, below is a Webex link:

Agenda

  1. Introductions
  2. Logistics  - Order Food
  3. The Future of Electronics at the Subatomic Particle (Quantum) Level.
  4. Summary of Meeting with San Diego STEAM Generation (San Diego HS STEM)
  5. Next Meeting

 

Webex Meeting Information:

 

A Webex meeting link for this meeting will be sent out separately soon.  Thanks.

 

 

Title:
SusTech Talk July 2026 - Preparing for 100% Clean and Renewable Energy Systems
Date:
July 28th
6:00 PM (1 hour)
Abstract:

“Preparing for 100% Clean and Renewable Energy Systems”

with Dr Ahmed Mousa, Chief Innovation Officer for Galileo Group, Inc.

Date/Time: Tuesday, July 28, 6pm – 7 pm Pacific Time

Abstract:

This talk will outline the characteristics of 100% clean and renewable energy systems, and how we can prepare for them, considering the guidelines of IEEE Planet Positive. Utilities must supply critical leadership in addressing climate change, sustainability, socioeconomic issues, and environmental stewardship. The transition to a sustainable future requires balancing today’s short-term needs with future planning for 100% clean and renewable energy systems. Issues include global collaboration, the role of inverter-based resources, climate change mitigation, large load vs. energy efficiency/load management and the future role of energy control centers. Supporting equity and inclusion mandates planning for rural electrification and for providing affordable power to disadvantaged communities.

 

Title:
Engaging Video Analytics and Generative AI
Date:
July 29th
5:30 PM (2 hours)
Location:
Sobrato Campus for Discovery and Innovation (SCDI) Room 1302
Santa Clara, CA
Abstract:

In this talk, Dr. Jianquan Liu presents an industry perspective on the convergence of video analytics and generative AI. The talk begins with an overview of video analytics, covering advancements in action recognition, object tracking, human-object interactions, scene recognition, and behavioral pattern analysis. These technologies enable efficient extraction, retrieval, visualization, and summarization of video content. The presentation then explores the impact of generative AI, particularly large language models (LLMs), on video understanding. It discusses how LLMs enhance object recognition, semantic segmentation, action recognition, captioning, visual question answering, and storytelling. Dr. Liu provides industry case studies to illustrate these applications while also addressing limitations and challenges. The talk introduces NEC's narrative summarization framework, designed to tackle key challenges in video analytics. It concludes with a demonstration of "Video with LLM" technology, showcasing its practical application in automating traffic accident investigation reports. This presentation offers valuable insights into the current state and future potential of AI-driven video intelligence, bridging the gap between technical innovation and practical application for both industry professionals and general audiences.

 

Title:
IEEE Oakland-East Bay Communications Society Distinguished Lecturer Series
Date:
July 29th
6:00 PM (1.5 hours)
Abstract:

The IEEE Oakland-East Bay Communications Society Chapter is pleased to host an IEEE Communications Society Distinguished Lecturer presentation by Dr. Wei Gao, Principal Engineer at Broadcom.

Presentation Title

Meta-Learning-Assisted Predistortion for Power Amplifier Linearization in Wireless Communication Systems

Abstract

Modern wireless communication systems require highly efficient RF power amplifiers while maintaining excellent signal linearity. This presentation introduces recent advances in AI-assisted digital predistortion techniques, focusing on meta-learning-based approaches that improve power amplifier linearization for IEEE 802.11 Wi-Fi systems. The talk discusses practical implementation challenges, optimization techniques, and industrial applications developed through years of experience at Broadcom.

Speaker

Dr. Wei Gao
IEEE Communications Society Distinguished Lecturer (2025–2026)
Principal Engineer, Broadcom

Everyone is welcome, including IEEE members, students, researchers, and industry professionals.

Title:
IEEE CENTRAL COAST FREE EVENT – 29 JULY @ 6PM @ Encina Meadows Clubhouse - “The Alarming Problem of Trash in Space” - Dr. Behrooz Parhami UCSB Distinguished Professor Emeritus
Date:
July 29th
6:00 PM (2.5 hours)
Location:
Clubhouse
Goleta, CA
Abstract:

Humans have managed to pollute the land, the seas, and the atmosphere of our precious planet. We now realize the dangers of such pollution and are working hard to reverse, to the extent possible, the processes that create such pollution. Another kind of pollution is beginning to endanger our well-being as a species. The problem is often referred to as “space junk.” In the seven decades since the advent of space flight in 1957, we have launched a large number of satellites, some of which are still functional and provide valuable services in communications, monitoring, observation, navigation, and surveillance. The number of such satellites has been growing steadily and is slated for even greater growth with our insatiable need for additional communication bandwidth and proposals for exotic projects such as energy harvesting and space-based data centers. Alongside the functioning satellites, we also have dead satellites and a host of space trash: Discarded rocket parts, ballistic missile pieces, debris created by explosions or collision between space objects, dropped tools, coolant droplets, and thermal paint flakes. Until now, we have managed to deal with such space junk, given the fairly low density of objects and the vastness of space. We are now at a critical stage when detection followed by evasive maneuvers to dodge space junk is becoming less feasible. NASA estimates that by early 2025, there were more than 25,000 fairly large objects in Earth's orbit. The number of space junk items may increase exponentially due to collisions between existing items. It is high time that we give serious thought to dealing with trash in space, as we do on Earth.

