📅 Date: Saturday, September 20, 2025
⏰ Time: 9:00 AM – 12:30 PM
📍 Location: MCMR at BSU – Room 106 & Outdoor Front Patio - University Drive (for Ham Radio Call Demo)

Free Parking Map: Look at the end of this message, look the streets sign before parking.

Croissants & Coffee to kick things off

• Purpose of Amateur Radio for Communications

• International Telecommunications Union (ITU) Phonetic Alphabet

• Basic Radio Operations (BRO)

• VHF/UHF Radio Operations

• HF Radio Operations

• Hands-On Operations (Make Your First Contact!)

Earn a Certificate of Completion

Enjoy Lunch* with Fellow Ham Experts

✨Open to all Adults, Free to Attend, No prior experience needed — just bring your curiosity!

Hosted by:

• IEEE Boise Young Professionals
• IEEE Boise Section
• IEEE WIE Boise Section
• IEEE BSU Student Branch

*Please fill in your dietary preferences, restrictions, and any accommodations required.

Join us for Kahoot!

Abstract : This presentation explores the evolution of automated transportation within public transit systems, focusing on ADASTEC’s real-world deployments and technology. ADASTEC develops SAE Level-4 automated driving software for full-size buses and has established operations across Europe and North America. Attendees will gain insights into deployment use cases, market drivers, safety compliance, and regulatory standards. The session will also address key engineering topics including sensor configurations, modular vs end-to-end AI models, and testing methodologies under real-world conditions. A live Q&A will follow to discuss public transit automation challenges and solutions.

Best regards

The Seattle Chapter of the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society (UFFC-S) aims to provide UFFC-S members with opportunities for professional and personal growth as well as network with the local, vibrant UFFC community.

Dr. Keith Murphy, PhD will be our guest speaker.  Dr. Murphy is Co-Founder and CTO of Attune Neurosciences which is developing next-generation lightweight wearable devices with bilateral, multi-element, electronically steered arrays. Prior to co-founding Attune Neurosciences, he received his training in neuroscience and behavioral genetics at the Scripps Research Institute and Florida Atlantic University followed by a post-doctoral fellowship at Stanford University to study the vagus nerve and its role in sleep regulation. 

Dr. Murphy will present on "Optimized ultrasound neuromodulation and wearables for behavioral control and clinical applications." 

This meeting will be virtual only. 

The San Francisco Bay Area chapter of the IEEE Computer Society invites to our free and open Virtual Tech Talks (no IEEE membership required):

First Speaker: Rakesh Keshava (Connect on LinkedIn)

Title: Managing Secrets at Scale in Traditional Enterprise, Cloud, and AI Systems

Abstract: In modern architectures spanning enterprise data centers, multi-cloud platforms, and AI workloads, secret management is both a security and engineering priority. This session examines patterns for securing API keys, tokens, and encryption keys at scale, including automated rotation, policy-driven access, and zero-trust integration. We will discuss reference architectures and tooling choices that ensure secrets remain protected without slowing down development or deployment velocity.

Bio: Rakesh Keshava is a Senior Member of IEEE and a Software Architect, Security at Okta Inc., specializing in identity, access management, cryptography, and AI-driven security solutions. He has over 17 years of experience designing and delivering secure cloud architectures for global enterprises. Rakesh is the named inventor on three U.S. patents, cited more than 200 times by major technology companies, with innovations spanning identity-centric encryption, automated key lifecycle management, and scalable policy enforcement frameworks. He actively contributes to scholarly work as a reviewer for Elsevier journals and IEEE conferences, and participates in technical program committees worldwide. Rakesh mentors professionals in the security community and collaborates on initiatives aimed at advancing cybersecurity practices. His current interests include post-quantum cryptography, AI-enhanced identity systems, and the integration of advanced security models into modern cloud-native environments. Driven by innovation and a commitment to secure digital ecosystems, he continues to shape solutions that address emerging security challenges.