Title:
Video Coding Standards in the Age of AI
Date:
July 30th
6:00 PM (3 hours)
Location:
Tencent Office
Palo Alto, CA
Abstract:

The IEEE Signal Processing Society Industry Board and Santa Clara Valley Chapter are pleased to announce an upcoming event on Video Coding Standards in the Age of AI which will be held on July 30, 2026 in Palo Alto, CA.

As AI continues to evolve, it is playing an increasingly important role in next-generation signal processing and multimedia technologies. At the same time, major international and open-source standardization organizations are actively exploring how AI can be integrated into future standards. This event will bring together experts from industry and the standards community to discuss the latest advances in AI for video coding, current standardization efforts, and future research directions.

Speakers

This event features distinguished speakers from industry and standardization community:

  • Arianne Hinds (INCITS L3 Chair)
  • Debargha Mukherjee (Google, Principal Engineer / Director)
  • Alican Nalci (Meta, Research Scientist)
  • Leo Zhao (Tencent, Principal Research Scientist)

Whether you are a researcher, engineer, student, or practitioner interested in AI and video compression, we warmly welcome you to join us for an evening of technical discussions and networking with leaders from academia and industry.

Title:
IEEE OC Senior Membership Elevation Dinner - July 2026
Date:
July 31st
6:00 PM (2 hours)
Location:
Mimi's Cafe
Irvine, CA
Cost:
Admission fee may apply
Abstract:

One of the requirements for elevation for Membership in IEEE is to have a minimum of 2 senior members to write recommendation letters in support of the the enrollee/ candidate. As many do not know many Senior Members, the Orange County IEEE Section will be conducting an Elevation Day with Senior members present to provide the needed support.

https://www.ieee.org/membership/senior

Announcing…

 

IEEE Senior Member Grade
Elevation Night

Sponsored by the IEEE Orange County Section

 

 

Date:   31 July 2026

Time:  6 p.m. to 8 p.m.
Where:  Mimi's Cafe, 4030 Barranca Pkwy, Irvine, CA 92604

Who:  All IEEE Members who qualify for Senior Membership

 

You are invited to an important event – an opportunity to apply for IEEE Senior Member grade!

 

All IEEE members who meet the qualifications below are encouraged to attend and meet with Senior Members, Fellows, and Honorary Members. Bring your application, obtain Senior Member references and learn more about what Senior membership means. Refreshments are complimentary.

 

Do you qualify as a Senior Member?

1)      Candidates shall be an engineer, scientist, educator, technical executive, or originator in IEEE-designated fields (Bylaw 1-104.11)

2)      Candidates shall have been in professional practice for at least ten years (see full qualifications)

3)      Candidates shall have shown “significant performance” over a period of at least five of those years in professional practice.

 

For all information and the application form
https://www.ieee.org/membership/senior

 

Please bring to the event four copies of both your completed application form and your detailed resume or CV, complete with full details and a strict timeline of dates.

IEEE Senior Members, or above, are invited as reviewers and endorsers. Event has limited seating. This event is exclusive to IEEE members applying for IEEE Senior Membership or serving as reviewers and endorsers, other individuals are kindly asked to refrain from attending this special event. If your availability or willingness to attend changes, please contact the organizing team to cancel your registration to allow for others to attend.

 

Questions?

Contact Dr Ahmed Saber - ahmed.saber@etap.com

 

IEEE Senior Members Make a Difference!

Title:
IEEE Alaska - August ExCom Meeting
Date:
August 4th
7:00 PM (1.5 hours)
Abstract:

IEEE Alaska Executive Committee Meeting

Tuesday, August 4, 2026 ⋅ 6:00 – 7:30pm (Alaska Time - Anchorage)

Jeremie Smith is inviting you to a scheduled Zoom meeting using the IEEE Alaska Section Account

Join Zoom Meeting
https://zoom.us/j/98832778456?pwd=WnhVWFpOOGQ0YkZEVnlqMlJjWG5lZz09

Meeting ID: 988 3277 8456
Passcode: 269832

Please register if you will be attending.

Title:
IEEE Hawaii August ExCom
Date:
August 4th
8:30 PM (1 hour)
Location:
TBD
Honolulu, HI
Abstract:

August Executive Committee Meeting

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
August 5th
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Dual Seed Semi-Additive and Damascene Processes: Enabling Fine-Pitch Interconnects for Advanced Packaging
Date:
August 6th
4:00 PM (1 hour)
Abstract:

     As AI, high-performance computing, and heterogeneous integration continue to scale, advanced packaging is facing growing interconnect challenges across redistribution layers, IC substrates, HDI boards, silicon vias, and emerging glass-core platforms. Higher bandwidth and larger package form factors require finer wiring, smaller vias, higher fan-out density, and more reliable vertical interconnects. In this context, copper seed formation and via metallization are becoming increasingly important bottlenecks for next-generation package and substrate scaling.
     Conventional copper deposition technologies, including physical vapor deposition, electroless plating, and electroplating, each play essential roles in today’s manufacturing flows. However, as via structures become smaller, deeper, rougher, or higher in aspect ratio, limitations such as step coverage, liquid circulation, process uniformity, and seed-layer continuity become more difficult to manage. These challenges are especially relevant across multiple interconnect layers, including motherboard HDI PCBs, IC substrates, RDL, memory and interposer silicon vias, and Si BEOL metal, etc.
     This presentation will introduce Nano Copper Deposition as a solution family for AI-era interconnect scaling. The talk will cover DeepVia™ HDI for high-aspect-ratio via metallization in motherboard HDI PCBs, DS-SAP™ for resolving the trade-off between thin surface seed layers and robust via coverage in IC substrates, and other applications such as Dual Seed Damascene for fine and high-aspect-ratio damascene structures in BEOL and RDL applications, and DeepVia™ Silicon for memory and interposer silicon vias. The discussion will highlight how these approaches can support higher I/O density, improved escape routing, reduced layer-count dependency, and broader process flexibility for next-generation advanced packaging.

Title:
IEEE Seattle Student Intern / YP Hangout
Date:
August 7th
3:00 PM (6 hours)
Location:
Log Boom Park
Kenmore, WA
Abstract:

We hope you are having a great summer break. We are excited to invite student interns, recent graduates, young professionals, and industry leaders to our outdoor casual networking event at Log Boom Park in Kenmore, WA. Enjoy this relaxed setting to connect and share your experiences. Food and drinks will be provided.

We look forward to seeing you there.

Title:
IEEE Electronic Packaging Design and Characterization Summer School 2026
Date:
August 10th
8:00 AM (3 days)
Location:
San Diego State University
San Diego, CA
Cost:
Admission fee may apply
Abstract:

The IEEE Electronics Packaging Society (EPS) San Diego Chapter, in partnership with San Diego State University (SDSU), is pleased to present a three-day summer school focused on the fundamentals and emerging trends in electronic packaging design and characterization.

The program is designed for senior undergraduate students, graduate students, recent graduates, and practicing engineers interested in advanced packaging technologies, heterogeneous integration, signal integrity, power integrity, thermal management, materials, package characterization, and electronic design automation.

Title:
IEEE OC PES/IAS Chapter ExCom Meeting - July 1st 2026, MOVED ON-LINE
Date:
August 10th
6:00 PM (0 minute)
Abstract:

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

 

 

Title:
SusTech Talk August 2026 – Heat Adaptation in Practice: Community-Facing Approaches to Extreme Heat in Singapore and India
Date:
August 11th
6:00 PM (1 hour)
Abstract:

“Heat Adaptation in Practice: Community-Facing Approaches to Extreme Heat in Singapore and India”

with Veerappan Swaminathan, CEO of SL2 Group, Singapore

Date/Time: Tuesday, August 11, 6pm – 7 pm Pacific Time

Abstract:

Extreme heat is an increasingly urgent climate adaptation challenge, especially for older adults and heat-vulnerable households living in dense urban and tropical environments. While heat resilience is often discussed through the lens of policy, urban planning, or public health, effective adaptation also depends on practical socio-technical systems that can work in real homes, care facilities, and communities.

This talk will share lessons from two ongoing community-facing projects: StayCool in Singapore, which combines heat and humidity sensors, physiological wearables, an app, heat alerts, and trained volunteers to support vulnerable households; and a heat adaptation project at Muthiyor Nanban Home in Tamil Nadu, India, which uses site assessment, environmental measurement, stakeholder engagement, and targeted interventions to improve thermal comfort for elderly residents. The talk will highlight implementation lessons for engineers interested in climate resilience, sensing, community systems, and adaptation in practice.

 

Title:
CHEERS OCEANEERS! August 12th, 2026 - Teagan Darling of Miramar College Engineering Club: RoboSub 2026
Date:
August 12th
5:30 PM (3 hours)
Location:
Quantum Brewing
San Diego, CA
Abstract:

CHEERS OCEANEERS! August 12th, 2026

This month is about RoboSub!  Our main presentation is from Teagan Darling and other team members from Miramar College Engineering Club.

Miramar College Engineering Club: RoboSub 2026 Overview

The Miramar College Engineering Club just competed in its first year of the RoboSub competition. This competition tasks students from around the world with creating Autonomous Underwater Vehicles (AUVs) with the goal of completing a series of increasingly difficult tasks and claiming the title of RoboSub 2026 Champion.

This talk will give an overview of the team’s trials, tribulations, innovative fixes, spectacular… let’s call them missteps, and great connections formed over the past year.

In addition, we will have Leverett Bezanson, Chair of the Marine Technology Society (MTS), present information about their last cycle of internships including some details about the projects that they worked on.
***

Welcome to the monthly event for the IEEE Oceanic Engineering Society (OES), San Diego Chapter, which is hosting this meeting jointly along with TMA BlueTech (The Maritime Alliance), and MTS (Marine Technology Society).

Please join us for the main presentation and also plenty of time for networking and friendly conversation about everything oceanic, engineering, science, Blue Tech, and more.  No need to be an IEEE or OES member, or TMA, or MTS.  Everyone is invited.

This month, we will be at Quantum Brewing again, a cool science-themed brewery founded by a biochemist.

No ticket required, but please order something for yourself from the brewery.

Please grab a bite from a nearby restaurant, which is okay to bring into the brewery per the owner.

The food and drinks are not being funded by the hosts.  Please open your own tab.