Second Speaker: Ranjan Sinha (Connect on LinkedIn)

Title: Natural Language Interaction Protocol: A Universal Application-Level Protocol for the Age of Generative AI

Abstract: The advent of Large Language Models (LLMs) has made an interactive natural language interaction feasible between machines in a manner that did not exist before. An implication is that a natural language interface can replace many mobile applications that are used today. Just like the advent of the browser in 1990s simplified technology by replacing a plethora of client-side applications with a single standard application, a common natural language interaction protocol can potentially replace the plethora of mobile applications that exists today, providing a universal application layer protocol. Convergence to a universal application layer protocol would bring significant benefits to all segments of society – consumers can use a single application for various interactions, businesses will have a simpler maintenance burden for their IT infrastructure, and integration among different businesses can be streamlined.

Bio: Ranjan Sinha is an IBM Fellow and CTO for watsonx in IBM Research AI. He works at the intersection of Technology, Research, Product, and Enterprise-scale use cases in AI. He is involved in cutting-edge initiatives in Data and AI and is on the front lines of transforming IBM itself into an AI Enterprise by infusing AI into real-world applications and helping IBM's clients navigate their data and AI journeys. From 2016–2023, he built IBM’s Cognitive Enterprise Data Platform, the backbone of IBM’s AI-driven transformation. He is passionate about promoting wellness, safety and empowerment of vulnerable groups, and an advocate for social and global issues.

IEEE Learn to Solder Night

Ever wanted to learn how to solder? Join IEEE for a fun and hands-on soldering workshop! Whether you’re a beginner or just want to brush up on your skills, this event is the perfect opportunity to practice with real tools and take home your own working project.

We’ll provide all the materials, equipment, and guidance you need. Come learn a valuable skill, meet fellow students, and spark your interest in electronics!

Abstract:

Thursday September 25, 2025

11:30 AM: Networking, Pizza & Drinks

Noon -- 1 pm: Seminar

Please register on Eventbrite before 9:30 AM on Thursday September 25, 2025

IEEE members  non IEEE members

(discounts for unemployed and students )

Speaker: Dr. Boris Vaisband

Meeting Date: September 25th, 2025

Abstract
The demand for computation and memory in applications such as large language models, has increased well beyond the reticle boundaries of a system-on-chip (SoC). Chiplet-based integration is a paradigm shift that shapes the way we design our future high-performance systems. The concept is to move away from large SoCs that are limited by communication, thermal design power, and reticle size, toward a robust plug-and-play approach, where small, hardened IP heterogeneous off-the-shelf chiplets are seamlessly integrated on a single platform. In this talk, we will discuss the current state-of-the-art and challenges in chiplet integration and introduce the silicon interconnect fabric (Si-IF), an ultra-large wafer-scale heterogeneous integration platform, for applications such as artificial intelligence acceleration, high-performance computing, and neuromorphic hardware, will be discussed.

Boris Vaisband (Senior Member, IEEE) is the Samueli Development Chair Assistant Professor at the University of California, Irvine, working on heterogeneous systems integration. In 2024 he was the Acting Director of UCLA CHIPS, and from 2019 to 2024, an Assistant Professor at McGill University. He received a B.S. degree in Computer Engineering from the Technion – Israel Institute of Technology in 2011, and M.S. and Ph.D. degrees in Electrical Engineering from the University of Rochester, NY, in, respectively, 2012 and 2017. From 2017 to 2019, he was a Postdoctoral Scholar at UCLA. From 2008 to 2015, he held various hardware design positions at Intel, Cisco, and Google. His current research interests are in heterogeneous integration, advanced packaging, and neuromorphic systems, with a focus on circuits, EDA tools, and design methodologies for power delivery, communication, thermal aware design and floorplanning, and testing. Some applications of interest are ultra-large-scale artificial intelligence systems and high performance computing.

Established in 2008, the Applied Research Laboratory at the University of Hawaiʻi (ARL at UH) is the fifth of five Navy-sponsored University-Affiliated Research Centers (UARC). The ARL at UH serves as a center of excellence for critical Navy and national defense needs, conducting research, development, testing and evaluation to address challenging and emerging problems. 

This presentation will focus on ARL at UH efforts to develop innovative and cost-effective solutions to problems impacting our community, our nation and our planet. Topics include: (i) developing inexpensive sensors and platforms for rapid deployment in response to natural and man-made hazards; (ii) testing non-invasive technologies for locating underwater munitions in shallow water; and (iii) developing an engineered, living, coastal protection solution using state-of-the-art research on submerged breakwaters and coral reef ecology. The presentation will also describe how ARL at UH’s research, development, testing, and evaluation expands the teaching mission of the University of Hawaiʻi: to create and nurture a high-tech workforce for the State.

Start your weekend with a shot of fresh ideas! Weekend Espresso is a series of quick, engaging seminars (under 1 hour) highlighting diverse topics in technology, innovation, and professional growth. Whether you’re a student, researcher, educator, or industry professional, you’ll discover insights that inform, inspire, and spark new connections. Hosted by the IEEE Foothill Section—pour yourself a cup and join us for lively learning!

Abstract:

Microwave technology has applications in the pharmaceutical industry for drug extraction, sterilization, and creating dosage forms. Microwave-assisted extraction can be used to obtain medicinal components from plants and other materials for healthcare purposes.

BioMEMS [Biological Micro-Electro-Mechanical Systems] and biomedical engineering have enabled the development of microwave-based devices for healthcare, such as wireless implants for monitoring intracranial pressure in patients with traumatic brain injury or hydrocephalus.

Metamaterials are used in designing antennas for healthcare applications. These metamaterial-based wearable antennas, like textile patch antennas, are crucial for wireless body-centric networks used in healthcare monitoring systems.

We’re excited to continue the Orange County Computer Society (OCCS) Global Emerging Technologies (GET) Series—a monthly platform dedicated to spotlighting groundbreaking innovations in computer science and technology. Hosted by the IEEE Orange County Computer Society Chapter, this series brings together professionals, students, and tech enthusiasts to explore what’s next in emerging tech.

Following an insightful June session focused on enterprise AI integration and large language model (LLM) development, we’re back this August after a brief summer break with another dynamic double-feature exploring AI at scale—from healthcare to production-ready ML systems.

As AI adoption accelerates, so do the complexities of real-world deployment. This month’s talks tackle those complexities head-on, offering both strategic and technical perspectives on building reliable, scalable, and human-centered AI solutions.

In this session:
🔹 The first talk bridges the gap between ML experimentation and production. Through a practical case study, it explores the full machine learning lifecycle—from training to CI/CD-enabled deployment—along with best practices in MLOps, model monitoring, and cross-functional collaboration.
🔹 The second talk delves into the deployment of agentic AI systems in healthcare, addressing challenges such as data heterogeneity, safety, regulation, and trust. You’ll learn about explanation-based and modular design principles, hybrid RAG-based deployment strategies, and real-world applications across triage, radiology, and dementia care.

Key topics include:
✅ Designing safe, explainable agentic AI in healthcare
✅ Deployment frameworks using hybrid RAG models
✅ ML development lifecycle: from notebooks to production
✅ CI/CD pipelines, monitoring, and model versioning
✅ Scalable and collaborative MLOps strategies

Whether you're building AI for regulated industries or scaling ML pipelines across teams, this session will provide the tools, frameworks, and real-world insights to drive your work forward.

📅 Join us on Tuesday, September 30 from 5:00 PM to 7:00 PM PT for an evening of learning, discussion, and community.

🎤 Interested in speaking at a future session? Reach out to swapnali.karvekar@ieee.org — we’re always looking for passionate voices shaping the future of technology.

Let’s keep advancing innovation—together.

Monthly Consultants Network Meeting

"The eyes have it" - the Physics of Cataract Surgery

Leonard J. Bond

Professor Emeritus, Iowa State University

Abstract

Approximately 3.7 million cataract surgeries are performed annually in the United States. Phacoemulsification, a modern technique, is the most common method used for cataract removal in these procedures. Despite its unparalleled success and the common use of phacoemulsification in the field of ophthalmic surgery, the precise mechanism of ultrasonic phacoemulsification for cataract extraction remains controversial. The web and literature report various mechanisms that are said to occur, and there are some “myths,” some of which have been discussed for decades and appear on websites. The types of tools used for cataract tissue fragmentation are also used in ultrasonic assisted liposuction (UAL) and for various surgical procedures, including tumor debulking.