Title:
IEEE Hawaii YP August ExCom
Date:
August 12th
8:30 PM (1 hour)
Location:
733 Bishop Street
Honolulu, HI
Abstract:

August ExCom

Title:
IEEE OC Section ExCom Meeting - August 13th, 2026, ONLINE
Date:
August 13th
6:30 PM (2 hours)
Abstract:

IEEE Orange County Section Executive Committee Monthly meeting - occurs every 2nd Thursday of the month. 

All IEEE OC Committee/Chapter/Affinity/SIG Chair/Key Volunteers (or their proxy) are requested to attend. Other IEEE members are also welcome to attend. Please RSVP here to receive the meeting login information. Routine attendance is required to qualify for your chapter's annual IEEE rebate.

To AVOID unauthorized attendance, you MUST REGISTER for this event so that you can be sent the meeting link.

 

  

Title:
From Physics to Flash: An Industry Perspective on 3D NAND Technology, Reliability, and High-Performance SSDs
Date:
August 14th
1:00 PM (1 hour)
Abstract:

Three-dimensional NAND flash memory has become a cornerstone of modern data storage, powering everything from mobile devices to hyperscale data centers fueling the AI revolution. As the industry pushes toward both higher storage density through aggressive 
vertical scaling and faster operation to meet the demands of next-generation highperformance SSDs, low-latency AI/ML workloads, and real-time data-intensive applications, the challenges of maintaining robust device reliability grow increasingly complex. This talk provides an industry perspective on the co-evolution of 3D NAND density and performance, covering advances in cell architecture and scaling strategies alongside the reliability challenges that arise when optimizing for both capacity and speed. The presentation will also share practical insights on working as an engineer in the semiconductor memory industry and the career path from academia to industry, aimed at students and young professionals entering the field

Title:
Marine Technology Society (MTS) San Diego: Summer 2026 Internship Closeout & Summer 2027 Internship Kickoff BBQ
Date:
August 14th
2:00 PM (4 hours)
Location:
SeeByte
San Diego, CA
Abstract:

Marine Technology Society (MTS) San Diego: Summer 2026 Internship Closeout & Summer 2027 Internship Kickoff BBQ

When: Friday August, 14, 2026 | 2:00-6:00 PM PST

Where: SeeByte - 2240 Shelter Island Dr San Diego, CA 92106

Join the San Diego Section in celebrating the achievements of the 2026 Summer Internship Program cohort as they showcase their summer projects. Food provided. Donation welcome to support the 2027 Summer Internship Program. 

For Industry Representatives:

Interested in showcasing your technology at this event? Reserve an exhibit table when you register! 

 

Special Notes:

All are welcome and it is free.  We will be taking donations to MTS for prizes or raffle items.  Food will be free, but we will guilt people into donating.  Menu is tri-tip sandwiches. 

 

Title:
AI Adoption Exchange – IEEE San Diego (Informal Networking)
Date:
August 14th
6:30 PM (0 minute)
Location:
Del Mar Highlands Town Center (Sky Deck area)
San Diego, CA
Abstract:

How are companies actually adopting AI today?

This informal IEEE networking session is designed for engineers, researchers, and industry practitioners to share real-world experiences around AI adoption — what’s working, what’s not, and where teams are facing challenges.

This is not a talk or presentation.
There are no slides — just a curated, peer-level discussion.

Topics may include:

  • Where teams are in their AI adoption journey (experimentation → production)
  • Use of LLMs and AI systems in real-world workflows
  • Challenges in scaling AI beyond prototypes
  • Measuring impact and ROI
  • Build vs. buy decisions

The session is intentionally kept small to enable meaningful interaction.

Format
  • Short introductions (name, role, current AI focus)
  • Open discussion guided by participant experiences
  • Informal networking
Who Should Attend
  • Engineers and ML practitioners working on AI systems
  • Product and platform leaders involved in AI adoption
  • Founders and technical decision-makers
  • Researchers interested in applied AI systems
Notes
  • No presentations or sales pitches
  • Participation is encouraged — come ready to share and learn
  • Limited capacity to maintain quality of discussion
Organizer

Chhavi Jain
Vice Chair, IEEE Signal Processing Society – San Diego Chapter

This session is part of an ongoing IEEE initiative to connect practitioners working on real-world AI systems and deployment challenges.

Title:
Among Us Night
Date:
August 14th
7:00 PM (2 hours)
Abstract:

 

Title:
Excomm (August) - PES Chapter of IEEE Boise Section (Monthly)
Date:
August 17th
10:30 AM (1 hour)
Location:
Micron Engineering Center (MEC)
Boise, ID
Abstract:

This is the monthly PES chapter's Executive Committee meeting.  Typically, an hour to discuss old business and new business.

We focus on the upcoming events.  Senior member activity, Section Picnic, and Holiday Party, Future City Event. + technical events.