This talk will report various ultrasonic measurements and the results of an investigation of the interaction of ultrasonic tools with materials and the mechanisms that can be seen to occur.

The results show that phacoemulsification is most likely dominated by the direct action of the vibrating tip of the tool used against tissue. The source of the “cavitational hiss,” that has been reported, is clearly identified. The insights given will, hopefully, reduce some of the mystery and mythology that still surrounds the physics of the fundamental interactions, for what is generally a safe and effective, and commonly used, procedure for cataract removal.

IEEE Orange County PES/IAS Chapter's ExCom meeting

All IEEE OC PES/IAS Chapter members are requested to attend this meeting. 

To AVOID unauthorized attendance you MUST REGISTER for this event so that you can be sent the meeting link.

The zoom link is given below: 

Topic: IEEE PES/IAS OC ExCom meeting
Time: Oct 3, 2025 06:00 PM Pacific Time (US and Canada)
Join Zoom Meeting
https://tae.zoom.us/j/85648332017?pwd=Kais4RUvFqbmNCSWnwgZV0NjJJ6Ewa.1

Meeting ID: 856 4833 2017
Passcode: 643497

IEEE PES & YP – Folsom Powerhouse Visit

Folsom Powerhouse Visit – Explore the Past, Power the Future

Step into history and see where modern electricity began! Join us for a fascinating visit to the historic Folsom Powerhouse, a landmark in hydroelectric power that once lit up Sacramento.

This guided tour is open to everyone—students, young professionals, industry veterans, families, and curious minds alike. Whether you’re part of the IEEE PES group, exploring a career in energy, or simply interested in how things work, you’ll enjoy:

• Walking through history: See the original equipment and learn how electricity was generated and transmitted in the late 1800s.

• Understanding hydroelectric power: Explore the science, engineering, and environmental aspects behind this renewable energy source.

• Connecting past to present: Learn how innovations in power systems have evolved and continue to shape our world.

• Networking opportunities: Meet energy professionals, IEEE members, and others passionate about technology and sustainability.

• Career inspiration: Young professionals can gain insights, industry connections, and perspective on how the energy field is changing.

Come ready to be inspired, learn something new, and enjoy a unique slice of California’s energy history.

CISPR and ANSI C63® Overview on Site Validation Measurements from 18 GHz to 40 GHz - Latest Advances in EMC Test Site Evaluation Using Advanced Antenna Measurement Techniques

es

By Zhong Chen, Chief Engineer, ETS-Lindgren, Cedar Park, Texas, USA

Abstract:  This presentation introduces a novel approach for EMC chamber validation beyond 18 GHz, currently under consideration in ANSI C63 and CISPR standards. By integrating Cylindrical Mode Filtered Site Voltage Standing Wave Ratio (CMF SVSWR) with Compressed Sensing (CS), we address inherent challenges in traditional SVSWR methods, such as inconsistency and slow data acquisition. CMF SVSWR utilizes circular path measurements and mode domain post-processing to discern antenna and chamber reflections, crucial for comprehensive VSWR analysis. Compressed Sensing, a data-driven machine learning technique, exploits signal sparsity to reconstruct data from fewer randomly sampled measurement points, thereby reducing test times and eliminating the need for precise turntable positioning.