Title:
Brew with the Crew: Accelerated Qualification of Novel Nuclear Structural Materials
Date:
August 20th
3:45 PM (1.2 hours)
Location:
1175 Pier View Dr
Idaho Falls, ID
Abstract:

Join us for the upcoming technical talk —attend in person at Stockman’s Restaurant or virtually via Microsoft Teams 

Title:

Accelerated Qualification of Novel Nuclear Structural Materials: Multiphysics Simulations of a MEMS-Based Creep Device Under Ion Irradiation

Abstract:

Qualification of structural materials for advanced nuclear reactors requires testbeds capable of
simultaneously replicating and monitoring high temperatures, irradiation, and mechanical stress.
This talk presents a multiphysics modeling framework for the design and optimization of an in-
situ testbed for measuring irradiation creep and thermal fatigue.
The testbed couples a silicon MEMS device with ion irradiation and scanning electron
microscopy to enable real-time mechanical testing under irradiation. Finite element simulations
developed in CUBIT and BISON resolve the coupled thermal, electrical, and mechanical
response of the MEMS device and quantify induced strain in the sample. Geometry optimization
of the MEMS device is performed to achieve uniform temperature and strain fields in the test
sample.
Results demonstrate that the multiphysics framework reduces reliance on iterative physical
prototyping in testbed development and provides a reproducible basis for geometry and loading
parameter selection in nuclear materials testing.

Speaker: Akanksha Parmar
Postdoctoral Research Associate
Idaho National Laboratory

 

Akanksha is a Postdoctoral Research Associate in C650 department at INL, where her research
focuses on computational modeling of nuclear fuels, including high burnup structure, chromia-
doped UO₂, and annular fuel pellets, using advanced constitutive models such as crystal
plasticity.
She received her Ph.D. in Mechanical Engineering from Purdue University, where she combined
multiscale modeling with hands-on fabrication, processing, and characterization to study
microstructure evolution during additive manufacturing. She holds an M.S. in Aeronautics and
Astronautics from Purdue University, where her thesis focused on multiscale modeling of
composite structures.

 

 

 

Title:
2026 TECHNICAL MEETING OF IEEE RELIABILITY SOCIETY ARIZONA CHAPTER
Date:
August 21st
12:00 PM (1 hour)
Abstract:

Agenda

  1. General issues of chapter development, next meeting time, and speaker.
  2. Officers election and reporting: Current interested are Amit Rai, Sree Ram, Vijaya sai Munduro, Karthik Bodducherla
  3. Tech talks feedback:
    1. Reliability Meets AI (RS & ASQ)
    2. Predictive Engineering (RS & EMBS)
    3. www.iirw.org | Oct 2026
  4. Members status
  5. Standards: IEEE P1856.1 (PHM) Working Group, IEEE Rel std. Semiconductor (TBD)
Title:
Building Powerful AI Agent Serverless Applications with AWS Part II - August 29th
Date:
August 29th
9:00 AM (3 hours)
Location:
Singel Building
Seattle,, WA
Cost:
Admission fee may apply
Abstract:

IEEE New Era AI 2024 Workshop series   

Register ,  Workshop  I participnts free 

 

Come to Master the new generation of intelligent, event-driven applications—where you transform input instantly into AI Agents, AI-guided decisions, and automate real-world actions.  Take away an actionable portfolio for your future.
For healthcare professionals, multimodal prototyping tools are used to analyze medical imagery such as X-rays and pathology slides. For Data scientists and analysts - process research papers, survey responses, or unstructured datasets at scale. For Software engineers - integrate RAG-based chatbots into existing applications to surface answers from knowledge bases. For Business analysts: extract structured data to derive insights without complex parsing logic. For Students and Researchers -prototyping an AI assistant that helps with literature review, data labeling, or experiment documentation.

Takeaway: Master the next generation of AI. By the end of this session, you’ll have a portfolio-ready project and the specialized skills to create actionable AI-guided results, setting your expertise apart in this competitive world.

No Code skill required.  Hybrid.  IEEE Certificate Available

Speakers 

Nithin Vommi is an Engineering Manager at Amazon Web Services, where he has spent nearly a decade building
and scaling large-scale distributed systems. He leads AWS Lambda streaming and queueing platforms, focusing on
serverless architectures and event-driven systems. Nithin has published technical articles, holds patents, and
speaks at AWS events, including re: Invent. Over his time at AWS, he has launched more than a dozen customer-
facing features on serverless platforms, several of which were highlighted at AWS re: Invent and are broadly adopted by enterprises.
His current interests include serverless, generative AI, and event-driven design patterns.

Mr. Ravi Godugu is a seasoned Software Engineer at AWS Computing

Tejas Ghadge is the engineering head for AWS Amplify, AWS Lambda Event-Driven Applications, and AWS Lambda
Developer Experience, where he leads an organization of 100+ engineers/managers across multiple sites in the US and
Canada. With over 14 years of experience at AWS, Tejas brings deep operational and architectural experience from
- operating large-scale (millions of requests per second) event-driven systems, leading and analyzing hundreds of
operational incidents, and successfully launching dozens of delightful customer features for AWS Lambda and AWS
Amplify customers.

Technical Requirements

Laptop with a modern web browser (Chrome, Firefox, or Edge)
2. Stable internet connection
3. No local software installation required — labs run in a browser-based IDE and a temporarily provided AWS account
4. No prior machine learning or data science experience required

  •  IEEE  Professional certificate and Hrs will be offered to those attendees who pass a simple quiz at the end of class, with a fee.  