Cylindrical Mode Filtered SVSWR Demonstration

Demonstration Abstract:  The Cylindrical Mode Filtered SVSWR (CMF SVSWR) is measured by placing the transmit antenna (typically a low gain omni-directional antenna) at the edge of the turntable and performing a single cut vector pattern measurement.  The vector S21 as a function of turntable angle at each frequency is transformed to the spectrum domain, where a filter can be applied to mathematically remove the chamber effects.  The SVSWR is derived by comparing the original pattern in the chamber to the “clean” filtered pattern.  This CMF SVSWR provides a more comprehensive evaluation of the EMC chamber quiet zone and can be readily measured without any special positioning fixtures.  The demonstration will show an entire measurement process including the post processing which can be performed in real time.  This new measurement technique is under consideration for the new draft standard ANSI C63.25.3 under development by the ANSC C63® committee for EMC test sites from 18 GHz to 40 GHz.

Speaker Bio:

Zhong Chen is Chief Engineer at ETS-Lindgren, located in Cedar Park, Texas. He has over 25 years of 
experience in RF testing, anechoic chamber design, as well as EMC antenna and field probe design and 
measurements. He is an active member of the ANSC C63® committee currently serving as Vice-Chair 
and is the immediate past Chair of Subcommittee 1 which is responsible for the antenna calibration 
(ANSI C63.5) and chamber/test site validation standards (ANSI C63.4 and the ANSI C63.25 series). Mr. 
Chen is chair of the IEEE Standard 1309 committee responsible for developing calibration standards for 
field probes, and IEEE Standard 1128 for absorber evaluation. Currently he is a member of the IEEE EMC 
Society Board of Directors and a former member of the Antenna Measurement Techniques Association 
(AMTA) Board of Directors. He is a past Distinguished Lecturer for the EMC Society and is recognized as 
an AMTA Fellow. His research interests include measurement uncertainty, time domain measurements 
for site validation and antenna calibration, and development of novel RF absorber materials. Several 
papers authored and co-authored by Mr. Chen have received best paper recognition at global 
conferences. Zhong Chen received his M.S.E.E. degree in Electromagnetics from the Ohio State 
University at Columbus. He may be reached at zhong.chen@ets-lindgren.com

Celebrating IEEE Day at Microsoft campus in Mountain View.

Join us for an informal mixer and networking event to learn about IEEE and the benefits it provides to its members.

Take away some swag and join the largest non-profit engineering organization by becoming a member.

Join us for an IEEE Day Celebration and Networking Event! Meet other engineering professionals and students in Hawaii.

This presentation explores the broad deployment and practical impact of Phasor Measurement Units (PMUs) at San Diego Gas & Electric. It highlights how PMU technology is used for real-time grid operations, advanced measurement and estimation, and dynamic system stability assessment. The discussion covers transmission line parameter estimation, composite load modeling, and high-speed state estimation, all of which contribute to operational resilience and model validation. Applications in generator monitoring, black start procedures, controlled islanding, and system inertia monitoring are addressed, along with advanced protection systems such as fault detection and falling conductor protection. The presentation also examines planning and compliance activities, including regulatory model validation, distributed energy resource integration, and geomagnetic disturbance studies. Collaboration with industry organizations and ongoing workforce development are emphasized, illustrating how PMU technology supports technical innovation and strategic objectives at SDG&E.

EXCOM Meeting for IEEE PES Seattle Officers 

IEEE Day/Week Lecture - from the IEEE History Center

Silicon Valley is commonly acknowledged as the tech capital of the world. How did Silicon Valley come into being, and what can we learn for our own startups and tech hubs? How has Silicon Valley directly affected the IEEE?
The story goes back to local Hams trying to break RCA’s tube patents, Stanford “angel” investors, the sinking of the Titanic, WW II and radar, and the SF Bay Area infrastructure that developed – these factors pretty much determined that the semiconductor and IC industries would be located in the Santa Clara Valley, and that the Valley would remain the world’s innovation center as new technologies emerge, and be the model for innovation worldwide.
This non-technical talk will give an exciting and colorful history of development and innovation that began in Palo Alto in 1909. You’ll meet some of the colorful characters – Cyril Elwell, Lee De Forest, Bill Eitel, Charles Litton, Fred Terman, David Packard, Bill Hewlett, Bill Shockley and others – who came to define our worldwide electronics industries through their inventions and process development. We will profile four IEEE presidents from Silicon Valley: Fred Terman and his son Lew Terman; Bill Hewlett; and Charles (“Bud”) Eldon. You’ll understand some of the novel management approaches that have become the hallmarks of its tech startups.

#IEEEDay

Topic: Sparks Museum of Electrical Invention, Bellingham

Date: Saturday October 11, 2025

Time: 9:45am  – 12:00 PM, Mega  Zapper Show and Museum Tour

Place: 1312 Bay Street, Bellingham, WA 98225

Restrictions:  This is an indoor event.

West O’ahu Solar + Storage Tour

The tour will last approximately one hour. All participants are required to sign a waiver in order to access the site.

Please be sure to complete the registration to receive additional information.

Space is limited and participation will be on a first-come, first-served basis.  

PLEASE WEAR/BRING 

• Covered and closed-toe shoes  (ideally boots)
• Long pants  
• Shirts with sleeves (no tank tops or thin straps), ideally long sleeve
• Sun protection (sunglasses, sunscreen)  
• Water 
• Please bring hard hats if you have, if not AES has some. Please add a note with the registration if you have a hard hat.

This is a hybrid in-person and online event. Pre-registration is required for either.

>> DIFFERENT LOCATION FOR IN-PERSON MEETING THIS MONTH!

Medical image-based modeling and digital twins have emerged as powerful tools to support patient-specific cardiac surgical planning in adults and children. This presentation will discuss 3D modeling techniques that provide a complete pipeline from medical image segmentation to 3D anatomic models and blood flow simulations. The technology that makes this possible was recently extended to model the whole heart, including blood flow, tissue mechanics, electrophysiology, cardiac contraction, and heart valves.

This presentation will also discuss recent applications of tools for clinical decision support. A first example is in adult cardiac surgery, where patient-specific modeling has been applied for vein graft failure prevention after coronary bypass graft surgery. Another example is in pediatric cardiac surgery where models have been used for clinical decision support in valve repair, flow re-direction, and bi-ventricular reconstruction. The program will conclude with a discussion of the open-source software and data resources that are available via the SimVascular project and the Vascular Model Repository.

*****This vTools link is for purchase of Vendor Tables ONLY! No walk-in registrations.*****

(Limit of 10 vendor tables so do not delay!)

*****************************************************************************************************

Vendor table will be one 6-foot exhibit table. Vendor table includes one (1) attendee ticket. A power strip will be available upon request.

For more than one (1) attendee to support the table, please register additional people using the regular attendee link: https://events.vtools.ieee.org/m/485039

Tape, Tacks, Nails may not be applied to walls, ceilings, or doors and are strictly prohibited.

Outside food, non-alcoholic and alcoholic beverage are not allowed.

IEEE and the Hotel are not responsible for any loss or damage to property belonging to you.

Sign-in for attendees and continental breakfast will open at 7:15AM, so please be completely set up by 7:15AM.

Vendors are encouraged (voluntary) to bring up to three (3) giveaways to be included in the overall raffle for attendees.

*****************************************************************************************************

This one-day Technical Seminar will cover the fundamentals of grounding, bonding, and ground fault protection. The seminar will serve as a primer for engineers and a refresher for experienced engineers. During breaks and lunch there will be opportunities to network with your peers and meet with manufacturers. The registration cost includes a print copy of the Soares Grounding and Bonding 2023 Book (full).

Please join us in attending this one-day Technical Seminar which will include an impressive list of speakers from Electrical Reliability Services (a Vertiv Company), ETAP, NEMA, Cummins, SEL, and PG&E. Seminar topics will include:

• Electrical Grounding Systems – An Overview
• Ground Grid Design and Electric Shock Protection
• Grounding Electrode Systems and Service Grounding
• Grounding Recommendations for On-Site Power Systems
• Generator Stator Ground Fault Protection
• Distribution Feeder High Impedance Ground Fault Testing, Findings, and Mitigation Strategies

 Plan to attend this timely, educational Seminar. Registration is now open!