 

Title:
IEEE Hawaii September ExCom
Date:
September 1st
8:30 PM (1 hour)
Location:
TBD
Honolulu, HI
Abstract:

September Executive Committee Meeting

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
September 2nd
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Rewired for AI: An Introduction to UltraEthernet
Date:
September 8th
7:00 PM (2 hours)
Location:
925 Thompson Place
Sunnyvale, CA
Abstract:

As AI and HPC workloads scale exponentially, traditional network fabrics are hitting a critical bottleneck. Legacy Ethernet simply wasn’t built for the ultra-low latency and zero-loss tolerances demanded by next-generation clusters.  This talk will provide an engineering-first primer on UltraEthernet—the industry’s collaborative answer to modern data center scaling.

Rip Sohan will dissect the architectural gaps of legacy networks, analyze the new data plane building blocks, and unpack the specification’s advanced congestion control and reliability mechanisms. He will also explore how UltraEthernet integrates with existing RDMA ecosystems. Attendees will leave with a definitive mental model of the fabric designed to power the future of compute.

Title:
Nuclear Power Solution for Energy Demand created by AI Data Centers
Date:
September 9th
3:30 PM (2 hours)
Location:
TBD
San Diego, CA
Abstract:

Global data center power demand is forecast to rise by 160% to 165% by 2030, with AI driving the majority of this surge. By 2030, worldwide electricity use by data centers is expected to reach 945 TWh. By 2035, demand is projected to soar further to 1,300 TWh globally, with AI making up 70% of total data center power.

Nuclear power reactor is considered to be one of the most viable solutions to fulfill this surge in energy demand caused by AI. 

In this talk, we will examine what is the current state of nuclear power generation, what is the projected growth, cost involved and comparison with conventional energy solutions and alternate energy sources such as Solar and Wind.

Title:
IEEE Hawaii YP September ExCom
Date:
September 9th
8:30 PM (1 hour)
Location:
733 Bishop Street
Honolulu, HI
Abstract:

September ExCom

Title:
Permanent Magnets, A Material in Flux
Date:
September 10th
6:30 PM (1.5 hours)
Location:
Quadrant Corp
San Jose, CA
Abstract:

Dr. Stan Trout of Spontaneous Materials will discuss how changing tariffs, domestic sourcing requirements, and global market forces are reshaping the permanent magnet industry and what these trends mean for its future. With nearly 50 years of experience in permanent magnets, magnetic materials, and rare-earth technologies, Dr. Trout is widely recognized as a leading authority in the field.

For more information, see Permanent Magnets, A Material in Flux

Title:
CANCELLED! IEEE San Diego Talk - EMF Assessment & Measurement Solutions: Standards, Applications, and Best Practices
Date:
September 12th
10:38 AM (0 minute)
Location:
C
San Diego, CA
Abstract:
IEEE San Diego Product Safety and EMC Chapter talk

EMF Assessment & Measurement Solutions: Standards, Applications, and Best Practices

by Lawrence Fortuny of  Wavecontrol

 Event Details:Thursday Feb 27th, 20256PM -8PM Advanced Test Equipment Corp.10401 Roselle StreetSan Diego, California 92121 Cost: Complimentary and Dinner will be providedOn-site Parking will be complimentary  Topic:

EMF Assessment & Measurement Solutions: Standards, Applications, and Best Practices

Accurate electromagnetic field (EMF) assessment is essential for ensuring compliance with IEEE, ICNIRP, and FCC standards across various industries. This session will provide an overview of measurement methodologies, key regulatory requirements, and practical challenges in RF and low-frequency EMF monitoring.

A live demonstration of the SMP3 Portable EMF Meter will highlight probe selection, broadband vs. frequency-selective measurements, and real-world applications in telecommunications, energy, aerospace, industrial safety, and more. Attendees will gain insights into selecting the right tools, optimizing measurement procedures, and staying ahead of evolving compliance needs.

 Speaker: 

Lawrence Fortuny is the USA Sales Manager at Wavecontrol, specializing in EMF measurement solutions for safety, compliance, and environmental monitoring. With a background in engineering physics and electrical engineering, he started in R&D before transitioning to technical sales and business development. He works across industries including telecommunications, energy, aerospace, defense, healthcare, and research, helping organizations implement accurate EMF assessment solutions.

Title:
Engineering Invisible Electronics: How Graphene is Changing the Way We Measure Human Health
Date:
September 15th
11:00 AM (1 hour)
Abstract:

What if medical electronics could become virtually invisible – not only conforming seamlessly to the human body but also sensing, communicating, and even interacting with living tissues? Recent advances in graphene and other two-dimensional materials are making this vision possible by enabling a new generation of wearable, implantable, and intelligent bioelectronic systems. Their unique combination of atomic thickness, flexibility, transparency, electrical conductivity, and biocompatibility is fundamentally changing how electronics interface with biology.

In this talk, I will explore how these materials are enabling technologies that were previously impossible. I will introduce graphene electronic tattoos that laminate onto the skin like temporary tattoos to provide long-term, high-fidelity monitoring of electrophysiological, mechanical, and biochemical signals. Applications will include continuous cuffless blood pressure monitoring using bioimpedance, multimodal physiological sensing, and wearable biosensors capable of tracking biomarkers directly from sweat. Beyond the skin, I will discuss the translation of these ultrathin biointerfaces into implantable devices, including transparent graphene arrays for recording and stimulating the heart. These tissue-conformable interfaces enable simultaneous electrical sensing, optical imaging, and optogenetic modulation while opening new opportunities for minimally invasive therapies and next-generation bioelectronic medicine. Finally, I will present our recent work on graphene-based neuromorphic devices that emulate the adaptive behavior of biological synapses with energy efficiencies approaching those of neurons. These systems represent an important step toward intelligent bioelectronics capable of learning from physiological signals, enabling adaptive biosensing, closed-loop therapeutics, and future human–machine interfaces. Together, these examples illustrate how atomically thin materials are driving the shift from rigid electronic devices to bioelectronic systems that integrate naturally with living tissues.

Title:
Glass-Core Packaging and Its Reliability
Date:
September 24th
11:30 AM (1.5 hours)
Location:
SEMI World Headquarters
Milpitas, CA
Abstract:

In the past few years, because of high-performance computing (HPC) driven by artificial intelligence (AI) and data centers in this AI era, packaging using glass-core substrates has been attracting lots of traction. For example, among others, Intel’s one-trillion-transistors application processor with glass-core substrate is to be shipped by the end of 2030 (announced September 2023) and TSMC’s chip-on-panel-on-substrate (CoPoS) with glass-core interposer is to be shipped in Q1 of 2029 (announced April 2025). In this lecture, a brief fundamental of through-glass via (TGV) and redistribution-layers (RDLs) of glass packaging will be presented. The advantages and disadvantages of glass, silicon, and organic will be discussed. Panel-level packaging vs. wafer-level packaging and the panel size will also be provided. Finally, the effects of coefficient of thermal expansion (CTE) of glass-core substrate on the solder joint reliability on printed circuit board (PCB) will be presented. Some recommendations will be provided.



Title:
Rocky Reach Dam Tour - Registration Closed - Contact Event Host
Date:
September 25th
10:00 AM (5 hours)
Location:
Wenatchee, WA
Cost:
Admission fee may apply
Abstract:

Topic: Rocky Reach Dam Tour

Date:  Friday, Sept. 25th, 2026

Time: 10:00am – 12:00pm

Place: Rocky Reach Discovery Center

Agenda:         

10:00 am – Check In, Introductions, Safety Talk

10:30 am – 12:00pm Tour- Fish Passage, Generator and Turbine, Top of Dam, Control Room

12:00pm – 1:00pm – Lunch Rocky Reach Café

1:00 pm – 3:00 pm – On your own tour of the Discovery Center

Visit Requirements:

  • This is a hard hat, tour of an operating power plant.  Closed toe shoes, long pants, and sensible clothing are required. Shorts, dresses, sleeveless shirts, tank tops, high heels are not permitted.
  • There is a significant amount of standing, walking and climbing stairs on this tour. Attendees must be able to walk at least a mile and climb stairs and must be over 12 years of age.
  • You cannot have a pacemaker.
  • Fanny packs, bags, purses, etc., are allowed.  Backpacks can be stored at site.
  • This is a technical tour for IEEE members and their quests. 
Title:
Utah RF & Wireless Day 2026
Date:
October 5th
8:00 AM (7 hours)
Location:
Sorensen Molecular Biotechnology Building
Salt Lake City, UT
Abstract:

Join us for presentations and networking with the Utah RF, wireless, and microwave engineering community. 

 

Utah RF & Wireless Day is an annual opportunity to network and learn from Utah's academic and industrial community. The event includes technical presentations, networking time, student posters, vendor tables, and an IEEE Distinguished Lecturer. Sponsored by the Utah IEEE Chapters of APS/MTT/EMC/AES and the University of Utah Department of Electrical and Computer Engineering.

Registration is free.

Title:
IEEE Hawaii October ExCom
Date:
October 6th
8:30 PM (1 hour)
Location:
TBD
Honolulu, HI
Abstract:

October Executive Committee Meeting

Title:
IEEE PES SEATTLE EXCOM MEETING
Date:
October 7th
8:00 PM (1 hour)
Abstract:

EXCOM Meeting for IEEE PES Seattle Officers 

Title:
Co-Packaged Optical Transceivers for HPC, Data Center and Ai Applications
Date:
October 9th
12:00 AM (14 hours)
Abstract:

This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems.

Title:
Spark Museum of Electrical Invention - Registration Opens August 3rd.
Date:
October 10th
9:45 AM (2.2 hours)
Location:
1312 Bay Street
Bellingham, WA
Cost:
Admission fee may apply
Abstract:

Topic: Sparks Museum of Electrical Invention, Bellingham

Date: Saturday October 10, 2025

Time: 9:45am  – 12:00 PM, Mega  Zapper Show and Museum Tour

Place: 1312 Bay Street, Bellingham, WA 98225

Restrictions:  This is an indoor event.

               

 

Title:
Minimalist Edge AI Student Competition
Date:
October 13th
8:00 AM (2 days)
Location:
500 El Camino Real
Santa Clara, CA
Abstract:

Part of the 11th ACM/IEEE Symposium on Edge Computing (SEC 2026) Location: Santa Clara University | Date: Oct 13-15, 2026 

Overview

The future of the Edge is not just decentralized—it must be sustainable. As AI models grow in complexity, the environmental and energetic costs of deploying them on edge devices have become a critical bottleneck.

The Minimalist Edge AI Challenge invites student teams to tackle the "AI Bloat" head-on. This one-day competition challenges you to take state-of-the-art "heavy" models and transform them into lean, green, high-performance machines capable of running on constrained, eco-friendly hardware. Can you maintain intelligence while slashing the carbon footprint? Join our Discord group for latest updates (https://discord.gg/V29ZXCTFR5).