The IEEE AI Exchange Conference is a local forum that brings together senior leaders and decision-makers to share how artificial intelligence is being applied across key industries in Arizona. With a focus on practical impact rather than technical research, the conference features director-level speakers presenting real-world use cases of AI in fields such as agriculture, construction, sustainability, and more.

This event is designed for professionals interested in understanding how AI is shaping industry strategy, operations, and innovation. Sessions are accessible, high-level, and insight-driven—perfect for business leaders, policymakers, and anyone curious about the future of AI in Arizona. 

In addition to talks, the conference provides space for networking and cross-industry exchange, fostering meaningful conversations among professionals leading AI adoption in the region.

Cybersecurity Starts with You: Protect, Prevent, Prevail

Since 2004, the President of the United States and Congress have declared October to be Cybersecurity Awareness Month. Cyber-attacks on corporations, governmental agencies and individuals are becoming increasingly widespread and regular, as well as more complex. The Virtual Sixth Annual Los Angeles IEEE Coastal Los Angeles Computer Society Cybersecurity Summit-South Bay that brings together government officials, private business executives and cybersecurity experts to discuss the current and emerging threats that exist in today’s sophisticated cyber environment, and the technological advancements being made to countermeasure and manage these risks.

Resources for Cyber Security Awareness:

Think Before You Click: Your Digital Life Depends on It

- Department of Homeland Security’s cyber security tips

- U.S. Computer Emergency Readiness Team

- Stay Safe Online website

- More on National Cyber Security Awareness Month 

• driving cybersecurity awareness home! - AFCEA International

Abstract:  In this talk, I will introduce the difference between classical bits (0/1) and qubits, which draw power from superposition and entanglement. I will explain, in plain terms, how superposition encodes many possibilities at once and how entanglement creates correlations no classical system can mimic, enabling quantum algorithms to traverse multiple solution paths more efficiently than step-by-step search. I will also discuss the engineering realities: quantum states are fragile, subject to decoherence and operational noise, so today’s devices have short coherence times and nontrivial error rates. Finally, I will discuss the state of the art in quantum computers from major players—Google, IBM, and leading startups—highlighting their architecture, capabilities, and near-term roadmaps.

Concrete encased electrodes for grounding electrical power systems, also called Ufer grounds, are highly effective grounding systems when installed correctly.  James will explain what constitutes a Ufer ground and how one can be easily constructed in accordance with IEEE Standard 142-2007 (the Green Book) and the National Electrical Code (NEC).  He will also explain what common errors and myths surround Ufer grounds as well as an error in the IEEE Green Book, and errors interpreting the NEC.  James will also explain how Ufer grounds are essential to effective lightning protection systems.  James’ background as an experienced construction electrician and a BS Civil Engineer makes him uniquely qualified to explain civil/structural concepts and practices and how they are relevant to his fellow Electrical Engineers. 

Is inflation and economic uncertainty making you rethink your financial safety net? You're not alone. The good news is, your IEEE membership includes access to exclusive, affordable Group Insurance Plans designed to protect you and your family.

Join our webinar to discover how these plans provide a critical layer of financial security. We'll simplify your options—from Life and Disability Insurance to coverage that fills gaps in your personal insurance portfolio—and show you how to leverage the group-buying power of IEEE for better rates and peace of mind.

Protect your future and family with confidence. Register today!

Monthly ExCom meeting. All Section members are welcome.

Dinner will be provided for per person. Please give cash to Matt on the day of. Students do not need to bring payment. Please register for the vTools event so we can get an accurate headcount. Include dietary restrictions in "Special Requests" when registering. 

If you have Chapter/Affinity Group updates or other announcements and discussion points you would like to add to the agenda, please send them to the Section Chair Brianne Tengan 2 days in advance.

The HPU map can be found in this link: https://www.hpu.edu/about-us/files/dt-wp-map.pdf

Future of communication and sensing network is being transformed with the advancement in next generations of wireless with Beyond-5G, beyond-WiFi-8, ICAS, NTN, VR/XR/Metaverse, Digital-Twin and other emerging applications. Higher quality of experiences for connected future with ubiquitous lowest latency and superhigh data rate connectivity services will require innovative wireless technologies and communication hardware combined with AI/ML. Mobile platform integrated RF systems with antenna front ends are common factor for most of the wireless applications. Emerging usage scenarios will need intelligent mobile platforms with ultra-small form-factor, requiring co-design and heterogeneous integration of dis-similar semiconductor device, circuit and antenna technologies, in order to satisfy the desired application-specific performance criteria for the evolving use cases.

This presentation will present the emerging technology trends and will focus on the antenna-integrated RF to mm-wave/THz array integrated frontend opportunities and challenges demanding new technology, design, development and integration. Example architectures to enable
multifunction microsystem platform will be discussed.

Free Registration (with a Zoom account; you can get one for free if you don't already have it. This requirement is to avoid Zoom bombing. Please sign in using the email address tied to your Zoom account — not necessarily the one you used to register for the event.): 

https://sjsu.zoom.us/meeting/register/qGy644m7StmKMra3Xs_x2g 

Synopsis:
Please feel free to check out the work and thoughts of Prof. Alice Smith, Ph.D., https://en.wikipedia.org/wiki/Alice_E._Smith,  https://www.eng.auburn.edu/~aesmith/ on Google Scholar at https://scholar.google.com/citations?hl=en&user=3WhioLIAAAAJ&view_op=list_works&sortby=pubdate, YouTube https://www.youtube.com/results?search_query=%22alice+smith%22+auburn and generally on the Internet.

Then, please feel free to submit your questions

• via Twitter by using the hashtag, #ProfSmithAMA and tagging @vishnupendyala
• emailing vspendyala(at)hotmail(dot)com with #ProfSmithAMA in the subject
• during your registration on Zoom

Selected questions will be answered by Prof. Smith during the session. Audience may be able to ask follow-up questions during the session, using the Chat feature.

By registering for this event, you agree that IEEE and the organizers are not liable to you for any loss, damage, injury, or any incidental, indirect, special, consequential, or economic loss or damage (including loss of opportunity, exemplary or punitive damages). The event will be recorded and will be made available for public viewing.

The rapid growth of 3D advanced packaging introduces new challenges in inspection and failure analysis, where complex structures such as microbumps, redistribution layers (RDLs), and through-silicon vias (TSVs) demand reliable non-destructive testing (NDT). Conventional approaches, including Scanning Acoustic Microscopy (SAM) and X-ray imaging, are limited by noise, resolution, and defect visibility, creating barriers for reproducible and scalable analysis. To address these challenges, our work advances an AI-powered multimodal inspection framework that couples physics-informed machine learning with structured data infrastructure. A Physics-Informed Neural Network (PINN) approach enhances SAM imaging by embedding acoustic wave physics into reconstructions, producing higher-fidelity images validated through structural similarity and physical accuracy metrics. Complementing this, multimodal data fusion across SAM, X-ray laminography, optical microscopy, and CT establishes richer defect detection and cross-validation. Central to this effort is the creation of multimodality benchmark datasets built on standardized acquisition protocols, structured metadata schemas, and annotation pipelines. These datasets provide not only a foundation for AI model training but also enable reproducibility, traceability, and interoperability across future programs.

CLASTECH will be at the Eravant Facility this year.  We will have a 4 speakers on Microwave and Antenna topics.  There will be a box lunch from Panera Bread.

Space is limited - no onsite registration

List of Speakers:

1- Prof. Mark Rodwell, Electrical and Computer Engineering Department, UCSB, "100-300 GHz Wireless: Transistor, ICS, Systems"

2- Tom Murphey, CTO Opterus R&D Inc., “Novel Deployable Apertures Utilizing High Strain Composite Materials”

3-  Dr. C. J. Reddy, 2025 IEEE AP-S President Elect, "Antenna Placement, Co-site Interference and RCS Simulations for Air, Sea and Ground Platforms"

4- Prof. Cristiano Tomassoni, Department of Engineering, University of Perugia, Italy, “Additive Manufacturing: Emerging Opportunities for Microwave Components" 

Here is a link about Eravant https://www.eravant.com/