 

 

The Challenge

Participating teams will be tasked with deploying a complex AI workload (e.g., real-time multi-object tracking or environmental anomaly detection) onto provided low-power hardware (Qualcomm Arduino UNO Q).

Your mission is to optimize for the "Green Trifecta":

  1. Model Accuracy: Maintain high predictive performance and reliability while operating under strict resource constraints.

  2. Model Compression: Use pruning, quantization, and distillation to shrink the model footprint.

  3. Resource Efficiency: Minimize peak RAM and CPU utilization to ensure smooth execution on minimalist hardware.

  4. Energy Parsimony: Achieve the lowest possible Joules-per-inference to maximize battery life and sustainability.

 

 

Why Participate?
  • Showcase Your Skills: Pitch your solution to a jury of world-leading edge computing experts from academia and industry.

  • Build Your Career & Network: Pitch your solution to a premier jury of world-leading edge computing experts and recruiters from academia and industry giants like Qualcomm.

  • Engineer for Planet Earth: Move past theoretical AI. Help define the actual benchmarks for "Green AI" and create real-world impact by building hyper-efficient, eco-friendly edge computing models.

  • Cash Prizes: The top three teams from each track will receive cash rewards:

    • 1st Place: jumi,000

    • 2nd Place: 0

    • 3rd Place: 0

  • Participant Perks: All competition participants will receive IEEE Computer Society swag and a free IEEE Computer Society Student Membership (Note: Requires an active IEEE Student Membership).

 

 

Eligibility & Team Composition
  • Open to all undergraduate and graduate students registered at a recognized university.

  • Teams should consist of 2 to 4 members.

  • Recommended Skill Set: * Proficiency in Python (PyTorch/TensorFlow) and/or C++/Rust.

  • Experience with model optimization techniques (Pruning, Quantization).

  • Knowledge of Linux systems and resource profiling.

  • A passion for sustainable engineering.

 

 

Important Dates

●      Team Registration Deadline: Sept. 6th, 2026

●      Competition Day: Oct. 13-16 (Co-located with SEC 2026)

 

Title:
IEEE Hawaii YP October ExCom
Date:
October 14th
8:30 PM (1 hour)
Location:
733 Bishop Street
Honolulu, HI
Abstract:

October ExCom

Title:
VENDOR TABLE for Electrical Design Fundamentals Seminar
Date:
October 15th
7:00 AM (10 hours)
Location:
DoubleTree by Hilton Hotel Pleasanton at The Club
Pleasanton, CA
Cost:
Admission fee may apply
Abstract:

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.*****

(Limit of 10 vendor tables so do not delay!)

Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request.

For more than one (1) attendee to support the table, please register additional people using the regular attendee link: https://events.vtools.ieee.org/m/562108

Tape, Tacks, Nails may not be applied to walls, ceilings, or doors and are strictly prohibited.

Outside food, non-alcoholic and alcoholic beverage are not allowed.

IEEE and the Hotel are not responsible for any loss or damage to property belonging to you.

Sign-in for attendees and continental breakfast will open at 7:15AM, so please be completely set up by 7:15AM.

Vendors are encouraged (voluntary) to bring up to three (3) giveaways to be included in the overall raffle for attendees.

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, lunch, and refreshments.

Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from IEEE, Eaton, Electrical Reliability Services (a Vertiv Company), ETAP, SEL, and NEMA. Seminar topics will include:

  • Overview of IEEE 1547-2018, Standard for Interconnection and Interoperability of distributed energy resources (DER) with Electric Power Systems
  • Electrical Design Fundamentals – Circuit Breaker Applications Understood  
  • Medium Voltage Cable Installations
  • Cable Ampacity and Sizing Fundamentals Generator
  • Protective Relaying Fundamentals
  • NEMA Resources and the NEMA Standards Store

 Plan to attend this timely, educational Seminar. Registration is now open!

Title:
Electrical Design Fundamentals Seminar
Date:
October 15th
7:00 AM (10 hours)
Location:
DoubleTree by Hilton Hotel Pleasanton at The Club
Pleasanton, CA
Cost:
Admission fee may apply
Abstract:

This one-day Technical Seminar will cover the fundamentals of electrical design, cable ampacity, protective relaying, and interconnections. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes continental breakfast, lunch, and refreshments.

Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from IEEE, Eaton, Electrical Reliability Services (a Vertiv Company), ETAP, SEL, and NEMA. Seminar topics will include:

  • Overview of IEEE 1547-2018, Standard for Interconnection and Interoperability of distributed energy resources (DER) with Electric Power Systems
  • Electrical Design Fundamentals – Circuit Breaker Applications Understood  
  • Medium Voltage Cable Installations
  • Cable Ampacity and Sizing Fundamentals Generator
  • Protective Relaying Fundamentals
  • NEMA Resources and the NEMA Standards Store

 Plan to attend this timely, educational Seminar. Registration is now open!

For Group Registrations, please list all attendee email addresses under Special Requests.

***** Early-Bird registration closes on July 3, don’t delay!*****

(Registration is limited to 100 attendees and must be completed on vTools. No walk-in registrations.)

65 meetings. Generated Monday, July 20 2026, at 11:07:29 PM. All times America/Los_Angeles